The invention relates to a high-energy pulse magnetron
sputtering linkage device, and relates to the technical field of
microwave superconducting accelerators, the high-energy pulse magnetron
sputtering linkage device comprises a linkage device, a vacuum cavity and a vacuum obtaining
system, and the vacuum obtaining
system comprises a multi-stage mechanical pump and a molecular pump; the linkage device comprises a rotating mechanism and a linear moving mechanism, and can accurately control the position and movement of the target material to the Tesla type
copper cavity; the linkage device is provided with a movable displacement table corrugated
pipe, a displacement table motor device, a CF-100
flange interface, a bottom plate and a top plate
assembly, and high-precision
motion control of a target material, rotation of a substrate and dynamic optimization of
sputtering parameters are achieved, so that the problem of poor uniformity in the film growth process is solved, and the device is suitable for various
superconducting cavity structures. According to the method, the uniformity and quality of the film are effectively improved, meanwhile, the sputtering efficiency and the target material
utilization rate are improved, the service life of the target material is prolonged, the production cost is reduced, and the method is particularly suitable for solving the problem of Tesla cavity
coating uniformity and has remarkable industrial application advantages.