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Aligning system photolithography equipment

An alignment system and lithography equipment technology, applied in the field of lithography machines, can solve the problems of unreliable provision of the highest alignment accuracy, inability to use high-order signals, low power, etc., to reduce signal processing time overhead, simplify Difficulty in optical path design and debugging, effects of strong signal strength

Active Publication Date: 2008-01-30
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

The advantage of this scheme is that it can achieve automatic capture and high alignment accuracy, but the disadvantage is that it requires a special wedge adjustment device and complicated adjustment. In addition, the high-order signals in the diffracted light are weak, while this method is Higher alignment accuracy is achieved by relying on high-order signals. In practice, as the power of the reflected signal (especially the high-order signal) of the mark (especially the silicon wafer mark) is too low, the high-order signal cannot actually be used. Therefore, it cannot reliably provide the highest alignment accuracy

Method used

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  • Aligning system photolithography equipment
  • Aligning system photolithography equipment
  • Aligning system photolithography equipment

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Embodiment Construction

[0048] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0049] Accompanying drawing 1 (Fig. 1 is a schematic diagram of the alignment system of the lithography machine using the present invention) shows an alignment system used in the prior art and an embodiment that the alignment system of the present invention can adopt, the main components of the lithography machine The structure includes: a mask stage 6 , a mask plate 4 , a projection objective lens PL, and a substrate stage 9 . The substrate table marker 1 and the substrate marker 5 may be in the form of FIG. 2 , FIG. 3 or FIG. 4 . The distribution of the substrate marks 5 on the substrate 7 can be in the form of Fig. 15 or Fig. 16, wherein Fig. 15 is a combination of four groups of one-dimensional three-period marks.

[0050] In the system used in the prior art, a lower-energy exposure radiation source or other non-exposure wavelength radi...

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Abstract

The invention discloses an alignment system applied in a lithography device, which uses three periods phase grating with crude precision combination in a substrate marker or a substrate station reference marker, uses a first order diffraction light of the three periods as an alignment signal, simultaneously realizes a big capture range and gets high alignment precision, gets labeled deformation information and other useful information, and through the optimum design of the match and / or the layout of the three periods, the influence on an alignment position by asymmetrical deformation of the marker is effectively reduced.

Description

technical field [0001] The invention relates to lithography machine technology, in particular to the alignment technology of scanning projection lithography machine. Background technique [0002] Applying a step-and-scan projection lithography machine to complete the pattern transfer task of micromachining basically involves basic steps such as workpiece loading, alignment of the workpiece area to be processed with the mask, workpiece exposure, and workpiece unloading. In the case of multi-layer processing technology, the precise alignment of the workpiece area to be processed and the mask plate is the premise to ensure that the workpiece is correctly processed when the line width is continuously reduced. When the graphics are accurately projected to the workpiece area to be processed or a new layer When the accurate registration of the graphics is projected on the area of ​​the previously formed workpiece to be processed, the proper exposure of the current layer can realize...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00G03F7/20
Inventor 韦学志李运锋徐荣伟周畅陈勇辉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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