4 results about "Array Feature" patented technology

Systems and methods for resource management using a scalable resource management database are provided. A resource management tool accesses a resource management database. The resource management tool determines an attribute value corresponding to an attribute of a resource instance comprises an object array. The object array includes a plurality of array features. The resource management tool converts the plurality of array features to a plurality of converted attributes. The resource management tool updates an attribute table by replacing the attribute of the resource instance with the plurality of converted attributes for the resource instance. The resource management tool updates a value table by adding one or more group identifications for grouping a plurality of attribute values corresponding to the plurality of converted attributes for the resource instance.

Systems and methods for resource management using a scalable resource management database are provided. A resource management tool accesses a resource management database. The resource management tool determines an attribute value corresponding to an attribute of a resource instance comprises an object array. The object array includes a plurality of array features. The resource management tool converts the plurality of array features to a plurality of converted attributes. The resource management tool updates an attribute table by replacing the attribute of the resource instance with the plurality of converted attributes for the resource instance. The resource management tool updates a value table by adding one or more group identifications for grouping a plurality of attribute values corresponding to the plurality of converted attributes for the resource instance.

The invention relates to the technical field of intelligent antenna arrays, in particular to a self-adaptive intelligent antenna system based on deep learning, which marks and converts a super-threshold array element pair into an adjacency relation through a screening mode of combining an array element amplitude difference and a phase difference with a space coordinate distance, and utilizes a multi-layer iterative combined topological structure to obtain a super-threshold array element pair. The method comprises the following steps: selecting a set with relatively low difference through successive iteration until a stable condition is reached, thereby obtaining a weighting parameter with relatively high convergence, differentiating a main signal vector and a residual vector term by term and comparing with a threshold value, realizing systematic compression of interference components in a signal, and realizing the systematic compression of the interference components in the signal through a signal time expansion stage. The multi-dimensional matrix structure bears frequency components and extracts trend factors, a factor sequence is combined with weighting parameters after extending in a time dimension, a parameter set capable of expressing dynamic evolution of a channel is generated, and a result has higher anti-interference performance and better dynamic tracking performance.

The present application relates to the chip advanced packaging and precision bonding technical field, specifically discloses a kind of chip advanced packaging bonding system and method based on pad / bump feature targeting.The present application uses the geometric barycenter, edge profile, array spacing of pad, bump (including copper column bump, micro bump) on chip and substrate as the only targeting feature, completely get rid of the dependence on special alignment mark (Mark point), for 2.5D / 3D packaging, flip welding, copper copper bonding and other advanced packaging scenarios, innovative use "visual-bonding axis in position + array feature targeting solution + whole-process dynamic closed-loop correction" architecture, through the clear correction algorithm and trigger mechanism, real-time dynamic correction bonding coordinate in the whole bonding process, compensate the alignment deviation caused by thermal deformation, mechanical drift, patch pressure deformation, realize bonding alignment accuracy≤0.5 μm.The present application is different from the existing conventional bump alignment technology, the core innovation lies in the deep integration of array feature targeting solution and dynamic closed-loop correction, solve the industry pain point of traditional bonding "pre-alignment deviation accumulation", can greatly improve advanced packaging yield and reliability, have unavoidable underlying technical barriers.