Polymer matrix composite membrane with high energy density and preparation method thereof

Abstract

The invention discloses a high-flexible polymer matrix composite membrane with high energy density and a preparation method thereof. The composite membrane is composed of a polymer matrix and core-shell structured nano-fibre dispersed in the polymer matrix; the core layer of the core-shell structured nano-fibre is ceramic fibre; the shell layer is an organic matter coated layer, wherein the mass percentage of the polymer matrix is 50-95%; and the mass percentage of the core-shell structured nano-fibre is 5-50%. The polymer matrix and the core-shell structured nano-fibre are composited into the membrane by adopting a solution blending and tape casting method or a bidirectional membrane pulling method, so that a flexible polymer matrix composite material having the advantages of being good in dielectric property, high in breakdown field strength and high in energy density is obtained. The dielectric constant of the composite material can be modulated to 10-40 by adjusting the content of nano ceramic fibre; simultaneously, the dielectric loss Tan delta is kept to be less than 5%, the breakdown field strength is more than 210 kV/mm, and the energy density is 2-6 kJ/L; and the composite material is a material which can be used for capacitors and high power static energy storage.

Description

technical field [0001] The invention relates to a polymer-based composite membrane with high energy storage density and a preparation method thereof. Background technique [0002] At present, in the microelectronics industry, more than 98% of passive components such as capacitors and inductors use discrete components, and they occupy more than 70% of the circuit board space. Embedded packaging technology, which embeds discrete components inside the printed circuit board for packaging, is the key to realizing the miniaturization, light weight and thinning of electronic devices. Embedded packaging requires the use of embedded capacitors, which must have a high dielectric constant and good compatibility with the organic materials used in printed circuit boards. The currently used surface mount capacitors are basically multilayer ceramic capacitors (MLCC). Although the ceramic capacitor material has a very high dielectric constant, its high sintering temperature makes the proce...

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Problems solved by technology

Dang Zhimin and others used carbon fiber, metal Ni particles, etc. to compound with polyvinylidene fluoride (PVDF) matrix, and used the percolation effect of conductive particles in the insulating matrix to significantly improve the dielectric constant of the composite material, but the dielectric constant of the composite material Losses also grow sharply near the percolation threshold

The above facts show that (1) when the ferroelectric component is directly combined with the polymer, although the dielectric constant is increased, the volume percentage of the required ceramic particles is too high, resulting in poor flexibility of the composite material and high The high content of ceramic particles increases the number of defects in the composite material and significantly reduces the breakdown field strength of the material; (2) Composite conductive particles and polymers, although the seepage effect of conductive particles can significantly improve the dielectric constant of the composite material , but because the insulator-conductor transition is easy to occur inside the material, the dielectric loss is also greatly increased while the dielectric constant is increased, so the breakdown field strength of the material is also greatly reduced

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