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High-performance liquid epoxy resin composition for packaging LEDs

A technology of liquid epoxy resin and LED packaging, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high viscosity, uninspected light transmittance, unsuitable LED packaging, etc., and achieve low viscosity and high heat resistance Effect

Inactive Publication Date: 2010-09-15
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Although the liquid epoxy encapsulants mentioned in the above-mentioned Chinese patents CN1282105 and CN1590498 have high heat resistance and good mechanical properties, they are filled with a large amount of fillers, have high viscosity, and have no light transmittance, so they are not suitable for LED encapsulation

Method used

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  • High-performance liquid epoxy resin composition for packaging LEDs
  • High-performance liquid epoxy resin composition for packaging LEDs
  • High-performance liquid epoxy resin composition for packaging LEDs

Examples

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preparation example 1

[0036] Preparation example 1: install mechanical stirrer and addition funnel in 1000ml three-neck round bottom flask, add 15 parts by weight of 3,4-epoxycyclohexyl methyl ester of 3,4-epoxyhexanecarboxylate, 85 parts by weight of bis Phenol A type liquid epoxy resin, 0.05 parts by weight of blue color paste, 0.5 parts by weight of defoamer, stirred at 40°C to obtain homogeneous transparent liquid A glue. Install a mechanical stirrer and an addition funnel in a 1000ml three-necked round-bottomed flask, add 20.5 parts by weight of methyl hexahydrophthalic anhydride, 78 parts by weight of hexahydrophthalic anhydride, 0.5 parts by weight of tetrabutylammonium bromide, 0.5 parts by weight of 1 , 4-butanediol, 0.5 parts by weight of an antioxidant, and stirred at 40°C to obtain a homogeneous transparent liquid B glue. Glue A and glue B were stirred at room temperature at high speed for 30 minutes to obtain a uniformly dispersed liquid epoxy resin encapsulation compound.

[0037] Wh...

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Abstract

The invention discloses a high-performance liquid epoxy resin composition for packaging LEDs. The liquid epoxy resin composition is characterized by comprising the following components in percentage by weight: 48-52 percent of glue A and 48-52 percent of glue B, wherein the glue A comprises the following components in parts by weight: 95-99 parts of epoxy resin mixture, 0.01-0.5 part of color paste and 0.1-4.9 parts of defoaming agent, and the epoxy resin mixture is prepared by mixing cycloaliphatic epoxy resin and bisphenol epoxy resin according to arbitrary proportion; and the glue B comprises the following components in parts by weight: 92-99 parts of anhydride curing agent, 0.5-3 parts of curing accelerator, 0.1-3 parts of curing improver and 0.5-2 parts of antioxidant. The liquid epoxy resin composition has the advantages of low viscosity, high heat resistance, high light transmittance and good mechanical property.

Description

technical field [0001] The invention relates to an epoxy resin composition with low viscosity, high heat resistance and high light transmittance, in particular to a high-performance liquid epoxy resin composition for LED packaging. Background technique [0002] As "green lighting", LED lighting is widely used in display screens, landscape lighting, special lighting and other fields. With the maturity of LED light source technology, the luminous lumens per watt has increased rapidly, prompting its decreasing price year by year. Looking forward to the future, LED general lighting has become an industry hotspot with the greatest market potential, so the packaging problem of high-power, high-brightness white LEDs has become increasingly prominent. [0003] Ordinary liquid epoxy materials for LED packaging have high viscosity (viscosity above 10,000 cps at room temperature) and low glass transition temperature (about 110°C), which is difficult to meet the requirements of high-pow...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08G59/42C08G59/24H01L33/56
Inventor 黄忠洲
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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