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208results about "Capacitor dielectric layers" patented technology

Solid electrolytic capacitor and method for manufacturing same

A solid electrolytic capacitor includes: a capacitor element including an anode part and a cathode part; a substrate that supports the capacitor element; a sealing body that seals the capacitor element; a first external electrode electrically connected to the anode part; a second external electrode electrically connected to the cathode part; and an adhesive layer disposed between the capacitor element and a first surface of the substrate. At an interface between the first surface and the adhesive layer, a maximum height Rz1 of surface roughness of the first surface is 5 μm or more, and a maximum height Rz2 of surface roughness of the adhesive layer is 3 μm or more.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Lightweight flexible composite micro energy storage module

The invention provides a lightweight flexible composite micro-energy storage module, which comprises a flexible substrate, a composite electrode layer, a solid electrolyte layer and a packaging layer, and is characterized in that the flexible substrate is made of a polyurethane-graphene composite material, the thickness of the flexible substrate is 50-200 [mu] m, and the surface of the flexible substrate is provided with a micro-crack structure; the composite electrode layer is formed by alternately stacking MXene / silicon carbon composite nanosheets and polypyrrole conductive polymers, wherein the mass ratio of MXene to silicon carbon is 3: 1 to 5: 1. According to the invention, through the mechanical interlocking design of the microcrack structure of the flexible substrate and the composite electrode layer, the interlayer binding force is significantly enhanced, and the structural integrity under dynamic bending is improved; the root-shaped ion transmission channel of the solid electrolyte layer and the vertical orientation transition layer realize electron-ion dual-channel cooperative transmission and reduce the interface impedance; the gradient hydrophobic structure of the packaging layer is matched with mechanics through chemical bonding, the sealing performance, the flexibility and the environmental tolerance are balanced, and the service life of the module is prolonged.
Owner:广西电网有限责任公司来宾供电局

Capacitor, electric circuit, circuit board, device, capacitor member, and method for manufacturing capacitor

This capacitor is provided with: a porous body that comprises a plurality of pores; and a conductor. The porous body comprises: a conductive base material; a first dielectric layer that is disposed on the base material; and a second dielectric layer that is disposed on the base material. The conductor is disposed on the first dielectric layer and the second dielectric layer. The first dielectric layer is disposed, in the porous body, in a first region that includes a boundary between the porous body and the outside of the porous body. The second dielectric layer is disposed in a second region that is located more inward of the porous body than the first region in the porous body.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Tantalum capacitor dielectric layer gradient oxidation preparation method and oxidation film and anode block thereof

The invention provides a tantalum capacitor dielectric layer gradient oxidation preparation method and an oxidation film and an anode block thereof, and the method employs a multi-stage gradient boost rate to carry out electrochemical oxidation on a tantalum anode, and controls the boost rate and the oxidation voltage at different stages. And the oxide film forms a grain size gradient structure from the compact layer at the bottom to the nanocrystalline layer at the top, and the film thickness is 400-900 nm. Meanwhile, an electrolyte formula is optimized, ammonium dihydrogen phosphate and cerous nitrate are added into a phosphoric acid solution, the compactness of the film is improved, and oxygen vacancies are inhibited; ozone bubbling treatment is introduced in the constant-pressure stage, and the defect concentration is further reduced. The prepared dielectric layer has high breakdown voltage, low leakage current and high specific capacitance performance, the reliability of the tantalum capacitor is remarkably improved, the service life of the tantalum capacitor is remarkably prolonged, and the dielectric layer is suitable for high-reliability electronic equipment.
Owner:NINGXIA ORIENT TANTALUM INDUSTRY CO LTD

Capacitor, electric circuit, circuit board, device, and method for manufacturing capacitor

