Thermosetting resin composition and use thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor production and processing stability, toughness, heat resistance, weak dielectric properties, and dielectric properties. and poor mechanical properties

Inactive Publication Date: 2013-12-25
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Patent CN1131955A mentions the interpenetrating polymer network of allyl compounds and epoxy resin curing system, but the allyl compounds are low molecular weight compounds such as triallyl cyanurate (TAC) and their prepolymers, etc. Its toughness, heat resistance and dielectric properties are relatively weaker than functionalized polyphenylene ether resins, and low molecular weight compounds such as TAC have a low boiling point, are volatile, and have poor processing stability
[0006] It is mentioned in CN1193081C that epoxy resins with propylene or vinyl groups can be added to resins that can be polymerized by free radicals or silicon oxidation to improve perfo

Method used

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  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0094] Example 1

[0095] 70 parts of methacrylic acid-terminated polyphenylene ether resin (SABIC, trade name: SA9000), 28 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB400), 12 parts of acid anhydride curing agent styrene- Maleic anhydride copolymer (Sartomer, SMA EF40), 3 parts of cumene peroxide DCP and 70 parts of toluene were mixed and stirred until completely dissolved. Dissolve 0.2 parts of 2 ethyl-4 methyl imidazole in 10 parts of methyl ethyl ketone, and then add the above solution. The above-mentioned composition is fully stirred at room temperature to obtain a resin composition uniformly dispersed. The resin composition was impregnated into NE type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155° C. for 2-10 minutes, and the solvent was removed to obtain a prepreg with a resin content of about 55%.

[0096] Each of the eight overlapping prepregs was covered with a 1Oz copper foil on each side, and hot pressed for 9...

Example Embodiment

[0097] Example 2

[0098] 30 parts of methacrylic acid terminated polyphenylene ether resin (SABIC, trade name: SA9000), 53 parts of bromine-containing bisphenol A epoxy resin in acetone solution (Dow Chemical, DER530A80, ​​solid content 80wt%), 5 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB350), 22 parts of biphenyl type phenolic resin (Meiwa Chemicals, Japan, MEH-7851H), 0.05 parts of 2ethyl-4methylimidazole, 1.3 parts Cumene peroxide DCP was mixed with 60 parts of toluene and completely dissolved. The above-mentioned composition is fully stirred at room temperature to obtain a resin composition uniformly dispersed. The resin composition was impregnated into NE type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155° C. for 2-10 minutes, and the solvent was removed to obtain a prepreg with a resin content of about 55%.

[0099] Each of the eight overlapping prepregs was covered with a 1Oz copper foil on both sides, and hot pr...

Example Embodiment

[0100] Example 3

[0101] 70 parts of methacrylic acid-terminated polyphenylene ether resin (SABIC, trade name: SA9000), 28 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB400), 12 parts of acid anhydride curing agent styrene- Maleic anhydride copolymer (Sartomer, SMA EF40), 10 parts of 2,6-glycidyl phenyl allyl ether (commercially available reagent), 3 parts of cumene peroxide DCP and 70 parts of toluene were mixed and completely dissolved . Dissolve 0.2 parts of 2 ethyl-4 methyl imidazole in 10 parts of methyl ethyl ketone, and then add the above solution. The above-mentioned composition is fully stirred at room temperature to obtain a resin composition uniformly dispersed. The resin composition was impregnated into NE type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155° C. for 2-10 minutes, and the solvent was removed to obtain a prepreg with a resin content of about 55%.

[0102] Each of the eight overlapping prepregs was ...

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Abstract

The invention relates to a thermosetting resin composition. The thermosetting resin composition comprises (A) polyphenylene ether resin; (B) epoxy resin; (C) a curing agent and (D) an initiating agent. The thermosetting resin composition can also comprise a compound which simultaneously contains an epoxy group and an olefinic bond type unsaturated group, the curing agent, a flame retardant, an accelerant and the like. The thermosetting resin composition has the characteristics of low dielectric constant and dielectric loss, high heat resistance, flame retardance and the like, and is suitable for laminated boards and the like for prepregs and printed circuits.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a prepreg and a printed circuit laminate using the resin composition. Background technique [0002] At present, the electronic and electrical industry is developing rapidly, and the development direction of electronic products is light and thin, high performance, high reliability and environmental protection. The specific requirements of laminates for printed circuits are also manifested in high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. Therefore, traditional epoxy resins cannot fully meet the development needs of printed circuit laminates, and polyphenylene ether resins with high heat resistance, low dielectric constant and dielectric loss, and excellent toughness are used in printed circuit laminates. applications are beco...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L63/00C08L63/02C08L51/08C08F283/08C08F283/10B32B27/04B32B15/08H05K1/03
Inventor 孟运东方克洪
Owner GUANGDONG SHENGYI SCI TECH
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