435results about How to "Increase binding area" patented technology

Described are methods for identifying targets in RNA molecules based on differences in RNA secondary structure related to sequence variances between different allelic forms. Also described are methods for identifying or developing small molecules which can be used to modulate a target RNA by creation of protein-small-molecule-RNA complexes, as well as compositions which include such small molecules and methods of using those small molecules and compositions.

The invention discloses a preparation method for an active element sintered ZTA (Zirconia Toughened Alumina) particulate reinforced steel based compound grinding roller and a grinding disk. The preparation method comprises the following steps: 1) uniformly mixing multiple active element powder, and then adding a defined amount of binding agents and fully mixing with ZTA particulates so as to uniformly cover the active element powder on the surfaces of the particulates, filling into a graphite mould, pressing, and then drying; 2) sintering, thereby obtaining a porous precast block; 3) fixing the precast block on a specific casting position and pouring molten metal, cooling and de-molding, thereby obtaining the compound grinding roller or grinding disk. According to the preparation method, the shape and size of the ZTA particulate precast block can be controlled through the mould and the technique is simple and has higher production efficiency, yield and practicability. Besides, the active element introduced into the interface can increase the wettability and binding strength of the interface and a compound layer structure with interactive distributed enhanced phase and base can ensure the longer service life of the grinding roller and the grinding disk under high stress effect.

The invention discloses a packaging and manufacturing method for a thermal enhanced quad flat no-lead flip chip. A thermal enhanced quad flat no-lead flip chip package piece structure comprises a lead framework, a first metal material layer, a second metal material layer, IC chips with convex points, an insulating filler material, a sticking material, radiating fins, heat conducting spacers and a plastic package material, wherein the lead framework comprises a chip carrier and a plurality of pins arranged in multiple circles around the chip carrier; the first metal material layer and the second metal material layer are respectively configured on the upper surface and the lower surface of the lead framework; the IC chips with the convex points are invertedly welded and configured at the position of the first metal material on the upper surface of the lead framework; the insulating filler material is configured below the stepped structure of the lead framework; the heat conducting spacers are configured between the IC chips and the chip carrier through the sticking material; and the radiating fins are configured on the edgeless surfaces of the IC chips through the sticking material and wrapped by the plastic package material to form a package piece. The QFN (Quad Flat No-lead) package piece structure provided by the invention has the advantages of high reliability, low cost and high I / O (Input / Output) density.

The invention discloses a quad flat non-lead (QFN) package with high density and a manufacturing method. The package comprises a lead frame 201, metal material layers 25, an IC chip 27, insulating filling materials 23, bonding materials 26, metal conductors 28 and plastic package materials 29, wherein the lead frame comprises a chip carrier 202 and a plurality of leads 203 arranged in multiple circles around the chip carrier; the metal material layers are arranged on the upper and lower surfaces of the lead frame; the IC chip is arranged on a metal material layer on the upper surface of the lead frame; the insulating filling materials are arranged below stepped structures 22b of the lead frame; the bonding materials are arranged between the IC chip and the metal material layer on the upper surface of the lead frame; the IC chip is connected to the inner leads of the multiple circles of leads and the upper surface of the chip carrier respectively by the metal conductors; the plastic package materials wrap and seal the IC chip, the bonding materials, the metal conductors, partial regions of the lead frame and partial metal material layers; and the chip carrier and the outer leads exposed out of the bottom surface of a package structure, are provided with raised parts. The package and the manufacturing method have the following beneficial effects: the bottleneck of low I / O quantity is broken through and the package reliability is improved.

The invention discloses a method of rolling composite plate and strip by a slanting corrugating roll. The method is characterized by comprising the following steps that a composite slab which is composed of a basal plate and a multilayer plate is rolled by a composite roughing mill with the slanting corrugating roll to prepare a semi-finished slanting corrugated composite plate, and then the semi-finished slanting corrugated composite plate is rolled by a composite finishing mill with a flat roll until the needed thickness to obtain a composite plate, wherein an axial included angle between slanting corrugation and the roll is 10-80 degrees. According to the method, the problems that instant impact is generated during rolling of a transverse corrugating roll, and the plate and strip are in deviation due to the axial force during rolling of a longitudinal corrugating roll are solved, and meanwhile, the combination area of the composite plates after being roughly milled is increased, so that the binding force between the basal plate and the multilayer plate is improved, and the composite strength and the composite efficiency of the composite plate are greatly improved.

