The present application relates to the technical fields of
semiconductor double-layer bonding
machine, and particularly relates to a
semiconductor double-layer bonding
machine environment
control system, which comprises a bonding
machine box body, the bonding machine box body comprises a fixed table, the fixed table is provided with a chuck
workbench, the upper portion of the fixed table is provided with an FFU module, the lower portion of the fixed table is provided with a local heat source wind collecting box and a wind collecting pipeline; a filtering
assembly, the filtering
assembly comprises a
processing box, a plurality of groups of
ionization pieces and
anode plates are arranged at intervals in the
processing box, a movable cleaning frame is movably arranged on the
processing box, a rack is arranged on the movable cleaning frame, an air inlet
pipe is arranged on the processing box, a driving piece is arranged at the bottom of the air inlet
pipe; and a movable exhaust plate is movably arranged in the processing box, a plurality of groups of exhaust holes and dust removal grooves are arranged on the movable exhaust plate, dust removal holes are arranged on the movable exhaust plate, and a lower sealing strip and an upper sealing strip matched with the exhaust holes and the dust removal grooves are arranged on the processing box. The present application can realize targeted
temperature control on the working area, automatic cleaning, frequent replacement is not needed, and operation and maintenance costs are reduced.