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265results about "Cleaning and washing methods" patented technology

Nanoelectronic and microelectronic cleaning compositions

InactiveUS20090163396A1Improved and superior cleaningImproved and superior and stripping photoresistElectrostatic cleaningOrganic/inorganic per-compounds compounding agentsHafniumSolvent
Nanoelectronic and microelectronic cleaning compositions for cleaning nanoelectronic and microelectronic substrates under supercritical fluid state conditions, and particularly cleaning compositions useful with and having improved compatibility with nanoelectronic and microelectronic substrates characterized by silicon dioxide, sensitive low-κ or high-κ dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of Al or Al(Cu) metallizations and advanced interconnect technologies, are provided by nanoelectronic and microelectronic cleaning compositions comprising nanoelectronic and microelectronic cleaning compositions of this invention are provided by compositions comprising: (1) a supercritical main fluid reaching a supercritical fluid state at a temperature of 250° C. or less and a pressure of 600 bars or less (592.2 atm, 8702.3 psi), and (2) as a secondary fluid, a modifier formulation selected from the following formulations: a) a formulation comprising: an oxidizing agent; a polar organic solvent selected from the group consisting of amides, sulfones, sulfolenes, selenones and saturated alcohols; and optionally other components; b) a silicate free formulation comprising: a polar organic solvent selected from the group consisting of amides, sulfones, selenones and saturated alcohols; a strong alkaline base; and optionally other components; c) a formulation comprising: from about 0.05% to 30% by weight of one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions; from about 0.5 to about 99.95% by weight of one or more corrosion inhibiting solvent compounds, said corrosion inhibiting solvent compound having at least two sites capable of complexing with metals; and optionally other components; d) a formulation comprising: from about 0.05 to 20% by weight of one or more non-ammonium producing, non-HF producing fluoride salt; from about 5 to about 99.95% by weight of water, organic solvent or both water and organic solvent; and optionally other components; and e) a formulation comprising: from about 0.05% to 30% by weight of one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions; from about 5 to about 99.95% by weight of one or more steric hindered amide solvents; and optionally other components.
Owner:AVANTOR PERFORMANCE MATERIALS LLC

Methods and Apparatus for Laser Cleaning

A method of cleaning a substrate (16, 24, 34, 64, 71, 82, 102, 165, 171, 181, 201, 300, 310) with optical energy can comprise applying optical energy from a source of optical energy (12, 21, 31, 91, 103, 114, 121, 131, 141, 151, 164, 191, 202) to the substrate. The method can comprise applying the optical energy to a substrate having a cleaning agent applied thereto, the optical energy having one or more optical parameters selected for cleaning the substrate. The method can comprise reading data from a data bearing element (173) associated with the substrate, communicating the data to a processor (154) associated with a cleaning appliance (10, 30, 40, 60, 70, 80, 90, 110, 120, 130, 140, 150, 161, 200) comprising the source of optical energy, wherein the processor, responsive to the communicated data, controls the cleaning of the substrate with the optical energy. The method can comprise slidingly contacting the substrate with a work surface, said work surface comprising an aperture (83, 117) and emanating optical energy from the aperture for cleaning the substrate. A cleaning appliance can comprise an appliance body (80, 90, 104, 125) comprising an aperture for emanating optical energy for cleaning the substrate and an optical transmission pathway arranged for propagating optical energy received from an optical energy source to said aperture. The appliance can be adapted and constructed for delivering a cleaning agent to the substrate. The appliance can include a processor, a data interface in communication with the processor, and can be configured such that the processor outputs signals that control the cleaning of the substrate, the processor being configured for controlling, responsive to data received by the data interface and via the output signals, the substrate cleaning. The cleaning appliance can include a suction pump (142) for removing material from the substrate.
Owner:WOODROW SCI LTD
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