Dimer acid type polyamide hot melt adhesive and preparation method thereof

A technology of polyamide hot melt adhesive and dimer acid type, which is applied in the direction of adhesives, etc., can solve the problems of poor low temperature resistance, high water absorption, low softening point, etc., and achieve high softening point, low high temperature melt viscosity, and good adhesion The effect of high reliability

Inactive Publication Date: 2011-10-19
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the shortcomings of the existing polyamide hot melt adhesives, such as low softening point, poor low temperature resistance, low elongation and high water absorption, and it is difficult to meet some special requirements in the fields of automobile industry and electronic product packaging, etc., Provide a dimer acid type polyamide hot-melt adhesive containing N alkyl-substituted diamine structure and its preparation method, the prepared polyamide hot-melt adhesive has high softening point, excellent low-temperature resistance performance, and significantly improved elongation, It is suitable for low-pressure injection molding process, especially for the bonding of non-polar polymer materials, meeting the high-end market demand of polyamide hot melt adhesives

Method used

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  • Dimer acid type polyamide hot melt adhesive and preparation method thereof
  • Dimer acid type polyamide hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18340.8g of dimerized linoleic acid, 80.8g of sebacic acid, 166.5g of N-alkyl propylenediamine, 4.0g of stearic acid, 0.5g of hypophosphorous acid, and put the mixed N-alkyl into the 100ml constant pressure dropper Mixture of 166.5g of propylenediamine and 8.8g of butanediamine, pass nitrogen gas to prevent oxidation, heat up while stirring, when the temperature in the reaction bottle reaches 130°C, start to add N-alkylpropylenediamine and butylenediamine dropwise to mix Liquid, the temperature is controlled at 130°C. After the dropwise addition, the temperature starts to rise slowly to about 240°C. During the heating process, water distills out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and depressurize. The vacuum degree is <100Pa. Keep the stirring rate at a certain value. After 3 hours of reaction, the vacuum is released to end t...

Embodiment 2

[0030] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18 397.6g of dimerized oleic acid, 56.4g of azelaic acid, 4.3g of piperazine, 1.0g of propionic acid, 0.5g of phosphorous acid, and 138.8g of mixed N-alkylpropylenediamine and 12g of ethylenediamine, feed nitrogen to prevent oxidation, heat up while stirring, when the temperature in the reaction bottle reaches 130°C, start to drop the mixed solution of N-alkylpropylenediamine and ethylenediamine, and control the temperature at 130°C ℃, after the dropwise addition, start to slowly heat up to about 240°C, water distills out during the heating process, when the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and depressurize, the vacuum degree is <100Pa, keep the stirring rate at a certain After 3 hours of reaction, the vacuum was released to end the reaction, and the molten polyamide resin was poured on a perchlorethylene plate to obtain a yellow str...

Embodiment 3

[0032] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18 454.4g of dimerized oleic acid, 40.4g of sebacic acid, 7.1g of cyclohexyl-p-dimethylamine, 4.0g of stearic acid, 0.5g of hypophosphorous acid, and put the mixed N-alkylpropane into a 1000ml constant pressure dropper Mixed solution of 120.3g of diamine and 18g of ethylenediamine, feed nitrogen to prevent oxidation, stir and heat up at the same time, when the temperature in the reaction bottle reaches 130°C, start to add N-alkylpropylenediamine and ethylenediamine dropwise, the temperature is controlled At 130°C, after the dropwise addition, start to slowly heat up to about 240°C, water distills out during the heating process, when the reaction temperature reaches 240°C, use a vacuum pump to evacuate and depressurize, the vacuum degree is <100Pa, keep the stirring rate at After a certain value, after 3 hours of reaction, the vacuum was released to end the reaction, ...

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Abstract

The invention relates to a dimer acid type polyamide hot melt adhesive and a preparation method thereof. The polyamide hot melt adhesive contains an N alkyl substitution diamine structure and consists of 50 percent of component A and 50 percent of component B according to mole percent, wherein the component A consists of 60-90 percent of unsaturated aliphatic dimer acid and 10-40 percent of aliphatic dicarboxylic acid according to the mole percent; the component B comprises 60-90 percent of N alkyl substituted aliphatic diamine, 10-30 percent of aliphatic diamine and 0-10 percent of heterocyclic diamine according to the mole percent. The dimer acid type polyamide hot melt adhesive has high softening point, good low-temperature resistance, high elongation, low high-temperature melting viscosity, high tensile strength and shearing intensity, and is suitable for low-pressure molding-injection forming process; and the dimer acid type polyamide hot melt adhesive has high bonding reliability and is particularly suitable for bonding of polar high polymer materials.

Description

technical field [0001] The present invention relates to a dimer acid type polyamide hot melt adhesive and a preparation method thereof, in particular to a dimer acid type polyamide hot melt adhesive containing an N alkyl substituted diamine structure and a preparation method thereof, suitable for non-polar The invention relates to the bonding application of permanent polymer materials, and belongs to the field of adhesives. Background technique [0002] There are two types of polyamide hot melt adhesives: one is high molecular weight PA hot melt adhesive (commonly known as nylon hot melt adhesive), which is mainly used in clothing, spinning and other industries; the other is low molecular weight PA hot melt adhesive (commonly known as nylon hot melt adhesive). Dimer acid type PA hot melt adhesive), which is formed by polycondensation of dimer acid and diamine or polyamine, has narrow melting point range, high softening point, non-toxic, good oil and chemical resistance, exce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08C08G69/34
Inventor 周宏福王建斌陈田安
Owner YANTAI DARBOND TECH
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