White adhesive for flexible printed circuit and preparation method thereof

A flexible printed circuit and adhesive technology, applied in the directions of adhesives, adhesive types, polyether adhesives, etc., can solve the problems of light shading and low light reflectivity, and achieve the effect of high light reflectivity, simplified process and reduced cost.

Active Publication Date: 2009-11-11
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem with the products of the above formula is that the product itself has low light-shielding and reflective properties. When these adhesives are used in LEDs, they need to be coated with white ink to improve light reflectivity.

Method used

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  • White adhesive for flexible printed circuit and preparation method thereof
  • White adhesive for flexible printed circuit and preparation method thereof
  • White adhesive for flexible printed circuit and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] A white adhesive for flexible printed circuits, its raw material components include thermosetting resin, filler, thermoplastic resin, rubber, curing agent and curing accelerator, wherein:

[0054] The thermosetting resin is novolac epoxy resin

[0055] The filler is a mixture of titanium dioxide and aluminum hydroxide or

[0056] The thermoplastic resin is 4-hydroxymethylphenoxymethyl resin of phenoxy resin

[0057] The rubber is carboxylated nitrile rubber 1072CG

[0058] The curing agent is 4-methyltetrahydrophthalic anhydride

[0059] The curing accelerator is 1 cyano 2-ethyl 4-methylimidazole

[0060] The organic solvent is a mixture of butanone and N,N-dimethylformamide

[0061] See Table 1 for the weight ratio of each raw material component.

[0062] The preparation method of the white adhesive for above-mentioned flexible printed circuit, it comprises the steps:

[0063] (1) Dissolving the thermosetting resin, thermoplastic resin and rubber in the organic s...

Embodiment 2

[0073] A kind of white adhesive for flexible printed circuit, its raw material component comprises:

[0074] The thermosetting resin is bisphenol A type epoxy resin E-44

[0075] The filler is a mixture of titanium dioxide and silicon dioxide

[0076] The thermoplastic resin is 4-hydroxymethylphenoxymethyl resin of phenoxy resin

[0077] The curing agent is diaminodiphenyl sulfone

[0078] The curing accelerator is 1 cyano 2-ethyl 4-methylimidazole

[0079] The organic solvent is a mixture of butanone and N,N-dimethylformamide

[0080] See Table 1 for the weight ratio of each raw material component.

[0081] Except that the mixing ratio of each component of the white adhesive mixture and the organic solvent is listed as the ratio in the column of Example 2 in Table 1, the preparation of the white cover film material is the same as in Example 1, and also according to the following The described test method was used to test the characteristics of this flexible copper clad l...

Embodiment 3

[0083] Except that the mixing ratio of each component of the white adhesive mixture and the organic solvent is listed as the ratio in the column of Example 3 in Table 1, the preparation of the white cover film material is the same as in Example 1, and also according to the following The described test method was used to test the characteristics of this white cover film material, and the results are listed in Table 1.

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PUM

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Abstract

The invention discloses a white adhesive for a flexible printed circuit and a preparation method thereof. The white adhesive comprises the following raw material compositions: thermosetting resin, filler, thermoplastic resin, rubber, a curing agent and a curing accelerator, wherein the weight ratio in portion of the various raw material compositions is as follows: 20 to 80 portions of the thermosetting resin, 45 to 150 portions of the filler, 0 to 60 portions of the thermoplastic resin, 0 to 40 portions of the rubber, 2 to 9 portions of the curing agent, 0.5 to 2 portions of the curing accelerator and 40 to 120 portions of organic solvent. The white adhesive has good opacity and reflection performance. The invention simultaneously discloses the method for preparing the white adhesive.

Description

technical field [0001] The invention relates to a white adhesive for flexible printed circuits and a preparation method thereof, a layered structure containing the white adhesive and a preparation method thereof. Background technique [0002] With the introduction of new designs of mobile phones and other electronic products, there are special design requirements for flexible printed circuit boards. In recent years, the LED lighting industry has developed rapidly. Improvements are expected to help LEDs emit light (concentrating light). The backplane used by traditional LEDs—the flexible circuit board—needs to be coated with white ink to improve light reflectivity. The process is cumbersome, the yield is reduced, and the cost is increased. [0003] The patent application document with the publication number CN1900157 discloses an adhesive, which includes a thermosetting resin, a thermoplastic resin, a curing agent and a curing accelerator, wherein the thermosetting resin uses...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/04C09J163/02C09J109/02C09J171/12C09J163/00C09J11/04C09J9/00
Inventor 张家骥
Owner ALLSTAE TECH ZHONGSHAN
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