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Manufacturing method for fine copper-silver alloy wires

A copper-silver alloy, manufacturing method technology, applied in the direction of rod/rod/wire/strip conductor, etc., can solve the problems of unstable structure, frequent wire breakage, inability to manufacture ultra-fine Cu/Ag alloy wire, etc. The effect of structural stability and avoiding local stress concentration

Active Publication Date: 2015-02-18
HENAN YOUK ELECTRONICS MATERIALS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ultra-fine Cu / Ag alloy wire (diameter 0.010-0.030mm) used for ultra-fine conductors is usually manufactured by drawing casting materials and other blanks, but in the manufacturing process, due to the composition and structure of the material Instability and improper control of process parameters during the wire drawing process lead to local stress concentration of the material during the wire drawing process, resulting in frequent wire breakage, and cannot produce ultra-fine Cu / Ag alloy wires of the required length

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The manufacturing method of the fine copper-silver alloy wire of the present embodiment is as follows:

[0018] (1) Smelting and continuous casting of Cu / Ag alloy blank:

[0019] a. To manufacture a copper-silver master alloy, respectively put 50% copper and 50% silver into a crucible of a vacuum melting furnace, and evacuate to 5×10 -1 Above Pa, start to heat up. After the temperature rises to 600°C, stop vacuuming and fill the vacuum furnace with pure N 2 up to 5×10 3 Pa; then continue to heat up to 1150 ° C, after the alloy is completely dissolved, start to fill the Cu / Ag alloy liquid with pure N 2 Stir for 15 minutes, and cool the alloy melt to obtain a Cu / Ag alloy master alloy;

[0020] b. In the vacuum smelting furnace, Cu and Cu-Ag master alloys are weighed and calculated according to the following proportions, in which copper (Cu) is 98%; silver (Ag) is 2%, and mixed into the vacuum smelting furnace, vacuumed to 5×10 -2 Pa, start to heat up, after the tem...

Embodiment 2

[0028] The manufacturing method of the fine copper-silver alloy wire of the present embodiment is as follows:

[0029] (1) Smelting and continuous casting of Cu / Ag alloy blank:

[0030] a. To manufacture a copper-silver master alloy, respectively put 50% copper and 50% silver into a crucible of a vacuum melting furnace, and evacuate to 5×10 -1 Above Pa, start to heat up. After the temperature rises to 700°C, stop vacuuming and fill the vacuum furnace with pure Ar 2 up to 5×10 3 Pa; then continue to heat up to 1200 ° C, after the alloy is completely dissolved, start to fill the Cu / Ag alloy liquid with Ar 2 Stir for 15 minutes, and cool the alloy melt to obtain a Cu / Ag alloy master alloy;

[0031] b. In the vacuum smelting furnace, Cu and Cu-Ag master alloys are weighed and calculated according to the following proportions, in which copper (Cu) is 94%; silver (Ag) is 6%, mixed into the vacuum smelting furnace, and vacuumed to 1×10 -1 Pa, start to heat up, after the te...

Embodiment 3

[0039] The manufacturing method of the fine copper-silver alloy wire of the present embodiment is as follows:

[0040] (1) Smelting and continuous casting of Cu / Ag alloy blank:

[0041] a. To manufacture a copper-silver master alloy, respectively put 50% copper and 50% silver into a crucible of a vacuum melting furnace, and evacuate to 5×10 -2 Pa, start to heat up, after the temperature rises to 800°C, stop vacuuming and fill the vacuum furnace with pure N 2 to 5×10 3 Pa; then continue to heat up to 1250 ° C, after the alloy is completely dissolved, start filling the Cu / Ag alloy liquid with N 2 Stir for 15 minutes, and cool the alloy melt to obtain a Cu / Ag alloy master alloy;

[0042] b. In the vacuum smelting furnace, Cu and Cu-Ag master alloys are weighed and calculated according to the following proportions, in which copper (Cu) is 90%; silver (Ag) is 10%, and mixed into the vacuum smelting furnace, vacuumed to 1×10 -1 Above Pa, start to heat up. After the temper...

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Abstract

The invention discloses a manufacturing method for fine copper-silver alloy wires. The method comprises steps as follows: (1) smelting and continuous casting of copper-silver alloy blanks; (2) drawing of copper-silver alloy rods; (3) intermediate heat treatment of copper-silver alloy wires; (4) drawing of the copper-silver alloy wires after intermediate heat treatment into copper-silver alloy wires with diameters in a range of 0.1-0.25 mm by an intermediate wire drawing machine. With the adoption of the manufacturing method for the fine copper-silver alloy wires, components and organization structures of raw copper-silver alloy materials can be stabilized, the texture and the performance of silver are stabilized through control on the distribution form of the silver in the copper-silver alloy wires through heat treatment during wire drawing, wire breakage due to local stress concentration caused by unstable components and organization structures during wire machining is avoided, and manufacturing of the fine copper-silver alloy wires is guaranteed.

Description

technical field [0001] The invention belongs to the field of wire and cable conductor materials, and mainly relates to a method for manufacturing fine copper-silver alloy wires. Background technique [0002] As a high-performance material, Cu / Ag alloy wire has high strength, high conductivity, good processing performance and heat resistance, and is widely used in aerospace cables, materials for scientific laboratories, notebook computers, and mobile phones. Coaxial cables, high tension enameled wires, and speaker lead wires. The ultra-fine Cu / Ag alloy wire (diameter 0.010-0.030mm) used for ultra-fine conductors is usually manufactured by drawing casting materials and other blanks, but in the manufacturing process, due to the composition and structure of the material Instability and improper control of process parameters during the wire drawing process cause local stress concentration of the material during the wire drawing process, resulting in frequent wire breakage, and c...

Claims

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Application Information

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IPC IPC(8): B21C37/04H01B5/02
CPCB21C37/047H01B5/02
Inventor 曹军范俊玲徐燕吕长春李科
Owner HENAN YOUK ELECTRONICS MATERIALS
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