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Epoxy-organic silicon polyimide adhesive and preparation method thereof

A silicon polyimide and adhesive technology, which is applied in the field of organic polymer adhesive preparation, can solve the problems of high price, unfavorable large-scale popularization and application, high cost of polyetherimide resin, etc., and achieves convenient operation, The effect of convenient source of reaction raw materials and excellent bonding performance

Inactive Publication Date: 2010-12-15
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented inventor describes an improved type called Epoxys Polyimides that offers better control over both viscous behavior during use compared with existing types like Siloxane or PTFE resin systems. It's easy to work with, does well on different metals such as Fe/Co, Cu/Al, Ti, Hg, Au, Ag, Invar, Co, Ni, Ge, Si, Ga, Sn, Bi, Technoyers Group III, VA, Xylene Sulfonic Acids, Platinum group elements, Groups VIII, VII, IVb, VI B, Moonsky Reactants, Ammonia Gas Respiratory System, Phosphorus Fluorescent Dyes, Sodium Borohydride Soluble Polymer Stabilizers). Overall this new composition provides technical benefits including easier handling, lower costs, ease of operation, flexibility, durable solvent resistant qualities, thermal stability, chemical reactivity, ability to absorb moisture from various surfaces, gas barrier capabilities, and superior electrical conductance characteristics.

Problems solved by technology

This patents describes different methods for modifying existing epoxy compositions by adding specific types of chemical substances called epoxygen acids into them. These modifications help increase their overall durable property while maintaining superior physical characteristics like tensile elongations at room temperatures. Additionally, these modification techniques involve changing the ratio of components within the composition without affecting the original balance of each ingredient.

Method used

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  • Epoxy-organic silicon polyimide adhesive and preparation method thereof
  • Epoxy-organic silicon polyimide adhesive and preparation method thereof
  • Epoxy-organic silicon polyimide adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add 20.0 grams of silicone polyimide (SPI) resin, 30.0 grams of N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane and 30.0 grams of thermoplastic novolac epoxy resin In the reaction kettle, react at 130°C for 0.5 hours, cool down, add 40.0 g of N,N-dimethylacetamide organic solvent, stir and dissolve at room temperature, it becomes a homogeneous transparent viscous liquid, and obtains component A.

[0033] With 2.1 grams of 4,4'-diaminodiphenylsulfone and 17.0 grams of 4,4'-bis(3-aminophenoxy)diphenylsulfone curing agent, 0.9 gram of 2-ethyl-4-methylimidazole accelerator Mix with 60.0 g of N,N-dimethylacetamide organic solvent, stir and dissolve at room temperature to obtain a homogeneous and transparent component B solution.

[0034] Mix components A and B, and stir evenly at room temperature to obtain an epoxy-silicon polyimide adhesive, which is designated as ESPIA-1.

[0035] Take an appropriate amount of ESPIA-1 epoxy-silicon polyimide adhesive, and evenly sp...

Embodiment 2

[0042] 30.0 grams of silicone polyimide (SPI) resin, 20.0 grams of N, N, N', N'-tetraglycidyl-3,3'-dimethyl-4,4'-diaminodiphenylmethane Add 40.0 grams of thermoplastic novolac epoxy resin to the reaction kettle, react at 130 ° C for 0.5 hours, cool, add 20.0 grams of N, N-dimethylformamide and 20.0 grams of dichloroethane organic solvent, and stir to dissolve at room temperature , in the form of a homogeneous transparent viscous liquid to obtain component A.

[0043] With 3.0 grams of 4,4'-diaminodiphenyl sulfone and 6.0 grams of 2,5-bis(2-trifluoromethyl-4-aminophenoxy) tert-butylbenzene curing agent, 1.0 grams of 2-ethylimidazole The accelerator was mixed with 60.0 g of N,N-dimethylformamide organic solvent, stirred and dissolved at room temperature to obtain a homogeneous and transparent component B solution.

[0044] Mix components A and B, and stir evenly at room temperature to obtain an epoxy-silicon polyimide adhesive, which is designated as ESPIA-2.

[0045] Take an ...

Embodiment 3

[0052] Add 20.0 grams of silicone polyimide (SPI) resin, 40.0 grams of N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane and 30.0 grams of thermoplastic novolac epoxy resin In the reaction kettle, react at 130°C for 0.5 hours, cool down, add 35.0 g of N,N-dimethylacetamide organic solvent, stir and dissolve at room temperature, it becomes a homogeneous transparent viscous liquid, and obtains component A.

[0053] 2.0 grams of 4,4'-diaminodimethylmethane and 7.0 grams of methyltetrahydrophthalic anhydride curing agent, 1.0 grams of 2-ethyl-4-methylimidazole accelerator and 65.0 grams of N, N-dimethylacetamide organic The solvents were mixed, stirred and dissolved at room temperature, and a homogeneous and transparent component B solution was obtained.

[0054] Mix components A and B, and stir evenly at room temperature to obtain an epoxy-silicon polyimide adhesive, which is designated as ESPIA-3.

[0055] Take an appropriate amount of ESPIA-3 epoxy-silicon polyimide adhes...

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Abstract

The invention relates to an epoxy-organic silicon polyimide adhesive comprising the following components: organic silicon polyimide (SPI) resin, multifunctional epoxy resin, a curing agent, an accelerating agent and an organic solvent. The preparation method of the epoxy-organic silicon polyimide adhesive comprises the following steps of: adding the SPI resin to a reactor for reacting for 0.5 hours at 130 DEG C, then cooling, adding the organic solvent, and stirring for dissolution to obtain a component A; stirring the curing agent, the accelerating agent and the organic solvent for dissolution to obtain a component solution B; and when in use, uniformly mixing and stirring the components A, B to obtain the epoxy-organic silicon polyimide adhesive. The tensile sheering strength of the epoxy-organic silicon polyimide adhesive reaches 25.4 MPa at the room temperature, and the epoxy-organic silicon polyimide adhesive also has the advantages of excellent heat resistance, strong hydrophobicity, simple preparation process and low cost, is beneficial to realizing industrial production and has extensive application prospects in the fields of electronics, microelectronics, flexible copper--clad laminates, flexible printed circuit boards, hard copper-clad laminates, motors, aerospace and the like.

Description

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Claims

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Application Information

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Owner DONGHUA UNIV
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