High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method

Abstract

The invention relates to a high-humidity and high-temperature resisting single component epoxy adhesive and its preparation method. The epoxy adhesive comprises the following raw materials by weight: 40% to 60% of epoxy resin, 1% to 5% of reactive diluent, 30% to 50% of filling material, 0.5% to 1% of coupling agent, 0 to 1% of cross-linking agent, 1% to 10% of flexibilizer, 3% to 8% of latent curing agent and 3% to 5% of curing accelerator. According to the invention, the requirement of high temperature and high humidity resisting performance after the electronic packaging can be satisfied by the high-humidity and high-temperature resisting single component epoxy adhesive, the application scope of the electronic and electric appliances can be greatly extended, and the solidified system has the advantages of high adhesion reliability and wide application range.

Description

technical field

[0001] The invention relates to an epoxy structural adhesive used in electronic packaging and a preparation method thereof, in particular to a high-humidity and high-heat-resistant single-component epoxy adhesive and a preparation method thereof, belonging to the field of epoxy resin adhesives. Background technique

[0002] In recent years, with the rapid development of electronic materials and composite materials, electronic equipment has higher and higher requirements for the characteristics of epoxy resin for packaging, especially the continuous development of microelectronics technology, the high temperature resistance of epoxy glue for electronic packaging Wet performance puts forward higher requirements. For example, when a thin electronic package device is mounted on a printed circuit board, the subsequent encapsulation soldering process must dip the package in a tin bath. This soldering process must be carried out at a high temperature above 200 ° C. ...

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