Halogen-free resin composition, bonding sheet and copper-clad laminate

A resin composition and bonding sheet technology, applied in the field of copper clad laminates, can solve the problems of poor mechanical properties, reduced halogen content, high water absorption, etc., and achieve high glass transition temperature, excellent heat resistance, good The effect of flame retardant effect

Active Publication Date: 2012-10-17
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the halogen-free flame retardant copper clad laminate greatly reduces the halogen content and meets the requirements of environmental protection, the heat resistance of the halogen-free flame retardant copper clad laminate is reduced, the flame retardant effect is not good, the water absorption is large and the mechanical poor performance

Method used

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  • Halogen-free resin composition, bonding sheet and copper-clad laminate
  • Halogen-free resin composition, bonding sheet and copper-clad laminate
  • Halogen-free resin composition, bonding sheet and copper-clad laminate

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preparation example Construction

[0030] The preparation method of described benzoxazine resin is, adopts solution synthesis method, and it comprises steps as follows:

[0031] Step 1, phenol, primary amine, aldehyde are quantified as 1: (0.8-1.2): (1.5-2.5) by phenolic hydroxyl group, amine group, aldehyde functional group molar ratio; The structural formula of described phenol is as follows:

[0032] (Formula 2)

[0033] In formula 2, R1 is O, C=O, S, SO2, alicyclic hydrocarbons with 3 to 20 carbon atoms and derivatives thereof, aliphatic hydrocarbons with 1 to 20 carbon atoms and derivatives thereof, or alicyclic hydrocarbons with 2 to 20 carbon atoms 20 unsaturated aliphatic hydrocarbons and their derivatives. The primary amine is: NH2R2, wherein R2 is an alicyclic hydrocarbon with 3 to 20 carbon atoms and its derivatives, an aliphatic hydrocarbon with 1 to 20 carbon atoms and its derivatives, or an unsaturated fat with 2 to 20 carbon atoms Hydrocarbons and their derivatives, such as allylamine, anilin...

preparation example 1

[0044] Preparation of Benzoxazine Resin by Solution Synthesis

[0045]Dissolve phenol in absolute ethanol at room temperature, adjust the pH to 8-10, and add toluene, aniline and formaldehyde aqueous solution at a molar ratio of phenolic hydroxyl, amino and aldehyde functional groups of 1:1:2. After stirring evenly, heat up to reflux, react for 4 hours and distill ethanol and water toluene under reduced pressure, cool the device, add butanone to obtain a light yellow translucent viscous body, after washing, purification and drying, the benzoxazine resin is obtained , and the yield was 80.5%. The structural formula of the obtained benzoxazine resin is as follows:

[0046]

preparation example 2

[0048] Preparation of Benzoxazine Resin by Solution Synthesis

[0049] Dissolve phenol in absolute ethanol at room temperature, adjust the pH to 8-10, and add toluene, aniline and paraformaldehyde at a molar ratio of phenolic hydroxyl, amino, and aldehyde functional groups of 1:1.2:2.5. After stirring evenly, heat up to reflux, react for 4 hours, and distill ethanol, water, and toluene under reduced pressure, and cool the device to obtain a light yellow translucent viscous body. After washing, purification, and drying, the benzoxazine resin is obtained. The rate is 78.8%. The structural formula of the obtained benzoxazine resin is as follows:

[0050]

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PUM

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Abstract

The invention provides a halogen-free resin composition, a bonding sheet and a copper-clad laminate. The halogen-free resin composition comprises the following components of: by weight, 10-90 parts of polybenzoxazine resin, 10-90 parts of polyepoxides, 1-50 parts of a curing agent, 0.01-1 part of a curing accelerator, 10-100 parts of a filling material, and 0-80 parts of a fire retardant. The bonding sheet prepared from the halogen-free resin composition has high glass-transition temperature, excellent heat resistance and low water absorption. The copper-clad laminate prepared from the bonding sheet has high glass-transition temperature, excellent heat resistance, good flame retardation effect and low water absorption. In addition, the technology for making the copper-clad laminate is simple to operate and requires low cost.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a halogen-free resin composition, a bonding sheet made using the halogen-free resin composition, and a copper-clad laminate made using the bonding sheet. Background technique [0002] Traditional copper-clad laminates for printed circuits mainly use brominated epoxy resin, and bromine is used to realize the flame-retardant function of the board. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. In addition, on July 1, 2006, two environmental directives of the European Union, the Directive on Waste Electrical and Electronic Equipment and the Directive on the Restriction of the Use of Certain Hazar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/02C08L63/04C08L63/00C08K13/02C08K3/22C08K3/34C08K3/36C08K3/26C08K5/3492C09J7/04C09J179/04C09J163/02C09J163/04C09J163/00B32B15/092B32B15/08B32B27/04B32B27/38B32B37/12
Inventor 杨虎何岳山苏世国
Owner GUANGDONG SHENGYI SCI TECH
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