A composable computing platform (100) comprising the following: a first parallel
interconnection layer (260, 262, 264), comprising a first plurality of switching structure branches (270, 273, 275) which provide parallel connections via the first parallel
interconnection layer (260, 262, 264); and a second parallel
interconnection structure layer (260, 262, 264) comprising a second plurality of switching structure branches (271, 274, 276) providing parallel connections via the second parallel interconnection structure layer (260, 262, 264); where: a first switching structure
branch of the first plurality of switching structure branches (270, 273, 275) and a first switching structure
branch of the second plurality of switching structure branches (271, 274, 276) are communicatively connected to each other and comprise a first switching structure, a second switching structure
branch of the first plurality of switching structure branches (270, 273, 275) and a second switching structure branch of the second plurality of switching structure branches (271, 274, 276) are communicatively connected to each other and comprise a second switching structure, and The first switching structure and the second switching structure are isolated from each other and provide independent paths for routing packets.