LED-packaging epoxy resin composition

A technology of LED encapsulation and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., and can solve problems such as sacrifice

Inactive Publication Date: 2012-10-24
MIANYANG WELLS ELECTRONICS MATERIAIS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For these solutions, although the viscosity can be increased, other pro

Method used

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  • LED-packaging epoxy resin composition
  • LED-packaging epoxy resin composition
  • LED-packaging epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]

[0035]

[0036] Properties before curing:

[0037]

[0038] Process conditions:

[0039]

[0040] It is to mix components A and B in an equal weight ratio, which is equivalent to 1:1 mixing and stirring for curing, and then curing is generally carried out in stages, demoulding after half an hour to 1 hour at 130°C, and then 130°C for 6- Cured after 8 hours, and then cured at 150°C for 1 hour.

[0041] Properties after curing:

[0042]

Embodiment 2

[0049] For Example 2, this comparative example only uses hydrogenated bisphenol A epoxy resin, the viscosity is below 500cps, and the color correcting agent will also settle after being stored at room temperature for a period of time; It settles quickly and cannot be uniformly dispersed and cured, which affects the quality after curing. The pure hydrogenated bisphenol A system has a very low activity and a very low Tg after curing. Although the flexibility is good, the heat resistance is too poor. The Tg is only about 100°C, and it is easy to soften during use and curing. .

[0050] Of course, if only solid cycloaliphatic resin is used, it is definitely impossible.

[0051] Example 2

[0052]

[0053] illustrate:

Embodiment 3

[0056]

[0057]

[0058] Compared with Example 1, this example reduces the amount of solid alicyclic resin EHPE3150, so the viscosity of component A is reduced to below 1000cps.

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Abstract

The invention discloses a method for improving the performance of a large-power high-light-transmittance LED packaging epoxy resin composition. The composition is composed of a component A and a component B. The composition has excellent UV resistance and yellowing resistance. The composition is advantaged in good manufacturability, good light transmittance, and low light failure. The composition can be used in white-light and blue-light LED packaging. Compared with organosilicon, the composition is advantaged in low price. Innovatively, the component A of the composition is composed of liquid cycloaliphatic epoxy resin, solid cycloaliphatic epoxy resin, and hydrogenated bisphenol A epoxy resin. An anti-forming agent, a color complementary agent, and a dispensing agent are adopted in auxiliary. The system does not contain benzene ring, and yellowing is not easy to occur. The component B is prepared through the steps that: methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride are subjected to a polymerization reaction with promoting agents or cationic initiators such as quaternary phosphonium salt, quaternary ammonium salts, DBU salt, and imidazole; with added phosphate antioxidant, a thermal yellowing capacity is improved. With the applications of an ultraviolet absorber and a light stabilizer, a UV yellowing resisting effect is further improved.

Description

technical field [0001] The invention relates to an epoxy resin compound, in particular to an epoxy resin compound capable of improving the performance of white light LED packaging materials. Background technique [0002] Due to the low thermal conductivity of ordinary bisphenol A epoxy resin itself, the benzene ring is prone to electronic π-π transition and yellowing, which leads to some defects in weather resistance, so it is easy to changes, affecting performance. [0003] as attached Figure 6 As shown, the light decay of white light is the fastest, so when packaging white light LEDs, the performance requirements of the resin are particularly high. [0004] For epoxy packaging of LEDs, epoxy resins are generally required to have high transparency and strong yellowing resistance. Since part of the ultraviolet light will leak to the outside during the conversion process of LED phosphor powder, in the field of high-transmittance LED packaging, the requirements for yellowin...

Claims

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Application Information

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IPC IPC(8): C08G59/20C08G59/24C08G59/42C09J163/00C09J11/06H01L33/56
Inventor 周鸿飞陆南平卓虎
Owner MIANYANG WELLS ELECTRONICS MATERIAIS
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