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a display area and a non-display area surrounding the display area, the non-display area isprovided with a plurality of fan-out wires and a plurality of first binding bonding pads, and the fan-out wires are led out from the display area and electrically connected with the first binding bonding pads; the first binding bonding pads are arranged in a first direction, and each first binding bonding pad comprises a first bonding pad part and a second bonding pad part; the first end of the first bonding pad part in each first binding bonding pad is in electrical contact with the first end of the corresponding second bonding pad part, the second end of each second bonding pad part is electrically connected with the corresponding fan-out wire, and the length direction of the first bonding pad parts intersects with the length direction of the second bonding pad parts; an acute angle between the long edge of each second bonding pad part and the connected fan-out wire is smaller than 30 degrees. According to the technical scheme, a frame of the display panel is further narrowed while the effective binding area of the first binding pads is ensured.

The invention discloses a kit for quantitative detection on an O type foot-and-mouth disease virus antibody through fluorescence immunoassay magnetic particles. The kit consists of O type foot-and-mouth disease virus antibody negative serum, O type foot-and-mouth disease virus antibody positive serum, VP1 coating magnetic beads, a biotinylation goat-anti-pig antibody, a streptavidin marking fluorescent substance, a cleaning solution and an enhancing solution. The magnetic beads used in the kit have relatively large binding areas, so that the detection range is greatly increased, the reaction time is shortened, and the sensitivity is improved. The kit has a relatively wide stimulation spectrum and a relatively narrow emitting spectrum, the cost can be reduced, and the sensitivity can be improved; compared with a conventional fluorescent substance, the kit is relatively wide in detection range and relatively good in specificity. Due to adoption of a streptavidin-biotin signal amplification system, the detection sensitivity is further improved, and the kit is relatively high in sensitivity when being compared with ELISA (Enzyme-Linked Immuno Sorbent Assay) and chemiluminiscence. Together with a full-automatic detector, on-site automatic operation can be achieved, one or more samples can be simultaneously detected, and the kit is simple, convenient and rapid to operate and low in price.

The invention discloses a drug eluting balloon system which comprises a balloon catheter and a drug eluting balloon, wherein the balloon catheter is provided with a wire guide cavity arranged along the axial direction; the drug eluting balloon is arranged along the partial length of the balloon catheter and is expanded by virtue of a pressure medium provided by the balloon catheter; the external surface of the balloon body of the drug eluting balloon is provided with a drug coating; the drug coating comprises an inner layer and an outer layer, wherein the inner layer is a taxol and hirudin mixed drug coating, and the outer layer is a hirudin drug coating; a flow channel is also arranged in the wire guide cavity, and the flow channel is arranged at the partial length position of the balloon catheter; and the flow channel is provided with two openings which are respectively formed in two ends of the drug eluting balloon. When the drug eluting balloon system releases drugs, blood flow can not be blocked and drug release can be prolonged to any time, so that the action time of the drugs is increased and the curative effect is improved.

The invention provides a spiral-body-enhanced metal-based or polymer-based composite and a preparation method. The composite is formed by distributing an array formed by a plurality of spiral enhancing bodies in a metal matrix and combining the surface-modified spiral enhancing bodies with the metal matrix in a metallurgical manner. The metal matrix is made of frequently-used electronic packaging metal materials such as Al, Cu and Ag. The spiral enhancing bodies are formed by depositing diamond on a spiral-body-shaped substrate through a chemical vapor deposition method to obtain lining supporting diamond spiral bodies, and graphene or carbon nanotubes grow in the direction perpendicular to the surface to obtain a spiral diamond heat conductor structure with a vertical-array graphene wall or a carbon nanotube forest on the surface. The high-heat-conductivity composite is obtained by distributing the spiral enhancing bodies in the metal matrix to form an array and adding enhancing particles to further improve the heat conductivity. The composite can be used as electronic packaging, heat sink materials and the like, and the packaging problems of high-temperature, high-frequency and high-power electronic devices are solved.

