Sub-module fault diagnosis method of modular multilevel converter
A modular multi-level, fault diagnosis technology, applied in the field of power transmission and distribution, can solve problems such as undiagnosable fault diagnosis ability, complex hardware circuit design, etc.
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2013-08-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention belongs to the technical field of power transmission and distribution, and in particular relates to a sub-module fault diagnosis method of a modular multilevel converter. Background technique
[0002] Modular Multilevel Converter (MMC) is a new voltage source converter topology proposed by R. Marquardt and A. Lesnicar in 2002. It does not require a large number of IGBTs in series, and the device withstands voltage change rate is low. The output waveform has lower harmonic content and other advantages. Therefore, the MMC-based high-voltage direct current transmission system (MMC-HVDC) is also a research hotspot in the field of direct current transmission in recent years.
[0003] At present, the sub-module (SM) widely used in the project adopts a half-bridge type sub-module structure, which is the basic unit that constitutes the MMC. The timely diagnosis and in-situ protection of fault conditions during operation directly affect the stable opera...
Examples
Embodiment Construction
[0054] The preferred embodiments are described in detail below in conjunction with the drawings. It should be emphasized that the following description is only exemplary, and is not intended to limit the scope and application of the present invention.
[0055] figure 1 The topological structure diagram of the modular multilevel converter MMC (half bridge) provided by the present invention. figure 1 Among them, SM1, SM2,..., SMn, represent the first submodule, the second submodule,..., the nth submodule in a bridge arm of MMC; L 0 Represents the bridge arm reactor; U dc Indicates the voltage difference between the positive and negative DC buses of the MMC. T1, T2 respectively represent the upper and lower IGBTs in the half-bridge submodule, D1, D2 respectively represent the anti-parallel diodes of the corresponding IGBTs; i arm Is the bridge arm current; C 0 Represents the capacitor in the half-bridge sub-module; U c Indicates the capacitor voltage of the sub-module; U SM Indi...