Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System including a host connected serially in a chain to one or more memory modules that include a cache

a technology of memory modules and host systems, applied in the field of computer system memory, can solve the problems of limited maximum memory bus speed, increased operating speed of computer system processors, and inability to configure external caches by end users

Inactive Publication Date: 2005-07-28
ADVANCED MICRO DEVICES INC
View PDF7 Cites 188 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This configuration enhances memory bus speed and performance by reducing latency and improving data access efficiency through point-to-point links and cache optimization, aligning with increasing processor speeds.

Problems solved by technology

There are several drawbacks to parallel bus arrangements.
For example, depending on the topology of the interconnect, the maximum memory bus speed may be limited due to transmission line effects such as signal reflections.
Furthermore, increasing the size of the external cache may require a system redesign and so the external cache may not be configurable by an end user.
Although the operating speed of computer system processors continues to increase, the relative performance of the main system memory has not increased at the same rate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System including a host connected serially in a chain to one or more memory modules that include a cache
  • System including a host connected serially in a chain to one or more memory modules that include a cache
  • System including a host connected serially in a chain to one or more memory modules that include a cache

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Turning now to FIG. 1, a block diagram of one embodiment of a system including a serially connected chain of memory modules is shown. System 50 includes a host 100 coupled to a system memory 125 via a memory link 1I A. System 50 may be configured to operate as part of a computing device such as a computer system or server system, for example. System memory 125 includes a memory module 150A coupled to a memory module 150B via a memory link 110B. Memory module 150B is shown coupled to a memory link 110C, which may be coupled to an additional memory module (not shown) as desired to form a serially connected chain of memory modules that is coupled to host 100. It is noted that although two memory modules are shown in the chain, it is contemplated that one or more memory modules may be connected in this manner. It is further noted that components including a reference number followed by a reference letter may be referred to generally by the reference number alone. For example, whe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system including a host coupled to a serially connected chain of memory modules. In one embodiment, at least one of the memory modules includes a cache for storing data stored in a system memory.

Description

[0001] This application claims the benefit of U.S. Provisional Application No. 60 / 470,078 filed May 13, 2003.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates to computer system memory and, more particularly, to memory module configurations and the memory subsystem topology. [0004] 2. Description of the Related Art [0005] Many computer systems employ a main system memory that may be configured dependent upon the needs of an end user. In such systems, a motherboard or system board may include a number of memory expansion sockets. One or more small circuit boards, referred to as memory modules, may be inserted into the sockets as needed to increase the memory capacity of the computer system. Each of the memory modules typically includes multiple memory devices that provide a given amount of memory capacity. The memory devices are usually implemented using some type of dynamic random access memory (DRAM). Some examples of DRAM types include sync...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): G06F12/00G06F13/16G06F13/28G11C5/00
CPCG06F12/0215G06F12/0862G06F2212/6022G06F13/4243G06F13/1626G06F13/1684G06F13/4256G06F13/16
Inventor TALBOT, GERALD R.WEBER, FREDERICK D.PATEL, SHWETAL A.
Owner ADVANCED MICRO DEVICES INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products