432results about How to "Increase binding area" patented technology

The invention discloses a packaging and manufacturing method for a thermal enhanced quad flat no-lead flip chip. A thermal enhanced quad flat no-lead flip chip package piece structure comprises a lead framework, a first metal material layer, a second metal material layer, IC chips with convex points, an insulating filler material, a sticking material, radiating fins, heat conducting spacers and a plastic package material, wherein the lead framework comprises a chip carrier and a plurality of pins arranged in multiple circles around the chip carrier; the first metal material layer and the second metal material layer are respectively configured on the upper surface and the lower surface of the lead framework; the IC chips with the convex points are invertedly welded and configured at the position of the first metal material on the upper surface of the lead framework; the insulating filler material is configured below the stepped structure of the lead framework; the heat conducting spacers are configured between the IC chips and the chip carrier through the sticking material; and the radiating fins are configured on the edgeless surfaces of the IC chips through the sticking material and wrapped by the plastic package material to form a package piece. The QFN (Quad Flat No-lead) package piece structure provided by the invention has the advantages of high reliability, low cost and high I/O (Input/Output) density.

The invention discloses a quad flat non-lead (QFN) package with high density and a manufacturing method. The package comprises a lead frame 201, metal material layers 25, an IC chip 27, insulating filling materials 23, bonding materials 26, metal conductors 28 and plastic package materials 29, wherein the lead frame comprises a chip carrier 202 and a plurality of leads 203 arranged in multiple circles around the chip carrier; the metal material layers are arranged on the upper and lower surfaces of the lead frame; the IC chip is arranged on a metal material layer on the upper surface of the lead frame; the insulating filling materials are arranged below stepped structures 22b of the lead frame; the bonding materials are arranged between the IC chip and the metal material layer on the upper surface of the lead frame; the IC chip is connected to the inner leads of the multiple circles of leads and the upper surface of the chip carrier respectively by the metal conductors; the plastic package materials wrap and seal the IC chip, the bonding materials, the metal conductors, partial regions of the lead frame and partial metal material layers; and the chip carrier and the outer leads exposed out of the bottom surface of a package structure, are provided with raised parts. The package and the manufacturing method have the following beneficial effects: the bottleneck of low I/O quantity is broken through and the package reliability is improved.

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a display area and a non-display area surrounding the display area, the non-display area isprovided with a plurality of fan-out wires and a plurality of first binding bonding pads, and the fan-out wires are led out from the display area and electrically connected with the first binding bonding pads; the first binding bonding pads are arranged in a first direction, and each first binding bonding pad comprises a first bonding pad part and a second bonding pad part; the first end of the first bonding pad part in each first binding bonding pad is in electrical contact with the first end of the corresponding second bonding pad part, the second end of each second bonding pad part is electrically connected with the corresponding fan-out wire, and the length direction of the first bonding pad parts intersects with the length direction of the second bonding pad parts; an acute angle between the long edge of each second bonding pad part and the connected fan-out wire is smaller than 30 degrees. According to the technical scheme, a frame of the display panel is further narrowed while the effective binding area of the first binding pads is ensured.

The invention provides a composite molded window protection structure and an electronic device composed of the composite molded window protection structure. The composite molded window protection structure comprises a transparent window and an elastic buffering frame, wherein the elastic buffering frame is integrally molded on the periphery of the transparent window in an intramode ejection mode, and surrounds the periphery of the transparent window in a combined mode, the top of the elastic buffering frame is lower than the top face of the transparent window, and the bottom of the elastic buffering frame extends in the direction of the bottom face of the transparent window. The elastic buffering frame accordingly has the elastic buffering effect of preventing the transparent window from being cracked by lateral impacting; in addition, the bottom of the transparent window and the bottom of the elastic buffering frame can be combined with a displayer, a circuit board and a bottom shell to form the electronic device with the composite molded window protection structure.

The invention discloses a graphene reinforced copper-based composite material. The graphene reinforced copper-based composite material comprises, by weight, 0.5-5% of graphene subjected to surface modification, 2-5% of graphite, 6-15% of Ti3SiC2, and the balance copper. The graphene subjected to surface modification is graphene subjected to gallic acid modification. According to the copper-based composite material, the dispersity of the graphene subjected to surface modification is good, the content of impurities is low, the complete surface appearance is kept, the graphene, the graphite powder, the Ti3SiC2 powder and the copper powder jointly play the enhancement function, the mechanical property and friction abrasion resistance of the copper-based composite material are remarkably improved, and meanwhile the excellent intensity and shock resistance are achieved. The invention further discloses a preparation method of the copper-based composite material. The method is simple in process, production is easy, and wide application prospects are achieved.

The invention discloses a semiconductor PiP (package in package) system structure and a manufacturing method thereof. The semiconductor PiP system structure comprises a lead frame, a first metal material layer, a second metal material layer, an IC (integrated circuit) chip provided with salient points, a lead bonding IC chip, an insulating filling material, a pasting material and a plastic package material, wherein the lead frame comprises a chip carrier and multiple pins which surround the chip carrier and are arranged in multiple circles; the first metal material layer and the second metal material layer are respectively positioned on the upper surface and lower surface of the lead frame, and the insulating filling material is positioned below a terraced structure of the lead frame; the lead bonding IC chip is positioned on the chip carrier; and the salient points of the IC chip provided with the salient points are positioned on the inner pins of multiple circles of the pins in a flip-chip bonding manner, the plastic package material is used for coating the IC chip provided with the salient points and the lead bonding IC chip, thus forming the semiconductor PiP system structure. The invention relates to a three-dimensional package structure which has the advantages of high reliability, low cost and high I/O (input/output) density and is based on QFN (quad flat no-lead) package and a manufacturing method thereof.

The invention belongs to the technical field of composite material preparation, and relates to a method used for preparing a liquid state moulded composite material sandwich structure from foam filledhoneycomb. The method is used for solving difficulties in liquid state moulding and honeycomb using. According to the method, a phenolic foaming material with both material and technology matching performance with the honeycomb material and the liquid state moulding material is adopted for pre-filling of honeycomb holes, and then after pre-curing, the foamed filled honeycomb core material is adopted in liquid state moulding so as to obtain the foam filled honeycomb sandwich composite material using liquid moulding technology. The method is adopted to prepare that foam filled honeycomb sandwich structure, so that a problem that it is difficult to introduce honeycomb into liquid state moulding is solved, manufacturing difficult problems are solved, the honeycomb core material is suitable for a plurality of liquid state moulding, and the adaptability is relatively high.

The invention discloses a preparation method of a para/meta aramid composite paper. The method specifically comprises the steps of: pretreating para-aramid chopped fiber; conducting first untwining on the pretreated para-aramid chopped fiber by a dfibizer; then adding meta-aramid pulp fiber to conduct second untwining; finally adding a dispersant to conduct third untwining to obtain a suspension; injecting the obtained suspension into a paper sheet former to conduct dehydration forming, and carrying out squeezing and drying treatment to obtain aramid composite paper raw paper; and conducting hot press molding on the obtained aramid composite paper, thus obtaining the product. The preparation method of the aramid composite paper provided by the invention can maximumly utilize the high strength properties of chopped fiber to improve the strength properties of meta-aramid paper.

The invention discloses a nursery stock grafting method which comprises the following steps of (1) selection of a stock, selection of a scion, (3) combination, (4) treatment of the combined portion and (5) timely watering after combination. In the combination process, the combined part of the stock is cut open to form a 30-degree oblique plane through a disinfected knife, the phloem of the lower portion of the scion is cut off by 1 cm to 1.2 cm, so that the cambium is exposed, the cambium of the stock is combined with the cambium of the scion. The grafted nursery stock is managed in a conventional method. According to the nursery stock grafting method, the combination area between the cambium of the stock and the cambium of the scion is enlarged, combination is tighter, the grafting survival rate can be increased, the survival rate can achieve 80 percent to 90 percent, the germination rate of the nursery stock after grafting can be increased at the same time, and the nursery stock after grafting can survive ahead of time by 10 days to 15 days.

The invention relates to a porous plant fiber plate, relative preparation and special device. Wherein, the preparation comprises: inserting the sharp hollow punch head with inner sheath into the blank of plant fiber plate to be heated; using compress plate to compress it and attain the plates which has vertical through holes. Said plant fiber comprises the fiber or fiber beams made from wood or non-wood plant; the shape of through hole can be round, regular hexagon, and square, etc; the diameter of through hole is 10-200mm, the hole rate is 20-90%; said through holes are distantly or un-distantly arranged. The inventive plate can effectively reduce the wood consumption; reduce the weight; and support the application for vibration adsorption, sound insulation and thermal insulation. And it is not limited by thickness, to apply door and walls of building.

The invention discloses a display panel and a display device. Multiple welding discs are included, the welding discs comprise first secondary parts and second secondary parts which are electrically connected, the first secondary parts have first length, the second secondary parts have second length, the second length is greater than the first length, the edges, close to a fastening area, of the display panel is first edges, the ends, close to the first edges, of the first secondary parts are first end parts, the distance from the first end parts to the first edges is first range, the ends, close to the first edges, of the second secondary parts are second end parts, the distance from the second end parts to the first edges is second range, and the second range is smaller than the first range. By lengthening the second secondary parts of the welding discs to increase the fastening area, the fastening effect is better, the signal transmission accuracy and stability of the fastening areaare improved, better compatibility is achieved when the electronic assembly is fastened, and the influence on the fastening of an electronic assembly caused by expansion caused by heat and contractioncaused by cold is reduced.

The invention discloses a cooling device and method for a cylindrical power battery pack. The cooling device comprises a battery pack and a cooling structure thereof. The cooling structure includes a cooling channel which is distributed at two side faces of the battery pack and the inside of which is provided with a cyclically flowing cooling working medium, and heat pipes for transferring the heat generated by the battery pack to the channel body of the cooling channel; the heat generated by the battery pack is indirectly transferred to the channel body of the cooling channel through the heat pipes, and the heat generated by the battery pack is taken away by the cyclically flowing cooling working medium in the cooling channel. For the device, the heat pipes are adopted for heat-dissipation of the battery pack, the entire device is compact, small in floor space, flexible in layout, and easy for the connection between single cells. The cooling device has the advantages of simple structure, environment protecting and energy saving, easiness in installation and convenience in maintenance, so the problem of dissipation of the cylindrical power battery pack under different working conditions is solved to reduce the maximum temperature and the overall temperature difference of the battery pack, which has a good application prospect.

The invention relates to the technical field of 3D (Three-dimensional) printer manufacturing, in particular to a 3D printing device for printing buildings. The 3D printing device for printing the buildings comprises a ceramsite conveying mechanism, wherein a spiral drive device is arranged in a spray head; a nozzle is arranged at the lower end of the spray head, and is formed by two end plates oppositely arranged in parallel and two sides plates oppositely arranged in a surrounding way; the two end plates are perpendicular to a movement direction of the nozzle; multiple bulge parts and sunkenparts are arranged on the two end plates long a length direction of the nozzle; the bulge part on one end plate and the sunken part on the other end plate are arranged correspondingly so as to realizethe matching of binding surfaces of each layer of wall body; a ceramsite discharge pipe and a support plate are arranged in the nozzle; the ceramsite discharge pipe is fixed into the nozzle through the support plate; and the upper end of the ceramsite discharge pipe is sealed. The 3D printing device for printing the buildings adopting the technical scheme provided by the intention has the advantages that a printed building wall is smooth in wall surface, good in attractiveness, high in structural strength, and good in forming effect.

The invention relates to a high-heat-conductivity tungsten-copper heat sink and electronic packaging material. The tungsten-copper heat sink and electronic packaging material is composed of copper or a copper alloy matrix, and a tungsten-copper composite coat formed on copper or the copper alloy matrix through a vacuum plasma spraying technology, wherein the room-temperature heat conduction coefficient of the tungsten-copper heat sink and electronic packaging material is greater than 300W/(m.K), the porosity of the tungsten-copper composite coat is lower than 3%, the thickness of the tungsten-copper composite coat is 100-2000mum, and the weight percent content of copper in the tungsten-copper composite coat is 10-40%.

The invention discloses a tube plate type core device of a flat-plate solar collector and belongs to the technical field of flat-plate solar collectors. The tube plate type core device comprises a pair of round guide collecting tubes with large tube diameters, a plurality of heat absorption row tubes with small tube diameters and a flat-plate absorber plate with an absorption layer on the surface. The guide collecting tubes are provided with a plurality of connection rings which are arranged at intervals. The heat absorption row tubes are special-shaped tubes with flat top surfaces. Each heat absorption row tube has a longer main-body middle section and two shorter same-direction bending sections. A port of each bending section is provided with a round insertion port. The round insertion ports are respectively inserted in corresponding connection rings and are in brazed connection with the connection rings. The flat top surfaces of the heat absorption row tubes and the top edges of the guide collecting tubes are integrally located on the same plane. An ultrathin and continuous heat conduction silica gel layer is adhesively bonded on the back plane of the flat-plate absorber plate. By means of the technical scheme, the tube plate type core device is high in heat transfer property, no damage is caused to absorption films, bonding area is large and full contact is achieved, the flat-plate absorber plate is large in heat utilization area, and heat transfer is conducted evenly between tube plates.

The invention discloses a preparation method of a surface-treated ZTA particle reinforced steel-based composite wear-resistant part. ZTA particles are subjected to activating treatment, and then the surfaces of the ZTA particles are plated with metal chromium by adopting a direct-current magnetron sputtering method; afterwards, sensitization and activating are carried out, surface modification iscarried out on the ZTA particles by adopting chemical plating, ZTA particles plated with Cr-Ni layers are filled into a graphite mold together with Ni powder, Al powder and Cr powder, and vacuum sintering is performed to obtain a prefabricated body with a honeycomb structure; and molten metal pouring is carried out by adopting a cast infiltration method, and cooling is performed to obtain the reinforced steel-based composite wear-resistant part with a pinning effect. According to the preparation method, active elements introduced by means of physical vapor deposition (PVD) and chemical platingcan be used to optimize the combination mode of the ZTA particles and metal, so that the interface bonding is converted from mechanical bonding to metallurgical bonding, and relatively high bonding strength is realized.