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Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue

A technology of epoxy resin and bonding glue, which is applied in the field of bonding glue, can solve the problems of corrosiveness, ozone layer destruction, toxicity, etc., and achieve the effects of low cost, high thermal conductivity and convenient operation

Inactive Publication Date: 2012-07-04
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large amount of hydrogen halide released by halogenated flame retardants is not only poisonous but also corrosive. At the same time, it will produce carcinogens such as dioxin, and also produce substances that destroy the ozone layer. Therefore, halogens that endanger human health and damage the environment Flame retardants have been gradually banned by countries all over the world in recent years

Method used

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  • Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 50 parts of spherical alumina powder (domestic average particle size is 40 μm), 20 parts of aluminum hydroxide, 15 parts of bisphenol A epoxy resin, 5 parts of bisphenol F epoxy resin, 2.5 parts of allyl glycidyl ether, 3 parts of Doher62000, 3 parts of hydroxyl-terminated liquid nitrile rubber, 0.5 parts of KH5600, 0.8 parts of fumed silica AerosilR202, 0.2 parts of carbon black, and stir evenly at room temperature to obtain component A; polyamide 651 and polyetheramine D - 400 amine curing agents in a weight ratio of 1:1. Mix component A and amine curing agent in a weight ratio of 100:12, stir evenly under vacuum at room temperature, cure the mixture at 25°C for 24 hours, and measure the thermal conductivity of the cured product.

Embodiment 2

[0042] 55 parts of spherical alumina powder (domestic average particle size is 40 μm), 22 parts of aluminum hydroxide, 12 parts of bisphenol A epoxy resin, 3 parts of bisphenol F epoxy resin, 2 parts of n-butyl glycidyl ether, 2.5 parts of Doher6200, 2.5 parts of hydroxyl-terminated liquid nitrile rubber, 0.3 parts of KH560, 0.5 parts of fumed silica Aerosil R202, 0.2 parts of carbon black, and stir evenly at room temperature to obtain component A; polyamide 651 and polyetheramine D-400 is an amine curing agent with a weight ratio of 1:1. Mix component A and amine curing agent in a weight ratio of 100:8.5, stir evenly under vacuum at room temperature, cure the mixture at 25°C for 36 hours, and measure the thermal conductivity of the cured product.

Embodiment 3

[0044] 60 parts of spherical alumina powder (domestic average particle size is 40 μm), 24 parts of aluminum hydroxide, 7 parts of bisphenol A epoxy resin, 3 parts of bisphenol F epoxy resin, 1.5 parts of phenyl glycidyl ether, Doher 62002 parts, 2 parts of hydroxyl-terminated liquid nitrile rubber, 0.1 parts of KH5600, 0.2 parts of fumed silica Aerosil R2020, 0.2 parts of carbon black, and stirred evenly at room temperature to obtain component A; polyamide Versamid 125 and polyamide Etheramine D-400 is an amine curing agent with a weight ratio of 1:1. Mix component A and amine curing agent in a weight ratio of 100:5, stir evenly under vacuum at room temperature, cure the mixture at 25°C for 48 hours, and measure the thermal conductivity of the cured product.

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Abstract

The invention relates to flame retardant high-heat-conductivity epoxy resin electronic adhesive glue, which is formed by mixing ingredients A with amine curing agents according to the weight ratio of 100:(5-12), wherein the ingredients A comprises the following ingredients in parts by weight: 50 to 60 parts of spherical alumina powder, 20 to 30 parts of flame retardant fillings, 10 to 20 parts of epoxy resin, 1.5 to 2.5 parts of reactive diluents, 2 to 3 parts of halogen-free liquid flame retardants, 2 to 3 parts of toughening agents, 0.2 to 0.8 parts of thixotropic agents and 0.1 to 0.5 parts of coupling agents. According to the adhesive glue provided by the invention, the adhesive glue filled by the spherical alumina has higher condensate heat conductivity when being compared with the adhesive glue filled by the non-spherical alumina, and the heat accumulation of heating devices can be fast dispersed.

Description

technical field [0001] The invention relates to an adhesive, in particular to a flame-retardant high thermal conductivity epoxy resin electronic adhesive, which belongs to the technical field of adhesives. Background technique [0002] Thermally conductive adhesives are mostly used for bonding and packaging of electronic and electrical components in electrical insulation applications. With the development of integrated circuits and assembly technology in the electronics industry, the volume of electronic components and logic circuits tends to be miniaturized, and their development towards multi-functionalization and integration will inevitably result in a substantial increase in heat generation, which is harmful to bonding and The thermal conductivity of packaging materials puts forward very high requirements, so improving thermal conductivity is an increasingly urgent problem. [0003] There are two ways to improve the thermal conductivity of polymers: 1. Synthesize struct...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04
Inventor 林荣杏王建斌陈田安
Owner YANTAI DARBOND TECH
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