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Inorganic/organic nano particle compound modification epoxy resin adhesive and preparation method thereof

A technology of inorganic nanoparticles and epoxy resin, which is applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problems of low bonding strength, poor high temperature aging performance, etc., and achieve bonding Excellent performance, high temperature bonding strength, good bonding strength and toughness effect

Inactive Publication Date: 2013-06-05
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low bonding strength and poor high-temperature aging performance of existing toughened epoxy resin adhesives at high temperatures, the present invention provides organic-inorganic nanoparticle composite modified epoxy resin adhesives and a preparation method thereof

Method used

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specific Embodiment approach 1

[0013] Specific embodiment one: the inorganic-organic nanoparticle composite modified epoxy resin adhesive of the present embodiment is made up of separately packaged epoxy resin component and separately packaged curing agent component; Described epoxy resin component is made up of by weight The number of parts is 50-100 parts of epoxy resin, 0.5-5 parts of silane coupling agent, 1-10 parts of organic nanoparticles and 1-10 parts of inorganic nanoparticles, wherein the organic nanoparticles are core-shell nanoparticles, and the particle size of the organic nanoparticles is 10nm to 100nm, the particle size of the inorganic nanoparticles is 10nm to 100nm, and the curing agent component is 5 to 100nm in parts by weight. It is made of 30 parts of amine curing agent and 5-10 parts of titanate.

[0014] When the inorganic-organic nanoparticle composite modified epoxy resin adhesive of the present embodiment is used, the separately packaged epoxy resin component and the separately pa...

specific Embodiment approach 2

[0016] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the epoxy resin component consists of 70-80 parts by weight of epoxy resin, 1-4 parts of silane coupling agent, 5 to 6 parts of organic nanoparticles and 5 to 6 parts of inorganic nanoparticles; the curing agent component is composed of 18 to 20 parts by weight of amine curing agent and 6 to 9 parts of titanic acid Ester is made, and other steps and parameter are identical with specific embodiment one.

specific Embodiment approach 3

[0017] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the epoxy resin is bisphenol A type epoxy resin, novolac epoxy resin, bisphenol S type epoxy resin, 4,5 -one of epoxy hexane-1,2-dicarboxylic acid diglycidyl ester, 4,4'-diaminodiphenylmethane epoxy resin, silicone modified epoxy resin or a mixture of several of them, so The silane coupling agent is γ-aminopropyltriethoxysilane, γ-glycidyl ether propyltrimethoxysilane, γ-(methacrylate) propyltrimethoxysilane, γ-mercapto Propyltrimethoxysilane, γ-vinyltriethoxysilane, vinyltri-tert-butylperoxysilane, anilinomethyltriethoxysilane and β-aminoethyl-γ-aminopropyltrimethoxy One or a mixture of several of the base silanes, other steps and parameters are the same as those in Embodiment 1 or 2.

[0018] When the epoxy resin in this embodiment is a mixture, the components of the mixture are mixed in any proportion.

[0019] When the silane coupling agent in this embodiment i...

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Abstract

The invention relates to an inorganic / organic nano particle compound modification epoxy resin adhesive and a preparation method thereof, aiming at solving the problem that the existing toughened epoxy resin adhesive has low bonding strength at high temperature and poor high temperature aging performance. The preparation method comprises the following steps of: firstly preparing an epoxy resin component, and then preparing a curing agent component, thereby obtaining the inorganic / organic nano particle compound modification epoxy resin adhesive. When the adhesive is used, the epoxy resin component and the curing agent component are mixed uniformly at normal temperature, tensile shear strength of the adhesive at 150 DEG C can reach 10MPa-15MPa, the tensile shear strength of the adhesive at 250 DEG C still can reach 4MPa-5MPa, the bonding strength at high temperature is high, after ageing for 1000 hours at 150 DEG C, the retention rate of the tensile shear strength of the adhesive still can be above 80%, the high temperature ageing property of the adhesive is good, the preparation method of the adhesive is simple and is applicable to the fields of aviation, aerospace, mechanical automation, automobile and the like.

Description

technical field [0001] The invention relates to an inorganic organic nano particle composite modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has the characteristics of small shrinkage, stable size, excellent electrical properties, good medium resistance, and excellent adhesion to various materials. However, the epoxy resin is brittle, and there is a problem of poor toughness when used in the preparation of adhesives, resulting in poor bonding performance of the adhesive. In recent years, with the rapid development of the automobile, aerospace and mechanical processing industries, higher requirements have been placed on the toughness of epoxy resin adhesives. At present, epoxy resin adhesives are mostly toughened by active end-group liquid rubber, such as carboxyl-terminated nitrile Rubber (CTBN), amino-terminated nitrile rubber (ATBN) and hydroxyl-terminated nitrile rubber (HTBN), etc. [0003] The existing patent N...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/04C09J163/00C09J11/08C09J11/04C09J11/06
Inventor 张大勇刘晓辉杜明赵颖李欣朱金华王刚
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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