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Polishing pad, method of producing same, and polishing method

Inactive Publication Date: 2005-01-27
NIHON MICRO COATING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

Grooves are formed on the surface of the polishing pad of this invention for collecting polluting or contaminating objects such as debris generated during the polishing operation such that such objects can be discharged ou

Problems solved by technology

If a conventional flexible and elastic polishing pad is used to polish the surface of such a top layer, a gentle unevenne

Method used

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  • Polishing pad, method of producing same, and polishing method
  • Polishing pad, method of producing same, and polishing method
  • Polishing pad, method of producing same, and polishing method

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Abstract

A polishing pad is formed with a non-foamed member shaped as a plate having a flat surface and abrading particles affixed inside and on the surfaces of this non-foamed member. Its average surface roughness is in the range of 0.5 μm-10 μm, and its Shore D hardness is within the range of 50-85. Grooves are formed on the surface of the polishing pad for collecting debris generated during the polishing operation and serving also as flow routes of a polishing liquid for distributing it uniformly over the surface of the polishing pad.

Description

Priority is claimed on Japanese Patent Application 2003-174258 filed Jun. 19, 2003. BACKGROUND OF THE INVENTION This invention relates to a polishing pad to be used for polishing the surface of a workpiece made of a metallic material, ceramics or glass, as well as a method of producing such a polishing pad. In particular, the invention relates to such a polishing pad used for polishing the surface of a workpiece such as a semiconductor wafer, a semiconductor device wafer, a liquid crystal display element, a thin-film imaging device, a magnetic disk substrate and an optical disk substrate, a method of producing such a polishing pad and a method of polishing. Semiconductor devices and magnetic disks are used as principal electronic components of electronic apparatus such as telephones, cameras and computers in order to control their functions and to store or display data. A workpiece such as a semiconductor wafer used in such an electronic component is made into a product after hav...

Claims

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Application Information

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IPC IPC(8): B24D3/00B24D7/02B24D3/28B24D3/30B24D7/00H01L21/304
CPCB24D3/30B24B37/26
Inventor SAITO, MITSURUTAMURA, JUNIZUMI, TOSHIHIROKOBAYASHI, TOSHIHIRONAGAMINE, TAKUYAMILLER, CLAUGHTON
Owner NIHON MICRO COATING
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