Packaging material of high capacity film capacitor

A technology of packaging materials and film capacitors, applied in the direction of hybrid box/housing/packaging, etc., can solve the problems of low stress, high thermal conductivity, etc., achieve good flow performance, good heat and humidity resistance, and ensure reliability

Inactive Publication Date: 2016-03-09
建伟电子科技(广州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The stable electrical insulation performance of the invention can ensure long-term stable operation of large-capacity capacitors; high thermal conductivity and low stress can ensure that large-capacity capacitors can be used in harsh outdoor environments, and have excellent weather resistance and cold and heat shock resistance, and are compatible with metals and Good adhesion of plastic, can solve the problem of insulation packaging of large-capacity film capacitors

Method used

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  • Packaging material of high capacity film capacitor

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Effect test

Embodiment 1

[0036] A packaging material for a large-capacity film capacitor, the packaging material is formed by mixing components A and B, and the weight ratio of component A to component B is 1:1~1.2;

[0037] The A component includes the following raw materials in parts by weight: 10 parts of bismaleimide modified phenolic resin; 2 parts of epoxy resin; 3 parts of ethyl acetate; 5 parts of butyl glycidyl ether;

[0038] The B component includes the following raw materials in parts by weight: 7 parts of modified amine curing agent; 6 parts of zinc N-ethyl-N-phenyldithiocarbamate; 3 parts of thermal conductivity reinforcing agent; tetrakis (4-hydroxy 1 part of pentaerythritol ester of -2,5-tert-butylphenylpropionate; 8 parts of anilinomethyltriethoxysilane; 1.5 parts of ethyl imidazole; 0.3 parts of anti-settling agent; 0.2 parts of defoaming agent.

Embodiment 2

[0040] A packaging material for a large-capacity film capacitor, the packaging material is formed by mixing two components, A and B, and the weight ratio of component A to component B is 1:1.1;

[0041] The A component includes the following raw materials in parts by weight: 15 parts of bismaleimide modified phenolic resin; 5 parts of epoxy resin; 8 parts of ethyl acetate; 15 parts of butyl glycidyl ether;

[0042] The B component includes the following raw materials in parts by weight: 9 parts of modified amine curing agent; 9 parts of zinc N-ethyl-N-phenyldithiocarbamate; 6 parts of thermal conductivity reinforcing agent; tetrakis (4-hydroxy 2 parts of -2,5-tert-butylphenylpropionic acid) pentaerythritol ester; 15 parts of anilinomethyltriethoxysilane; 2.5 parts of ethyl imidazole; 0.6 parts of anti-settling agent; 0..5 parts of defoaming agent.

Embodiment 3

[0044] A packaging material for large-capacity film capacitors, the packaging material is formed by mixing two components, A and B, and the weight ratio of component A to component B is 1:1.2;

[0045] The A component includes the following raw materials in parts by weight: 25 parts of bismaleimide modified phenolic resin; 9 parts of epoxy resin; 15 parts of ethyl acetate; 25 parts of butyl glycidyl ether;

[0046] The B component includes the following raw materials in parts by weight: 15 parts of modified amine curing agent; 15 parts of zinc N-ethyl-N-phenyldithiocarbamate; 12 parts of thermal conductivity reinforcing agent; tetrakis (4-hydroxy -2,5-tert-butylphenylpropionic acid) 3 parts of pentaerythritol ester; 25 parts of anilinomethyltriethoxysilane; 3.5 parts of ethyl imidazole; 1.6 parts of anti-settling agent; 1.5 parts of defoamer.

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Abstract

The invention discloses a packaging material of a high capacity film capacitor. The packaging material is prepared by mixing a component A with a component B, and the component A comprises bimaleimide modified phenolic resin, epoxy resin, ethyl acetate and butyl glycidyl ether; and the component B comprises a modified amine curing agent, zinc N-ethyl-N-phenyldithiocarbamate, a heat conduction strengthening agent, pentaerythrite tetra(4-hydroxy-2,5-t-butylphenylpropionate), anilinomethyltriethoxysilane, ethylimidazole, an anti-settlement agent and an antifoaming agent. The packaging material has an excellent electric insulation performance, so long-term stable working of the high capacity film capacitor is ensured; the packaging material has high heat conduction coefficient and low stress, so the high capacity film capacitor can be used in severe outdoor environment; and the packaging material also has the advantages of excellent weatherability, hot and cold impact resistance, good bonding force with metals and plastics, and solving of the insulation packaging problem of the high capacity film capacitor.

Description

technical field [0001] The invention relates to the field of electronic packaging materials, in particular, the invention relates to a packaging material without large-capacity film capacitors. Background technique [0002] All countries in the world are starting to research and develop electric double layer capacitors, that is, super large capacity capacitors. It stores energy by polarizing the electrolyte, and the energy storage process is reversible. Therefore, supercapacitors can be repeatedly charged and discharged hundreds of thousands of times, and are widely used in various fields such as new energy vehicles, power systems and grid transformation, instrumentation, backup power supplies, and high-speed rail. Large-capacity film capacitors are larger than ordinary film capacitors, and multiple capacitors are connected in series or in parallel, with complex distribution and a wide range of applications. Therefore, large-capacity film capacitors need packaging material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L63/00C08K13/02C08K5/1515C08K5/134C08K5/544C08K3/34H01G11/78
CPCY02E60/13C08L61/14C08L2201/02C08L2201/08H01G11/78C08L63/00C08K13/02C08K5/1515C08K5/1345C08K5/544C08K3/34
Inventor 郑春秋
Owner 建伟电子科技(广州)有限公司
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