Lead-free high heat-resisting copper-clad board and preparation method thereof

A high heat-resistant, copper-clad laminate technology, applied in chemical instruments and methods, non-polymer adhesive additives, epoxy resin glue, etc., can solve the problem of increasing the cost of PCB processing, toughness, peel strength and PCB processability. Insufficient and other problems, to achieve the effect of good toughness and peel strength, excellent PCB processing performance, good heat resistance

Inactive Publication Date: 2014-03-19
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the basic development direction of the high Tg copper clad laminate materials used in the industry is mainly to use the phenolic curing system, which performs well in the heat resistance of the material, and can basically meet the various performance requirements of the PCB for heat resistance. , althoug

Method used

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  • Lead-free high heat-resisting copper-clad board and preparation method thereof
  • Lead-free high heat-resisting copper-clad board and preparation method thereof
  • Lead-free high heat-resisting copper-clad board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] 1. The mass percentage of solids in the resin binder is 66.5%, and the rest is organic solvents (such as propylene glycol methyl ether),

[0066] Wherein, the formula of solid matter sees the following table 3 (by weight)

[0067] table 3

[0068] raw material

Solid weight (g)

Novolac epoxy resin

20

Isocyanate Modified Brominated Epoxy Resin

15

High Brominated Epoxy Resin

8

Phenolic resin curing agent

23

2-Ethyl-4-methylimidazole (2E4MZ)

0.05

Heat stabilizers

2.5

Aluminum hydroxide

10

silica

20

[0069] 2. The preparation method of resin adhesive:

[0070] (1) According to the above weight, add 49 grams of organic solvent propylene glycol methyl ether, aluminum hydroxide and silicon dioxide in the stirring tank in sequence, turn on the stirrer, rotate at 600 rpm, and continue stirring for 30 minutes;

[0071] (2) Add novolac epoxy resin, isocyanic acid modifi...

Embodiment 2

[0079] 1. The mass percentage of solids in the resin binder is 65%, and the rest is an organic solvent (such as propylene glycol methyl ether),

[0080] Wherein, the formula of solid matter sees the following table 5 (by weight)

[0081] table 5

[0082] raw material

Solid weight (g)

Novolac epoxy resin

25

Isocyanate Modified Brominated Epoxy Resin

14

High Brominated Epoxy Resin

6

Phenolic resin curing agent

22

2-Ethyl-4-methylimidazole (2E4MZ)

0.04

Heat stabilizers

2

Aluminum hydroxide

7

silica

22

[0083] 2. The preparation method of resin adhesive:

[0084] (1) Add 52 grams of organic solvent propylene glycol methyl ether, aluminum hydroxide and silicon dioxide into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, and continue stirring for 30 minutes;

[0085] (2) Add novolac epoxy resin, isocyanic acid modified brominat...

Embodiment 3

[0093] 1. The mass percentage of solids in the resin binder is 62.3%, and the rest is organic solvents (such as propylene glycol methyl ether),

[0094] Wherein, the formula of solid matter sees the following table 7 (by weight) table 7

[0095] raw material

Solid weight (g)

Novolac epoxy resin

30

Isocyanate Modified Brominated Epoxy Resin

12

High Brominated Epoxy Resin

10

Phenolic resin curing agent

27

2-Ethyl-4-methylimidazole (2E4MZ)

0.07

Heat stabilizers

1.3

Aluminum hydroxide

13

silica

17

[0096] 2. The preparation method of resin adhesive:

[0097] (1) Add 66 grams of organic solvent propylene glycol methyl ether, aluminum hydroxide and silicon dioxide into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, and continue stirring for 30 minutes;

[0098] (2) Add novolac epoxy resin, isocyanic acid modified brominated epo...

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Abstract

The invention discloses a lead-free high heat-resisting copper-clad board, and the lead-free high heat-resisting copper-clad board is prepared from a resin adhesive, glass fiber cloth and copper foil, the resin adhesive is composed of the following components by weight percent: 50-90% of solid matter and the balance of organic solvent; the solid matter is prepared from phenolic epoxy resin, isocyanate modified brominated epoxy resin, high-bromine epoxy resin, a phenolic resin curing agent, an epoxy resin curing accelerant, a heat stabilizer and an inorganic filler. The invention further discloses a preparation method of the lead-free high heat-resisting copper-clad board. The lead-free high heat-resisting copper-clad board suitable for lead-free process has a glass transition temperature not less than 170 DEG C, good heat resistance, good toughness and peel strength and excellent PCB (printed circuit board) processing property, can be manufactured as various lead-free printed circuit boards with excellent property, and is completely suitable for the demands of PCB lead-free process and high multilayer board production.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminate preparation, in particular to a lead-free high-heat-resistant copper-clad laminate suitable for the manufacture of high-layer PCBs and a preparation method thereof. Background technique [0002] Beginning on July 1, 2006, the official implementation of two EU directives (Restricting the Use of Hazardous Substances in Electrical and Electronic Products and Directives on Waste Electrical and Electronic Products) marks that the global electronics industry will enter the era of lead-free soldering. Due to the high soldering temperature, the thermal reliability of the copper clad laminate is correspondingly improved. The traditional lead-tin solder can no longer be used, and the soldering temperature required by today's tin-silver-copper and other alternative solders has been greatly increased. The traditional FR-4 copper clad laminate, due to its low heat resistance, has a glass transitio...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J11/04C09J11/06B32B15/092B32B27/04B32B27/38B32B37/12B32B37/00
Inventor 况小军席奎东粟俊华朱建国包秀银张东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD
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