A capacitor 1a includes a metallic tantalum 10, an electric conductor 20, and an oxidized tantalum film 30. The oxidized tantalum film 30 is disposed between the metallic tantalum 10 and the electric conductor 20, where the oxidized tantalum film 30 is in contact with the metallic tantalum 10. The oxidized tantalum film 30 includes a first portion 31 containing fluorine, and a second portion 32. The second portion 32 is located closer to the metallic tantalum 10 than the first portion 31 in a thickness direction of the oxidized tantalum film 30. And a fluorine concentration at the second portion 32 is lower than a fluorine concentration at the first portion 31.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Polymer capacitor comprising solution processed n-type conductive polymer

The present invention relates to a polymer capacitor comprising an anode, a dielectric layer and a cathode wherein the cathode comprises a solution processed n-type conductive polymer having an electrical conductivity of at least 100 S / cm, preferably at least 500 S / cm.
Owner:WESTRA MATERIALS AB

Solid electrolytic capacitor and its manufacturing method

To provide a solid electrolytic capacitor having high reliability and high productivity by maintaining high airtightness while maintaining excellent electrical characteristics and a manufacturing method of the same.SOLUTION: A solid electrolytic capacitor comprises: a capacitor element 1 which has an anode body 2, a dielectric oxide covering layer 3 covering the anode body 2, and a cathode body 6 formed on the dielectric oxide covering layer 3 so as to be insulated from the anode body 2; an exterior body 10 which covers the capacitor element 1; a contact layer 11 which is formed in an anode terminal part 9 being an end of the anode body 2 and has a surface 11S with prescribed surface roughness; and an anode side electrode layer (12) which covers the surface 11S.SELECTED DRAWING: Figure 2
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Solid electrolytic capacitors with improved reliability

To provide techniques for reducing an anomalous charge current (ACC) in an electrolytic capacitor.SOLUTION: When a conductive polymer 18 is applied to an electrolytic capacitor, processing of forming mordant layers (20, 21) of a phytic acid or the like is performed. Examples of sites where the mordant layers are formed are preferably between primary and secondary conductive polymers (18 / 22), between a dielectric 16 and the primary conductive polymer, on each layer of the primary conductive polymer, and the like.SELECTED DRAWING: Figure 1
Owner:KEMET ELECTRONICS CORP

Capacitor, dielectric for capacitor, circuit, circuit board, and device

The present disclosure provides a capacitor which is advantageous from the perspective of capacitance and insulation breakdown electric field. This capacitor (1a) is provided with a first electrode (11), a second electrode (12), and a dielectric (20). The dielectric (20) is disposed between the first electrode (11) and the second electrode (12). The dielectric (20) contains a composite oxide. The composite oxide is composed of Cs, at least one element selected from the group consisting of Ti, Zr, and Hf, and W.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Method for manufacturing capacitor member, capacitor, electric circuit, circuit board, equipment, and electricity storage device

A method for manufacturing a capacitor member according to the present disclosure includes forming, on a valve metal, a modified layer containing a metal other than the valve metal by a cathodic reaction. In this manufacturing method, εH / KH [V / nm] > εL / KL [V / nm] is satisfied. εH is the dielectric constant of oxide of the metal other than the valve metal. KH [nm / V] is the thickness of the first oxide film of the metal per 1 V of anode potential when the first oxide film is formed by anodic oxidation. εL is the dielectric constant of the oxide of the valve metal. KL [nm / V] is the thickness of the second oxide film including the oxide of the valve metal per 1 V of anode potential when the second oxide film is formed by anodic oxidation.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Electrolytic capacitor for a semiconductor device having improved conductive polymer layer

An electrolytic capacitor for a semiconductor device includes a conductive substrate, a dielectric layer on the conductive substrate, and a conductive polymer layer on the dielectric layer. The conductive polymer layer may include at least one additive. The at least one additive may include an anodizing agent to promote oxide growth of the dielectric layer. The at least one additive may instead or additionally include an organic solvent, an additive to promote hydration resistance of the dielectric layer, and / or an additive to increase conductivity of the conductive polymer layer.
Owner:SARAS MICRO DEVICES INC

