High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method

An epoxy adhesive, high-humidity technology, applied in adhesives, novolak epoxy resin adhesives, epoxy resin adhesives, etc., can solve the problems of loose wiring structure, low water absorption, restrictions, etc., and reach the scope of application Wide range, extended application range, and high bonding reliability

Inactive Publication Date: 2011-09-21
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, with the high performance of packaging devices, epoxy glue must not only have high temperature resistance, but also low water absorption, that is, high humidity resistance is also better. If the moisture resistance of the epoxy glue packaging material used is not good, then The metal wiring of the package is easily corroded and passivated; on the other hand, if the package is in a high-temperature and high-humidity environment, moisture is easy to infiltrate from the interface or pores of the packaging material and the lead-out wire, causing bad defects such as loose wiring structure In addition, the epoxy packaging material that has absorbed water molecules will burst due to the vaporization and expansion of water molecules, which will lead to the deterioration of the thermal, electrical and mechanical properties of the epoxy resin glue.
Therefore, epoxy adhesives that do not have high temperature and high humidity resistance are greatly restricted in their application in the field of electronic packaging.

Method used

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  • High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
  • High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
  • High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Accurately weigh each raw material according to the following weight percentages, bisphenol F epoxy resin: 30%, novolac epoxy resin 10%, ethylene glycol diglycidyl ether: 2%, silicon micropowder: 43%, silane active coupling Adding agent 0.5%, trimellitic anhydride 0.5%, liquid nitrile rubber 3%, latent curing agent imidazole: 8%, modified amine mixture M-10: 3%, add the above components into the double planetary power mixer in turn Inside, vacuumize to a vacuum degree of -0.08~-0.05MPa, stir at 500 rpm for 2 hours, stir evenly, let it air naturally to room temperature, and obtain a high-temperature and high-humidity one-component epoxy adhesive, which can be sealed and packaged.

Embodiment 2

[0019] Accurately weigh each raw material according to the following weight percentages, bisphenol A epoxy resin: 30%, novolac epoxy resin 10%, butanediol diglycidyl ether: 5%, kaolin: 33%, silane active coupling agent 1.5%, trimellitic anhydride 0.5%, epoxy-terminated nitrile rubber 10%, latent curing agent imidazole: 5%, modified imidazole Kingcure-390: 5%, add the above components in turn to double planetary dynamic mixing In the mixer, evacuate to a vacuum degree of -0.08~-0.05MPa, stir at 500 rpm for 2 hours, stir evenly, let it air naturally to room temperature, and obtain a high-temperature and high-humidity one-component epoxy adhesive, which can be sealed and packaged .

Embodiment 3

[0021] Accurately weigh each raw material according to the following weight percentages, bisphenol A type epoxy resin: 25%, bisphenol F type epoxy resin: 25%, multifunctional epoxy epoxy resin 10%, 1,2-cyclohexane Alcohol diglycidyl ether: 1%, diatomaceous earth: 21%, silane active coupling agent 1%, 3,3',4,4'-benzophenone tetraacid dianhydride 1%, epoxy-terminated butyronitrile Rubber 5%, latent curing agent imidazole: 8%, modified imidazole PN-40: 3%, add the above components into the double planetary power mixer in turn, and vacuum until the vacuum degree is -0.08~-0.05MPa, Stir at 500 rpm for 2 hours, stir evenly, and let it air naturally to room temperature to obtain a high-temperature and high-humidity one-component epoxy adhesive, which can be sealed and packaged.

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PUM

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Abstract

The invention relates to a high-humidity and high-temperature resisting single component epoxy adhesive and its preparation method. The epoxy adhesive comprises the following raw materials by weight: 40% to 60% of epoxy resin, 1% to 5% of reactive diluent, 30% to 50% of filling material, 0.5% to 1% of coupling agent, 0 to 1% of cross-linking agent, 1% to 10% of flexibilizer, 3% to 8% of latent curing agent and 3% to 5% of curing accelerator. According to the invention, the requirement of high temperature and high humidity resisting performance after the electronic packaging can be satisfied by the high-humidity and high-temperature resisting single component epoxy adhesive, the application scope of the electronic and electric appliances can be greatly extended, and the solidified system has the advantages of high adhesion reliability and wide application range.

Description

technical field [0001] The invention relates to an epoxy structural adhesive used in electronic packaging and a preparation method thereof, in particular to a high-humidity and high-heat-resistant single-component epoxy adhesive and a preparation method thereof, belonging to the field of epoxy resin adhesives. Background technique [0002] In recent years, with the rapid development of electronic materials and composite materials, electronic equipment has higher and higher requirements for the characteristics of epoxy resin for packaging, especially the continuous development of microelectronics technology, the high temperature resistance of epoxy glue for electronic packaging Wet performance puts forward higher requirements. For example, when a thin electronic package device is mounted on a printed circuit board, the subsequent encapsulation soldering process must dip the package in a tin bath. This soldering process must be carried out at a high temperature above 200 ° C. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04H01L23/29
Inventor 骆万兴王建斌解海华
Owner YANTAI DARBOND TECH
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