Method, device and equipment for detecting high-temperature resistance of wire rod and storage medium
By arranging micro thermocouple array sensors at key parts of the online material, temperature response data is collected and analyzed in real time, and a thermal distribution characteristic model is established, which solves the problem of deviation of wire high temperature resistance detection results in the existing technology, and accurately predicts the probability and life of wire failure.
Patent Information
- Application Number
- CN202510562654.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-07-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing high-temperature resistance detection methods of wire materials lack accurate monitoring of the accumulation effect of temperature abnormalities in key areas, and the temperature data acquisition and analysis are not accurate enough, resulting in large deviations from the actual use, and it is impossible to accurately predict the failure probability and life of wire materials.
The surface, bending and connection points of the outer insulation layer of the line material is arranged at high density, and temperature response data is collected in real time, and the temperature gradient analysis and thermal distribution characteristic calculation are combined with temperature fluctuation compensation and thermal stress accumulation calculation, a heat distribution characteristic model is established, and the thermal stress attenuation network model is input for aging characteristics analysis.
The accurate prediction of the failure probability of wires under different temperature conditions is achieved, the accuracy and reliability of detection results are improved, the data instability caused by random temperature fluctuations in traditional methods is overcome, and the temperature distribution characteristics of wires in complex thermal environments can be described.