Solid electrolytic capacitors

This invention provides a solid electrolytic capacitor that can achieve high capacitance. [Solution] The solid electrolytic capacitor comprises a capacitor element containing a conductive polymer. The capacitor element comprises an anode, a first dielectric layer containing a first dielectric (excluding a composite oxide of titanium and aluminum) covering at least a portion of the surface of the anode, a second dielectric layer containing a second dielectric covering at least a portion of the surface of the first dielectric layer, and the conductive polymer covering at least a portion of the surface of the second dielectric layer. The second dielectric is an oxide containing at least one element selected from the group consisting of silicon, aluminum, and zinc. The dielectric constant D1 of the first dielectric is higher than the dielectric constant D2 of the second dielectric. The thickness T2 of the second dielectric layer is 0.003T1 or more and 0.170T1 or less with respect to the thickness T1 of the first dielectric layer.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Multilayer body, capacitor, electrical circuit, circuit board, apparatus, and multilayer body manufacturing method

A multilayer body 1a is provided with metal tantalum 10 and a dielectric layer 20. The dielectric layer 20 is in contact with the metal tantalum 10 and contains an oxide containing tantalum and tungsten. At 120 Hz, the dielectric layer 20 has a relative permittivity greater than 27 and equal to or smaller than 41.7.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

LOW INDUCTIVITY ELECTROLYTE CAPACITOR

A capacitor capable of exhibiting good electrical properties under a wide variety of conditions is provided. The capacitor comprises a capacitor element consisting of a sintered porous anode body, a dielectric material covering the anode body, and a solid electrolyte containing a conductive polymer, also covering the dielectric. The capacitor also includes multiple anode conduction sections extending from the ends of the capacitor element. Furthermore, the capacitor includes a housing that defines an internal cavity in which the capacitor element is arranged and hermetically sealed.
Owner:KYOCERA AVX COMPONENTS CORP

Aluminum electrolytic capacitor composite oxide film suitable for hydrogen fuel cell and preparation method of aluminum electrolytic capacitor composite oxide film

The invention discloses an aluminum electrolytic capacitor composite oxide film suitable for a hydrogen fuel cell and a preparation method, and belongs to the technical field of aluminum electrolytic capacitors. The preparation method comprises the following steps: sequentially carrying out surface cleaning, neutralization, formation and activation pretreatment on a high-purity aluminum foil to prepare a surface-activated Al2O3 base film; the preparation method comprises the following steps: selecting tetrabutyl titanate as a titanium source, mixing a solvent, a chelating agent and a hydrolytic agent according to a preset molar ratio, stirring, modifying with a coupling agent, and performing ultrasonic dispersion to prepare TiO2 sol; coating the TiO2 sol on the surface of the Al2O3 base film by adopting a dip-coating process to form a wet film; and the wet film is converted into an anatase type TiO2 coating through segmented sintering, and the Al2O3-TiO2 composite oxide film is obtained. The composite oxide film comprises an Al2O3 base film and an anatase type TiO2 coating which are sequentially compounded, and the interface is tightly combined without gaps. Through material compounding and process optimization, the composite oxide film has the characteristics of low dielectric loss, high breakdown voltage, high humidity resistance and vibration resistance, adapts to the harsh working condition of a hydrogen fuel cell, and improves the service life and stability of a capacitor.
Owner:SHENZHEN XIN FU JING ELECTRONIC CO LTD

Electrode foil for electrolytic capacitors and electrolytic capacitors

An electrode foil for an electrolytic capacitor comprises a substrate containing a valve-acting metal and a dissimilar metal composite layer covering the surface of the substrate. The dissimilar metal composite layer includes a mixed region containing a first metal and a second metal different from the first metal. The mixed region constitutes at least 50% of the thickness of the dissimilar metal composite layer. The mixed region is used to achieve a content of at least 1 atom% for both the first metal (M1) and the second metal (M2) relative to the total metal content.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Thin-film capacitors, their manufacturing methods, and electronic circuit boards incorporating thin-film capacitors

