Double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive

A transparent epoxy resin, LED patch technology, applied in the direction of epoxy resin glue, adhesive, film/flake adhesive, etc., can solve the problems of high moisture absorption, poor UV resistance, low light transmittance, etc.

Inactive Publication Date: 2012-08-15
JIANGSU TETRA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a transparent, low viscosity, strong cohesive force, not easy to crack, high temperature and high corrosion resistance and low temperature alicyclic epoxy resin patch adhesive, to overcome the brittleness of the existing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of component A: 94% 4-vinyl epoxycyclohexane, 2.6% methylphenyl silicone resin, 2.6% propylene oxide butyl ether, 0.06% transparent blue-violet dye paste, 0.14% by mass percentage % defoamer and 0.6% softener are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;

[0021] The preparation of component B: the mass percentage is the mixture of 98% methyl hexahydrophthalic anhydride and polyazelaic anhydride, 0.92% tetramethylammonium bromide, 0.5% ultraviolet absorber, 0.5% glycerin and 0.08% Tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester was weighed in proportion, stirred at 70-90°C for 3-4h until uniformly mixed;

[0022] A and B components are mixed at 1:0.95 for construction.

Embodiment 2

[0024] Preparation of component A: 95% by mass percent of 3,4-epoxycyclohexylmethyl methacrylate, 2.1% benzyl silicone resin, 2.1% propylene oxide phenyl ether, 0.06% transparent blue-violet dye Weigh the slurry, 0.14% defoamer and 0.6% softener in proportion, and stir at 70-90°C for 3-4h until they are evenly mixed;

[0025] The preparation of component B: the mass percent is the mixture of 98% methyl hexahydrophthalic anhydride and polyazelaic anhydride, 0.95% tetramethylammonium iodide, 0.5% ultraviolet absorber, 0.5% glycerin and 0.05% Weigh 2,6-di-tert-butyl-p-cresol in proportion, stir at 70-90°C for 3-4h until uniform;

[0026] A and B components are mixed at 1:0.95 for construction.

Embodiment 3

[0028] Preparation of component A: 95% by mass percent of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carbonate, 2.1% epoxy-modified silicone resin, 2.1% propylene oxide benzene Base ether, 0.06% transparent blue-violet dye paste, 0.14% defoamer and 0.6% softener are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;

[0029] The preparation of component B: the mass percentage is the mixture of 98% hexahydrophthalic anhydride and polyazelaic anhydride, 0.95% tetramethylammonium iodide, 0.5% ultraviolet absorber, 0.5% glycerin and 0.05% 2, Weigh 6-di-tert-butyl-p-cresol in proportion, stir at 70-90°C for 3-4h until uniform;

[0030] A and B components are mixed at 1:1 for construction.

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PUM

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Abstract

The invention relates to a double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive. The double-component transparent epoxy resin LED patch packing adhesive is characterized by consisting of two components, namely an A component and a B component, wherein the A component and the B component are mixed to be applied to construction according to the proportion of 1:(0.9-1.0), the A component consists of cycloaliphatic epoxy resin, silicone resin intermediate, reactive diluent, transparent blue and purple dye color paste, a defoaming agent and a flexibility agent, and the B component consists of a curing agent, an accelerating agent, an ultraviolet absorbent, polyalcohol and an antioxidant. The invention provides transparent cycloaliphatic epoxy resin patch adhesive with small viscosity, strong cohesive force, difficulty in cracking, high temperature resistance, high corrosion resistance and low temperature resistance, overcomes the defects that the current epoxy resin patch adhesive has brittleness, high hygroscopicity, low light transmittance, poor ultraviolet resistance and the like, is more suitable for outside LED and high-power LED packing adhesive, has the advantages of being simple in manufacturing process, lower in production cost and advanced technique in country, and is suitable for industrial large-scale production.

Description

technical field [0001] The invention relates to an LED chip packaging glue, in particular to a two-component transparent epoxy resin LED chip packaging glue. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, are widely used in lighting, radiation sources, and displays because they have advantages in all aspects compared with incandescent lamps and fluorescent lamps. LED packaging materials must have high light transmittance, refractive index, excellent processability, moisture resistance, solvent resistance, thermal discoloration resistance, UV aging resistance and other necessary mechanical and thermal properties. [0003] With the development of the electronics industry, electronic appliances are developing toward miniaturization, light weight, multi-function, and high performance, and the application of surface mount technology SMT is becoming more and more common. Surface mount technology, its process invo...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J163/00C09J183/04C09J11/06H01L33/56
Inventor 曹祥来曹祥明乔毅常杨军
Owner JIANGSU TETRA NEW MATERIAL TECH
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