The invention discloses a method for manufacturing a multilayer PCB in a plate pressing mode. The method comprises the steps that plate pressing is conducted through two steps, wherein the first step of pressing is conducted, press fitting is conducted on stacked
layers through an upper steel plate and a lower steel plate,
silicone rubber
layers are arranged between the upper steel plate and the stacked
layers and between the lower steel plate and the stacked layers so that the stacked layers can be evenly stressed, and the stacked layers are formed by sequentially stacking
copper foil, prepreg, an inner core plate, prepreg and
copper foil; the second step of pressing is conducted, press fitting is conducted on the multilayer PCB through the upper steel plate and the lower steel plate, and
silicone rubber layers are arranged between the upper steel plate and the multilayer PCB and between the lower steel plate and the multilayer PCB so that the multilayer PCB can be evenly stressed, and the multilayer PCB comprises two layers of new
copper foil, the N stacked layers which are arranged between the two layers of new
copper foil and obtained through the first step of pressing with the double-face
copper foil corroded, and prepreg arranged between the N stacked layers and between the stacked layers and the new
copper foil. By means of the method for manufacturing the multilayer PCB in the plate pressing mode, the phenomena of interlayer cavities, insufficient interlayer combining force and layer deviation can be effectively controlled.