The invention discloses a graphene reinforced copper-based composite material. The graphene reinforced copper-based composite material comprises, by weight, 0.5-5% of graphene subjected to surface modification, 2-5% of graphite, 6-15% of Ti3SiC2, and the balance copper. The graphene subjected to surface modification is graphene subjected to gallic acid modification. According to the copper-based composite material, the dispersity of the graphene subjected to surface modification is good, the content of impurities is low, the complete surface appearance is kept, the graphene, the graphite powder, the Ti3SiC2 powder and the copper powder jointly play the enhancement function, the mechanical property and friction abrasion resistance of the copper-based composite material are remarkably improved, and meanwhile the excellent intensity and shock resistance are achieved. The invention further discloses a preparation method of the copper-based composite material. The method is simple in process, production is easy, and wide application prospects are achieved.

The invention discloses a semiconductor PiP (package in package) system structure and a manufacturing method thereof. The semiconductor PiP system structure comprises a lead frame, a first metal material layer, a second metal material layer, an IC (integrated circuit) chip provided with salient points, a lead bonding IC chip, an insulating filling material, a pasting material and a plastic package material, wherein the lead frame comprises a chip carrier and multiple pins which surround the chip carrier and are arranged in multiple circles; the first metal material layer and the second metal material layer are respectively positioned on the upper surface and lower surface of the lead frame, and the insulating filling material is positioned below a terraced structure of the lead frame; the lead bonding IC chip is positioned on the chip carrier; and the salient points of the IC chip provided with the salient points are positioned on the inner pins of multiple circles of the pins in a flip-chip bonding manner, the plastic package material is used for coating the IC chip provided with the salient points and the lead bonding IC chip, thus forming the semiconductor PiP system structure. The invention relates to a three-dimensional package structure which has the advantages of high reliability, low cost and high I / O (input / output) density and is based on QFN (quad flat no-lead) package and a manufacturing method thereof.

The invention belongs to the technical field of composite material preparation, and relates to a method used for preparing a liquid state moulded composite material sandwich structure from foam filledhoneycomb. The method is used for solving difficulties in liquid state moulding and honeycomb using. According to the method, a phenolic foaming material with both material and technology matching performance with the honeycomb material and the liquid state moulding material is adopted for pre-filling of honeycomb holes, and then after pre-curing, the foamed filled honeycomb core material is adopted in liquid state moulding so as to obtain the foam filled honeycomb sandwich composite material using liquid moulding technology. The method is adopted to prepare that foam filled honeycomb sandwich structure, so that a problem that it is difficult to introduce honeycomb into liquid state moulding is solved, manufacturing difficult problems are solved, the honeycomb core material is suitable for a plurality of liquid state moulding, and the adaptability is relatively high.

The invention discloses a preparation method of a para / meta aramid composite paper. The method specifically comprises the steps of: pretreating para-aramid chopped fiber; conducting first untwining on the pretreated para-aramid chopped fiber by a dfibizer; then adding meta-aramid pulp fiber to conduct second untwining; finally adding a dispersant to conduct third untwining to obtain a suspension; injecting the obtained suspension into a paper sheet former to conduct dehydration forming, and carrying out squeezing and drying treatment to obtain aramid composite paper raw paper; and conducting hot press molding on the obtained aramid composite paper, thus obtaining the product. The preparation method of the aramid composite paper provided by the invention can maximumly utilize the high strength properties of chopped fiber to improve the strength properties of meta-aramid paper.

The invention discloses an aluminum oxide reinforced copper base composite material. The aluminum oxide reinforced copper base composite material is characterized by comprising the following components in percentage by weight: 1-6% of modified ceramic aluminum oxide, 2-10% of graphite, 0.5-5% of Ti3SiC2, 2-8% of nickel, 2-8% of iron, 2-10% of tin, 1-5% of bismuth, 0.1-1% of zirconium oxide, 0.1-0.5% of lanthanum, and the balance of copper; and the modified ceramic aluminum oxide is surface-modified Al2O3 particles and surface-modified Al2O3 whiskers. The surfaces of the Al2O3 particles and theAl2O3 whiskers for the copper base composite material are modified by lauryl sodium sulfate water solution; through surface modification, the impurity content of the ceramic aluminum oxide is obviously reduced; multiple metal elements are matched for assisting and cooperating with a welding structure, so that the dispersibility is excellent, the ceramic aluminum oxide and a copper basal body arefirmly bonded, and the acceleration effect is prominently improved; and when the effect of external force is suffered, through excellent combined interfaces, the load transfer effect can be effectively achieved, the stress concentration is reduced, and defects are reduced.

