Package structure of surface adhesive light -emitting diode and its producing method

A technology for light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve problems such as inability to meet, and achieve the effect of reducing the thickness of the overall structure

Inactive Publication Date: 2004-02-11
SHANGJUXING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its thickness includes at least the thickness of the printed circuit board 30, the LED chip 10, the bonding wire 20, and the sealant 40. Therefore, in response to the tre

Method used

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  • Package structure of surface adhesive light -emitting diode and its producing method
  • Package structure of surface adhesive light -emitting diode and its producing method
  • Package structure of surface adhesive light -emitting diode and its producing method

Examples

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Embodiment Construction

[0022] A light-emitting diode (Light-Emitting Diode; LED) acts like a small light bulb that emits light when current passes through it. In the switches of many electrical appliances, light-emitting diodes are used to represent whether the power is on or not. For example, a computer panel usually has a Turbo indicator light, a power indicator light, a hard disk access light, etc., all of which use light-emitting diodes as display components.

[0023] The light-emitting diode has the advantages of strong mechanical strength, long service life, high brightness, high electro-optical conversion efficiency, and low voltage function. It is used as an indicator light to gradually replace the status of the previous tungsten lamp; There are several types of light-emitting diodes in the practical stage, each with its own advantages and application occasions. One of the surface-mounted light-emitting diodes is a light-emitting diode that can be directly bonded to a predetermined position ...

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Abstract

A packaging structure adhered by LED on the surface provides a base plate with multiple pads isolated in between and an insertion part containing at least a LED chip. A wire couples the chip and pads, the insertion part is filled by a cover covering the wire for protection and the packaging structure is cut, which can reduce the thickness of LED illuminating through different faces of the cover.

Description

technical field [0001] The invention relates to a packaging structure of a surface-mounted light-emitting diode and a manufacturing method thereof, in particular to a packaging structure of a surface-mounted light-emitting diode capable of emitting light from multiple sides and a manufacturing method thereof. Background technique [0002] Today's electronic components or their related products are trending toward thinner and smaller; however, in addition to the shrinking of electronic components, the widespread use of surface mount technology is also one of the factors for this trend. In the light emitting diode (Light Emitting Diode; LED), which is widely used at present, under the soldering method of the surface mount technology, a printed circuit board (PCB) is usually used as the substrate of the light emitting diode chip, such as figure 1 As shown, the light-emitting diode chip 10 is placed on a printed circuit board 30, and the light-emitting diode 10 and the printed c...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54
CPCH01L2224/48091H01L2224/48247H01L2924/181
Inventor 宋文恭
Owner SHANGJUXING
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