80 results about "Packaging Problem" patented technology

The invention discloses a hybrid beam forming method and device in a blind channel. The method comprises the following steps of: on the premise that the receiving signal-to-noise ratio is low and the receiving signal power is maximized, solving by adopting a stochastic gradient descent method according to the solving thought of a Rrassmann space packing problem, so that a simulation-domain beam forming pre-coding matrix of a base station side and a simulation-domain beam forming combination matrix of a user side are obtained; and, in combination with the simulation-domain beam forming pre-coding matrix of the base station side and the simulation-domain beam forming combination matrix of the user side, finding the optimal solution of a digital-domain equivalent channel matrix by adopting a transceiving iterative method based on the time-division duplex channel reciprocity, so that a digital-domain beam forming pre-coding matrix of the base station side and a digital-domain beam forming combination matrix of the user side are obtained. The hybrid beam forming method and device in the blind channel provided by the invention work in a blind channel state; channel state information does not need to be obtained in advance; the method and the device are not limited by channel types; therefore, the computing complexity is greatly reduced; and thus, the method and the device have relatively high practicability.

The present invention relates to a powder phase change energy storage material and a preparation method thereof, wherein the powder phase change energy storage material comprises a carrier and an inorganic phase change energy storage material adsorbed on the carrier, the inorganic phase change energy storage material is prepared from an energy storage material, a nucleating agent, a modifier and water, a weight part ratio of the energy storage material to the nucleating agent to the modifier to the water to the carrier is 35-50:0.1-1:0-15:35-50:20-25. According to the present invention, during the preparation, respectively weighing the energy storage material, the nucleating agent, the modifier and the water, uniformly stirring and mixing, adding the carrier, and uniformly stirring and mixing, wherein the interval time between the two stirring does not exceed 10 min; and compared with the material in the prior art, the material of the present invention has the following characteristics that the suitable packaging material and the suitable ratio are selected and the inorganic energy storage material is successfully and uniformly adsorbed into the system, such that the packaging problem of the material is solved, and the phase separation produced due to the long-term circulation of the material is solved.

The invention provides a spiral-body-enhanced metal-based or polymer-based composite and a preparation method. The composite is formed by distributing an array formed by a plurality of spiral enhancing bodies in a metal matrix and combining the surface-modified spiral enhancing bodies with the metal matrix in a metallurgical manner. The metal matrix is made of frequently-used electronic packaging metal materials such as Al, Cu and Ag. The spiral enhancing bodies are formed by depositing diamond on a spiral-body-shaped substrate through a chemical vapor deposition method to obtain lining supporting diamond spiral bodies, and graphene or carbon nanotubes grow in the direction perpendicular to the surface to obtain a spiral diamond heat conductor structure with a vertical-array graphene wall or a carbon nanotube forest on the surface. The high-heat-conductivity composite is obtained by distributing the spiral enhancing bodies in the metal matrix to form an array and adding enhancing particles to further improve the heat conductivity. The composite can be used as electronic packaging, heat sink materials and the like, and the packaging problems of high-temperature, high-frequency and high-power electronic devices are solved.

The invention discloses a horizontal bagging bag-feeding-type packing machine comprising a rotating disc arranged on a worktable in an indexing-rotating mode. A bag feeding station, a bagging stationand a bag discharging are arranged on the periphery of the rotating disc. A machine clamp used for clamping a packing bag is arranged corresponding to each station. The horizontal bagging bag-feeding-type packing machine is characterized in that each machine clamp is provided with a machine clamp nozzle capable of being turned over back and forth from the horizontal direction to the vertical direction; and in the bagging station, the packing bags clamped by the machine clamp nozzles are placed horizontally, and materials are horizontally pushed into the packing bags after bag openings are opened. The packing bags can be horizontally clamped, and horizontal bagging is achieved, so that the bag-feeding-type packing problem of the vertically-bagged materials is solved.

The invention discloses a packaging material of a high capacity film capacitor. The packaging material is prepared by mixing a component A with a component B, and the component A comprises bimaleimide modified phenolic resin, epoxy resin, ethyl acetate and butyl glycidyl ether; and the component B comprises a modified amine curing agent, zinc N-ethyl-N-phenyldithiocarbamate, a heat conduction strengthening agent, pentaerythrite tetra(4-hydroxy-2,5-t-butylphenylpropionate), anilinomethyltriethoxysilane, ethylimidazole, an anti-settlement agent and an antifoaming agent. The packaging material has an excellent electric insulation performance, so long-term stable working of the high capacity film capacitor is ensured; the packaging material has high heat conduction coefficient and low stress, so the high capacity film capacitor can be used in severe outdoor environment; and the packaging material also has the advantages of excellent weatherability, hot and cold impact resistance, good bonding force with metals and plastics, and solving of the insulation packaging problem of the high capacity film capacitor.

The invention relates to an annealing strategy-based layout method for a circle packing problem, and the problem is that n given round cakes are arranged in a regular triangle container in a way that every two round cakes are not embedded mutually, wherein the side length of the triangle is L, and the minimal value of the L is determined. The method comprises the following steps: A, reading an input file, namely, data including the number of the round cake to be arranged and the Ri thereof (i is larger than or equal to 1 and smaller than or equal to n) for test cases; B, converting the problem of the circle packing problem in the triangular container into an unconstrained layout optimization problem through a quasi content strategy; C, solving the circle packing problem in the triangular container through a heuristic simulated annealing algorithm; D, taking the final layout obtained from the algorithm as an initial layout, and carrying out binary search to the side length L; and E, outputting the final result in a way of graphics and documents. The method provided by the invention has high feasibility and high processing speed, can obtain the result closer to a global optimal solution, and can be widely used to solve other layout optimization problems.

The invention, which relates to the integrated circuit (IC) design technology field, discloses a contactless IC wafer pad layout design method. The invention provides a pad layout design method. A compatibility problem and a reliability packaging problem between pad layout configuration of the current contactless IC wafer and different wafer packaging carrier tape can be solved through arranging two radio frequency function solder joints of the wafer on diagonal positions of the wafer but not the current adjacent angular positions. The invention provides a pad layout design method. After scribing, the wafer can be attached and packaged according to different requirements of a wafer supplier or a wafer packaging trader. By using the method of the invention, a technology communication bridge between the wafer layout design and the wafer packaging are established; the wafer layout design with strong compatibility can be obtained; production efficiency is raised.

The invention relates to a packaging structure of a self-adhered elastic bandage. In the invention, the self-adhered elastic bandage is rolled to form a drum structure, the surface of the self-adhered elastic bandage in the drum structure is wrapped with a transparent PVC heat shrinking film, two rows of continuous eyelets are arranged at symmetric positions of the transparent PVC heat shrinking film, and a color pattern indication mark is printed besides each row of eyelets. The transparent PVC heat shrinking film wraps the surface of the self-adhered elastic bandage through heat shrinkage, and a user can easily find the eyelets besides the color pattern indication mark and can successfully tear off the transparent PVC heat shrinking film along the direction of the eyelets, thereby well solving the packaging problem of the self-adhered elastic bandage.