The invention provides a planar oxygen sensor, which comprises a heating layer, a reference gas layer and a sensing layer sequentially from bottom to top. The planar oxygen sensor is characterized in that the reference gas layer is provided with through holes, and closed reference cavities are formed at the through holes of the heating layer, the reference gas layer and the sensing layer. The reference gas layer is provided with the through holes, so that the combination area of the reference gas layer with the upper layer and the lower layer is enlarged, and product yield can be increased effectively. In addition, the sensing layer, the reference gas layer and the heating layer are stacked to form the closed reference cavities, so that voltage signals outputted by the planar oxygen sensor are stable.

The invention discloses a nursery stock grafting method which comprises the following steps of (1) selection of a stock, selection of a scion, (3) combination, (4) treatment of the combined portion and (5) timely watering after combination. In the combination process, the combined part of the stock is cut open to form a 30-degree oblique plane through a disinfected knife, the phloem of the lower portion of the scion is cut off by 1 cm to 1.2 cm, so that the cambium is exposed, the cambium of the stock is combined with the cambium of the scion. The grafted nursery stock is managed in a conventional method. According to the nursery stock grafting method, the combination area between the cambium of the stock and the cambium of the scion is enlarged, combination is tighter, the grafting survival rate can be increased, the survival rate can achieve 80 percent to 90 percent, the germination rate of the nursery stock after grafting can be increased at the same time, and the nursery stock after grafting can survive ahead of time by 10 days to 15 days.

The invention discloses a magnetic bead time resolution fluorescence immunoassay quantitative determination CK-MB kit. The CK-MB kit comprises an immunomagnetic bead coating a CK-MB monoclonal antibody, a CK-MB standardized product solution, a europium-marked CK-MB monoclonal antibody solution, washing liquid and enhancement liquid. The immunomagnetic bead coating the CK-MB monoclonal antibody isa covalent conjugate of a superpara magnetic bead modified by a functional group and with the diameter being 1-3 microns and the CK-MB monoclonal antibody. The kit has the high sensibility, the sensibility of CK-MB is 1ng / mL, and a blood serum (plasma) does not need to be diluted; the determination time is short, and a report can be resulted within 30 minutes; the demanding amount of the sample isless, and only 50 microliters are needed for one-time sample loading; and the kit is equipped with a full-automatic time resolution immune analysis meter, operation is easy, no artificial error exists, and labor is saved. The kit reasonably utilizes the space of a reagent strip, the structure of the reagent strip is more compact, the reagent strip can be transported more easily, and used conveniently, the operation is simple, and the stability is good.

The invention relates to anti-seepage structures of building engineering, in particular to an anti-seepage structure of a kitchen and bathroom reserved hole and a construction method. The anti-seepage structure of the kitchen and bathroom reserved hole comprises the pipeline reserved hole formed by cast-in-place concrete, a drain pipe and filling concrete poured between the pipeline reserved hole and the drain pipe are arranged in the pipeline reserved hole, the filling concrete is composed of a first concrete layer and a second concrete layer, the first concrete layer is located below the second concrete layer, the first concrete layer is in a straight cylinder shape, and the second concrete layer is in an inverted-circular-cone shape. The two concrete layers in different shapes are combined, so that the combination area with the pipeline reserved hole (1) is enlarged, and the anti-seepage performance of the plugged hole is improved. Thus, maintenance cost increased by water leakage can be reduced, and resources can be easily saved. An anti-seepage agent is arranged in the filling concrete, and thus the anti-seepage effect is better.

The invention relates to a porous plant fiber plate, relative preparation and special device. Wherein, the preparation comprises: inserting the sharp hollow punch head with inner sheath into the blank of plant fiber plate to be heated; using compress plate to compress it and attain the plates which has vertical through holes. Said plant fiber comprises the fiber or fiber beams made from wood or non-wood plant; the shape of through hole can be round, regular hexagon, and square, etc; the diameter of through hole is 10-200mm, the hole rate is 20-90%; said through holes are distantly or un-distantly arranged. The inventive plate can effectively reduce the wood consumption; reduce the weight; and support the application for vibration adsorption, sound insulation and thermal insulation. And it is not limited by thickness, to apply door and walls of building.