The present invention provides a thin-film capacitor capable of arranging a pair of terminal electrodes on the same side. The thin-film capacitor (1) comprises: a metal foil (10) having a roughened upper surface (11); a dielectric film (D) covering the upper surface (11) of the metal foil (10) and having an opening that partially exposes the metal foil (10); a first electrode layer connected to the metal foil (10) via the opening; and a second electrode layer connected to the dielectric film (D) but not connected to the metal foil (10). Thus, both the first and second electrode layers can be arranged on the upper surface (11) of the metal foil (10). Moreover, since the metal foil (10) is roughened, a larger capacitance can be obtained.
Owner:TDK CORP

Method of manufacturing solid electrolytic capacitor including exterior body that covers capacitor element

A capacitor element that has an anode body, a dielectric oxide film layer covering the anode body, and a cathode body formed on the dielectric oxide film layer; an exterior body that covers the capacitor element; a contact layer that is on an anode terminal, which is an end portion of the anode body, and has a surface with a predetermined surface roughness; and an anode-side electrode layer that covers the surface are provided.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Thin-film capacitors and electronic circuit boards incorporating them

The present invention provides a thin-film capacitor with high adhesion to a circuit board. The thin-film capacitor (1) comprises: a metal foil (10) having a roughened upper surface (11); a dielectric film (D) covering the upper surface (11) of the metal foil (10) and having an opening that partially exposes the metal foil (10); a first electrode layer connected to the metal foil (10) via the opening; and a second electrode layer connected to the dielectric film (D) but not connected to the metal foil (10). The angle θa formed by another main surface (12) and the side surface (13) of the metal foil (10) is greater than 20° and less than 80°. Thus, the angle of the side surface (13) is a conical shape greater than 20° and less than 80°, thereby suppressing warping and improving adhesion to the multilayer substrate when embedded in the multilayer substrate.
Owner:TDK CORP

Capacitor, electrical circuit, circuit board, device, and method for manufacturing capacitor

A capacitor 1a includes tantalum metal 20 and a dielectric layer 10. The dielectric layer 10 covers the tantalum metal and contains tantalum oxide. The dielectric layer 10 contains fluorine and phosphorus. The dielectric layer 10 includes, for example, a first portion 11 and a second portion 12. The first portion 11 is separate from the tantalum metal 20 in the thickness direction of the dielectric layer 10. The second portion 12 is in contact with the tantalum metal 20 in the thickness direction of the dielectric layer 10.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Delamination-resistant solid electrolytic capacitor

A solid electrolytic capacitor comprising a capacitor element, anode lead extending from a surface of the capacitor element, an anode termination that is in electrical connection with the anode lead, a cathode termination that is in electrical connection with the solid electrolyte, and a casing material that encapsulates the capacitor element and anode lead is provided. An interfacial coating is disposed on at least a portion of the anode termination and / or cathode termination and is in contact with the casing material. The coating contains a hydrophobic resinous material and the adhesion strength of the casing material is about 5 newtons per square millimeter or more as determined at a temperature of about 23° C. and relative humidity of about 30%.
Owner:KYOCERA AVX COMPONENTS CORP

Capacitors, electrical circuits, circuit boards, devices, and methods for manufacturing capacitors

This capacitor 1a comprises a metal tantalum 10, a conductor 20, and a tantalum oxide film 30. The tantalum oxide film 30 is disposed in contact with the metal tantalum 10, and is disposed between the metal tantalum 10 and the conductor 20. The tantalum oxide film 30 includes a first part 31 and a second part 32 containing fluorine. The second part 32 exists at a position closer to the metal tantalum 10 than the first part 31 in the thickness direction of the tantalum oxide film 30. Additionally, the concentration of fluorine in the second part 32 is lower than the concentration of fluorine in the first part 31.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Sensor including an anodized porous layer and method of forming a sensor

A method includes forming a metal cathode on a substrate, anodizing an outer surface of the metal cathode to form an anodized porous layer, and forming a metal anode over the anodized porous layer, wherein the anodized porous layer defines a dielectric layer between the metal anode and the metal cathode, and wherein the metal anode, the anodized porous layer, and the metal cathode define a sensor.
Owner:MICROCHIP TECHNOLOGY INC

