Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High impact-resistant epoxy resin filling adhesive and preparation method thereof

A kind of epoxy resin, high impact resistance technology, used in epoxy resin glue, novolac epoxy resin adhesive, adhesive and other directions, can solve the problems of large compression modulus, poor heat resistance, low thermal deformation temperature and so on , to achieve the effect of improving impact resistance flexibility, compressive modulus and compressive strength, increasing curing speed, and low exothermic peak temperature

Inactive Publication Date: 2011-06-15
YANTAI DARBOND TECH
View PDF3 Cites 56 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some aspects of the performance of the products in the market cannot fully meet the requirements, such as low compressive strength, high compressive modulus, high brittleness, easy cracking, and severe curing heat release, etc.
Because the impact resistance flexibility and compressive modulus of epoxy resin are two mutually opposing indicators, the technologies commonly used in the industry have not fundamentally solved this contradictory problem. Often, one indicator is improved, and the other is not. decreased, or the processing workability is poor, the curing exotherm is severe, or the heat distortion temperature is low, and the heat resistance is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High impact-resistant epoxy resin filling adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Accurately weigh the following raw materials, bisphenol A type epoxy resin 10g, bisphenol F type epoxy resin 10g, polyurethane acrylate toughening agent 5g, nonylphenol 2g, fumed silicon 0.1g, BYK-163 dispersant 0.3 g, BYK A-506 defoamer 0.1g, 1,4-butanediol diglycidyl ether 3g, calcium carbonate 69.5g, add the above components into the double planetary power mixing mixer in turn, the rotation speed is 1000 rpm Minutes, under the condition of revolution speed of 15 rev / min, mechanically stirred for 2.5 hours to obtain component A, mixed uniformly to obtain component A of the epoxy resin adhesive, packed and placed for use; 10g of triethylenetetramine, isophor 40 g of ketone diamine, 20 g of low molecular weight polyamide, and 10 g of bis(4-amino-3-methylcyclohexyl)methane were mixed uniformly to obtain a curing agent for epoxy resin adhesive, which was packaged and placed for use.

[0036] When in use, the prepared component A and curing agent are mixed in a weight rati...

Embodiment 2

[0038] Accurately weigh the following raw materials: 54g of bisphenol A epoxy resin, 5g of liquid carboxyl-terminated nitrile rubber (CTBN) toughening agent, 5g of nonylphenol, 0.5g of organic bentonite, 0.3g of BYK-163 dispersant, BYK A-506 defoamer 0.2g, butyl glycidyl ether 5g, silicon micropowder 30g, add the above components into the double planetary power mixing mixer in turn, the rotation speed is 800 rpm, and the revolution speed is 10 rpm Under the condition of mechanical stirring for 2.5 hours to obtain component A, mix evenly to obtain component A of the epoxy resin adhesive, pack and place it for use; 15g of triethylenetetramine, 35g of N-aminoethylpiperazine, and 20g of polyetheramine , 5g of bis(4-amino-3-methylcyclohexyl)methane, mixed uniformly to obtain a curing agent for epoxy resin adhesive, packed and placed for use.

[0039] When in use, the prepared component A and curing agent are mixed in a weight ratio of 100:6.8, and cured for 16 hours under ambient c...

Embodiment 3

[0041]Accurately weigh the following raw materials, bisphenol A type epoxy resin 15g, bisphenol F type epoxy resin 15g, epoxy acrylate toughening agent 8g, nonylphenol 7g, fumed silicon 0.3g, Anti-terra-U Dispersant 0.15g, BYK A-525 antifoaming agent 0.15g, neopentyl glycol diglycidyl ether 3g, mica powder 30g, talcum powder 21.4, add the above-mentioned components in the double planetary power mixing mixer in turn, and the rotation speed is 1000 rev / min, revolution speed is under the condition of 15 rev / min, mechanically stirred for 3 hours to obtain component A, mix uniformly, obtain the A component of epoxy resin adhesive, pack and place for use; Diethylenetriamine 8g, 38g of hydroxyethylpiperazine, 20g of low-molecular-weight polyamide, and 7g of bis(4-aminocyclohexyl)methane were mixed uniformly to obtain a curing agent for epoxy resin adhesive, which was packaged and placed for use.

[0042] When in use, the prepared component A and curing agent are mixed in a weight rat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a high impact-resistant epoxy resin filling adhesive and a preparation method thereof. The high impact-resistant epoxy resin filling adhesive consists of a component A and a curing agent in a weight ratio of 100:6.5-100:7.5, wherein the component A consists of the following raw materials in percentage by weight: 20 to 60 percent of epoxy resin, 5 to 15 percent of toughening agent, 0.1 to 0.5 percent of thixotropic agent, 2 to 10 percent of diluent, 30 to 70 percent of filler and 0.1 to 0.5 percent of aid; and the curing agent is one or a mixture of more of straight chain aliphatic amine, aliphatic cyclic amine, polyether amine and low molecular weight polyamide. The preparation method for the high impact-resistant epoxy resin filling adhesive comprises the following steps of: mixing the component A and the curing agent in a proper weight ratio, and curing at the temperature of between 10 and 35DEG C for 16 hours.

Description

technical field [0001] The invention relates to a high-impact epoxy resin filler and a preparation method thereof, belonging to the technical field of epoxy resin adhesives. Background technique [0002] Epoxy resin filler is an important industrial material, which is widely used in shipbuilding, electric power, petroleum, mining and non-ferrous metallurgy industries, as pad filling or back plate filling, etc. Taking marine applications as an example, at present, the proportion of China's shipbuilding industry in the global market is rising significantly, and China has become one of the world's important shipbuilding centers. The trend of international industrial transfer has shown the huge opportunities of the shipbuilding industry in front of Chinese enterprises, providing a broad space for the development of epoxy resin fillers for ships. [0003] Before the advent of marine epoxy resin fillers, in order to ensure the consistency of the shafting line, the main and auxili...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/00C09J163/02C09J163/04
Inventor 姜贵琳王建斌解海华
Owner YANTAI DARBOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com