The invention discloses a display panel and a display device. Multiple welding discs are included, the welding discs comprise first secondary parts and second secondary parts which are electrically connected, the first secondary parts have first length, the second secondary parts have second length, the second length is greater than the first length, the edges, close to a fastening area, of the display panel is first edges, the ends, close to the first edges, of the first secondary parts are first end parts, the distance from the first end parts to the first edges is first range, the ends, close to the first edges, of the second secondary parts are second end parts, the distance from the second end parts to the first edges is second range, and the second range is smaller than the first range. By lengthening the second secondary parts of the welding discs to increase the fastening area, the fastening effect is better, the signal transmission accuracy and stability of the fastening areaare improved, better compatibility is achieved when the electronic assembly is fastened, and the influence on the fastening of an electronic assembly caused by expansion caused by heat and contractioncaused by cold is reduced.

The invention discloses a cooling device and method for a cylindrical power battery pack. The cooling device comprises a battery pack and a cooling structure thereof. The cooling structure includes a cooling channel which is distributed at two side faces of the battery pack and the inside of which is provided with a cyclically flowing cooling working medium, and heat pipes for transferring the heat generated by the battery pack to the channel body of the cooling channel; the heat generated by the battery pack is indirectly transferred to the channel body of the cooling channel through the heat pipes, and the heat generated by the battery pack is taken away by the cyclically flowing cooling working medium in the cooling channel. For the device, the heat pipes are adopted for heat-dissipation of the battery pack, the entire device is compact, small in floor space, flexible in layout, and easy for the connection between single cells. The cooling device has the advantages of simple structure, environment protecting and energy saving, easiness in installation and convenience in maintenance, so the problem of dissipation of the cylindrical power battery pack under different working conditions is solved to reduce the maximum temperature and the overall temperature difference of the battery pack, which has a good application prospect.

The invention discloses a preparation method of para-aramid and meta-aramid electrical insulation paper. The method comprises the following steps that para-aramid chopped fibers are preprocessed for use; meta-aramid chopped fibers are preprocessed; the preprocessed para-aramid chopped fibers and the preprocessed meta-aramid chopped fibers are mixed in a fluffer for primary defibering; then meta-aramid pulp fibers are added for secondary defibering; lastly, a dispersing agent is added for third defibering, and suspension liquid is obtained; the obtained suspension liquid is injected into a sheet forming device for dewatering forming, and body paper of the aramid electrical insulation paper is obtained after pressing and drying treatment; the obtained body paper of the aramid electrical insulation paper is subjected to hot press molding, and the aramid electrical insulation paper is obtained. According to the preparation method of the aramid electrical insulation paper, different ratios of the para-aramid chopped fibers to the meta-aramid chopped fibers are adopted, and the aramid electrical insulation paper with high strength and good dielectric properties is prepared.

The invention relates to the technical field of 3D (Three-dimensional) printer manufacturing, in particular to a 3D printing device for printing buildings. The 3D printing device for printing the buildings comprises a ceramsite conveying mechanism, wherein a spiral drive device is arranged in a spray head; a nozzle is arranged at the lower end of the spray head, and is formed by two end plates oppositely arranged in parallel and two sides plates oppositely arranged in a surrounding way; the two end plates are perpendicular to a movement direction of the nozzle; multiple bulge parts and sunkenparts are arranged on the two end plates long a length direction of the nozzle; the bulge part on one end plate and the sunken part on the other end plate are arranged correspondingly so as to realizethe matching of binding surfaces of each layer of wall body; a ceramsite discharge pipe and a support plate are arranged in the nozzle; the ceramsite discharge pipe is fixed into the nozzle through the support plate; and the upper end of the ceramsite discharge pipe is sealed. The 3D printing device for printing the buildings adopting the technical scheme provided by the intention has the advantages that a printed building wall is smooth in wall surface, good in attractiveness, high in structural strength, and good in forming effect.

The invention relates to a high-heat-conductivity tungsten-copper heat sink and electronic packaging material. The tungsten-copper heat sink and electronic packaging material is composed of copper or a copper alloy matrix, and a tungsten-copper composite coat formed on copper or the copper alloy matrix through a vacuum plasma spraying technology, wherein the room-temperature heat conduction coefficient of the tungsten-copper heat sink and electronic packaging material is greater than 300W / (m.K), the porosity of the tungsten-copper composite coat is lower than 3%, the thickness of the tungsten-copper composite coat is 100-2000mum, and the weight percent content of copper in the tungsten-copper composite coat is 10-40%.