Electrolytic capacitor and production method therefor

This electrolytic capacitor comprises a capacitor element. The capacitor element includes an electrode group including an anode body and a cathode body, and a conductive polymer component interposed between the anode body and the cathode body of the electrode group. The anode body includes a first substrate including a first valve metal, and a first chemical conversion coating that covers a surface of the first substrate. A first chemical conversion voltage Vfa applied to the first substrate to form the first chemical conversion coating is 400 volts or greater. The ratio Vfa / Vw of the first chemical conversion voltage Vfa volts to the rated voltage Vw volts of the electrolytic capacitor is 2.10 or greater.

Capacitor, circuit, circuit board and device

A capacitor 1a is provided with a tantalum metal 10, a conductor 20, and a tantalum oxide film 30. And a tantalum oxide film (30) that is in contact with the tantalum metal (10) and is disposed between the tantalum metal (10) and the conductor (20). The tantalum oxide film 30 includes a first site 31 and a second site 32. The first site 31 contains fluorine. The second portion 32 is located closer to the metal tantalum 10 than the first portion 31 in the thickness direction of the tantalum oxide film 30. In the tantalum oxide film (30), the concentration of fluorine in the second region (32) is lower than the concentration of fluorine in the first region (31). The ratio (d1 / d0) of the thickness (d1) of the first portion to the thickness (d0) of the tantalum oxide film (30) is greater than 0.4 and 0.8 or less.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Low profile solid electrolytic capacitor

A solid electrolytic capacitor having a thickness of about 1,000 µm or less is provided. The capacitor comprises a capacitor element comprising an anode component comprising a porous anode body disposed on a surface of an anode substrate. The anode substrate is formed from a valve metal composition and the porous anode body is formed from a sintered powder containing a valve metal composition and having a thickness of about 650 µm or less. The capacitor element further comprises a cathode coating disposed over a dielectric and the porous anode body. The cathode coating comprises a solid electrolyte containing conductive polymer particles, wherein at least a region of the anode substrate is free of the cathode coating. An anode termination is electrically connected to the region of the anode substrate that is free of the cathode coating, and a cathode termination is electrically connected to the cathode coating.
Owner:KYOCERA AVX COMPONENTS CORP

Dielectrics, capacitors, electric circuits, circuit boards, and devices

A dielectric 10 includes a complex oxide. The complex oxide is amorphous and has a composition represented by CexAl1–xOk. In said composition represented by CexAl1–xOk, the condition 0.400≤x<0.90 is satisfied, and k is a value that preserves the electroneutrality of the complex oxide.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Solid electrolytic capacitor

This solid electrolytic capacitor comprises a capacitor element including a conductive polymer. The capacitor element comprises: a positive electrode body; a first dielectric layer that includes a first dielectric covering at least a portion of the surface of the positive electrode body; a second dielectric layer that includes a second dielectric covering at least a portion of the surface of the first dielectric layer; and the conductive polymer that covers at least a portion of the surface of the second dielectric layer. The first dielectric is an oxide other than a composite oxide of titanium and aluminum. The second dielectric is an oxide including at least one element selected from the group consisting of silicon, aluminum, and zinc. When the dielectric constant of the first dielectric is D1 and the dielectric constant of the second dielectric is D2, D1 is higher than D2. A thickness of the first dielectric layer is T1, and T2 is 0.003 T1 to 0.170 T1.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Electrode foil for electrolytic capacitor, electrolytic capacitor, and method for manufacturing electrode foil for electrolytic capacitor

An electrode foil for an electrolytic capacitor comprises an anode body containing a valve metal, a first dielectric layer covering at least a portion of the anode body, and a second dielectric layer covering at least portion of the first dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer, and the thickness T2 of the second dielectric layer is greater than the thickness T1 of the first dielectric layer. The first dielectric layer suppresses diffusion of oxygen from the second dielectric layer to the anode body.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD