Display panel and display device

Abstract

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a display area and a non-display area surrounding the display area, the non-display area isprovided with a plurality of fan-out wires and a plurality of first binding bonding pads, and the fan-out wires are led out from the display area and electrically connected with the first binding bonding pads; the first binding bonding pads are arranged in a first direction, and each first binding bonding pad comprises a first bonding pad part and a second bonding pad part; the first end of the first bonding pad part in each first binding bonding pad is in electrical contact with the first end of the corresponding second bonding pad part, the second end of each second bonding pad part is electrically connected with the corresponding fan-out wire, and the length direction of the first bonding pad parts intersects with the length direction of the second bonding pad parts; an acute angle between the long edge of each second bonding pad part and the connected fan-out wire is smaller than 30 degrees. According to the technical scheme, a frame of the display panel is further narrowed while the effective binding area of the first binding pads is ensured.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of display panels, and in particular, to a display panel and a display device. Background technique [0002] With the wide application of electronic products such as mobile phones, more and more requirements are placed on the non-display area of ​​the display panel, and narrow bezels have become a development trend of electronic products. [0003] In order to achieve a narrow frame, the current chip packaging mainly adopts chip on film (COF, Chip On Film) and chip on plastic (COP, Chip On Pi) packaging technology. For a display panel using a COF packaging process, the width of its lower border is mainly limited by the vertical size of the fanout area (fanout) and the binding area, and with the increase in the pixel density of the display panel, the vertical size of the fanout area and the binding area It is difficult to shrink any further, resulting in a larger size of the lower bezel ...

AI Technical Summary

Problems solved by technology

For a display panel using a COF packaging process, the width of its lower border is mainly limited by the vertical size of the fanout area (fanout) and the binding area, and with the increase in the pixel density of the display panel, the vertical size of the fanout area and the binding area Difficult to scale down any further, resulting in a larger size for the lower bezel of the display panel

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