The invention relates to a manufacturing method of a copper-clad plate. The method comprises the following steps of: providing a ceramic baseplate, carrying out roughening treatment on the surface of the ceramic baseplate; carrying out copper deposition treatment on the ceramic surface after roughening to form a copper-deposited base; and carrying out electroplating treatment on the formed copper-deposited base to form the copper-clad plate. The invention also provides a manufacturing method of a printed circuit plate based on the manufacturing method of the copper-clad plate. The invention further provides the copper-clad plate and the printed circuit plate. The printed circuit plate has the advantages of good electrical property, good mechanical property and high reliability.

The invention discloses a tube plate type core device of a flat-plate solar collector and belongs to the technical field of flat-plate solar collectors. The tube plate type core device comprises a pair of round guide collecting tubes with large tube diameters, a plurality of heat absorption row tubes with small tube diameters and a flat-plate absorber plate with an absorption layer on the surface. The guide collecting tubes are provided with a plurality of connection rings which are arranged at intervals. The heat absorption row tubes are special-shaped tubes with flat top surfaces. Each heat absorption row tube has a longer main-body middle section and two shorter same-direction bending sections. A port of each bending section is provided with a round insertion port. The round insertion ports are respectively inserted in corresponding connection rings and are in brazed connection with the connection rings. The flat top surfaces of the heat absorption row tubes and the top edges of the guide collecting tubes are integrally located on the same plane. An ultrathin and continuous heat conduction silica gel layer is adhesively bonded on the back plane of the flat-plate absorber plate. By means of the technical scheme, the tube plate type core device is high in heat transfer property, no damage is caused to absorption films, bonding area is large and full contact is achieved, the flat-plate absorber plate is large in heat utilization area, and heat transfer is conducted evenly between tube plates.

The invention discloses a spraygun of a gasification chamber for desulfurizing granular magnesium. The spraygun comprises a metal gun core the lower end of which is provided with the gasification chamber; the outer circumferential surface and the underside of the gastification chamber are covered with a refractory working liner respectively; the inner surface of the sidewall of the gasification chamber is an outer convex arched surface; the lower end of the gasification chamber is provided with hemline skirt; a plurality of zigzag protrusions with downward tooth tips are arranged on the inner surface of the hemline skirt along the circumferential direction or a plurality of metal short columns are welded on the inner surface of the hemline skirt; and the inside of the refractory working liner is distributed with a plurality of solid riveting pieces. The structure of the gasification chamber avoids the promoting action of the prior conical top corner to slag adhesion, reduces the slag adhering speed and the slag cleaning frequency and delays the deforming speed of a metal member of the gasification chamber; and the irregular hemline skirt can absorb the whole deformation of the hemline of the sidewall of the gasification chamber, strength the comprehensive strength and non-deformability of the wall of the gasification chamber and finally achieve the aims of prolonging the service life of the spraygun, reducing the manufacturing cost for the spraygun and improving the use performance of the spraygun.

The invention relates to a conducting and radiating energy-saving motor. A motor stator heat-conducting shell (1) is connected with a distributive sheet hollow radiating slot (8) and hollow radiating chambers (7) at two ends; the upper part of the motor stator heat-conducting shell (1) is connected with a radiator (3) by a connector (6); the radiator (3) consists of a branch pipe (5) pipeline, a radiating fin and an oil filler (4); heat-conducting oil is used as a conducting device; all hollow radiating chambers distributed on the stator heat-conducting shell (1) conduct internal heat to the external radiator by the heat-conducting oil for radiating; two radiating methods, namely an automatic radiating method or a forcible radiating method, can be selected by the motor, thus eliminating a motor radiating flywheel fan and a wind-guiding cover; the radiating ribbon ventilation passage of the shell is changed into the hollow radiating chamber, thus improving the heat conduction efficiency; therefore, the big problem on the heat dissipation of the motor is effectively solved; the service life of the motor is prolonged; and the conducting and radiating energy-saving motor is particularly applicable to the radiating systems of the oil field motors, various closed low-noise power generator units and the high-speed motors in the field severe environments with high and low temperatures and insolation.