Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermosetting resin composition and use thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor production and processing stability, toughness, heat resistance, weak dielectric properties, and dielectric properties. and poor mechanical properties

Inactive Publication Date: 2013-12-25
GUANGDONG SHENGYI SCI TECH
View PDF13 Cites 44 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Patent CN1131955A mentions the interpenetrating polymer network of allyl compounds and epoxy resin curing system, but the allyl compounds are low molecular weight compounds such as triallyl cyanurate (TAC) and their prepolymers, etc. Its toughness, heat resistance and dielectric properties are relatively weaker than functionalized polyphenylene ether resins, and low molecular weight compounds such as TAC have a low boiling point, are volatile, and have poor processing stability
[0006] It is mentioned in CN1193081C that epoxy resins with propylene or vinyl groups can be added to resins that can be polymerized by free radicals or silicon oxidation to improve performance such as adhesion, but the patent abandons ordinary epoxy resins and only uses There are very few types of epoxy resins with acrylic or vinyl groups on the market, which reduces the applicable space of their resin compositions and the cost is high
[0007] CN1160407A mentions a resin composition consisting of a curing system composed of an epoxy resin and an acid anhydride curing agent and an allyl network forming compound, wherein the allyl compound used is mainly triallyl cyanurate (TAC), etc. Low boiling point compound, poor production and processing stability, and its dielectric and mechanical properties are inferior to functionalized polyphenylene ether resin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] 70 parts of methacrylic acid-terminated polyphenylene ether resin (SABIC, trade name: SA9000), 28 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB400), 12 parts of anhydride curing agent styrene- Maleic anhydride copolymer (Sartomer, SMA EF40), 3 parts cumene peroxide DCP and 70 parts toluene were mixed and stirred until completely dissolved. 0.2 parts of 2-ethyl-4-methylimidazole was dissolved in 10 parts of butanone, and then added to the above solution. The above composition is fully stirred at room temperature to obtain a uniformly dispersed resin composition. The resin composition was impregnated into NE-type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155°C for 2-10 minutes to remove the solvent to obtain a prepreg with a resin content of about 55%.

[0096] A 1Oz copper foil is coated on both sides of eight overlapping prepregs, and hot-pressed at a temperature of 200°C and a pressure of 3.0MPa for 90min to obt...

Embodiment 2

[0098] 30 parts of methacrylic acid-terminated polyphenylene ether resin (SABIC, trade name: SA9000), 53 parts of acetone solution of brominated bisphenol A type epoxy resin (Dow Chemical, D.E.R.530A80, ​​solid content 80wt%), 5 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB350), 22 parts of biphenyl phenolic resin (Nippon Meiwa Chemical Co., Ltd., MEH-7851H), 0.05 parts of 2-ethyl-4 methylimidazole, 1.3 parts Mix cumene peroxide DCP and 60 parts toluene and dissolve completely. The above composition is fully stirred at room temperature to obtain a uniformly dispersed resin composition. The resin composition was impregnated into NE-type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155°C for 2-10 minutes to remove the solvent to obtain a prepreg with a resin content of about 55%.

[0099] A 1Oz copper foil is coated on both sides of eight overlapping prepregs, and hot-pressed at a temperature of 190°C and a pressure of 3.0MP...

Embodiment 3

[0101] 70 parts of methacrylic acid-terminated polyphenylene ether resin (SABIC, trade name: SA9000), 28 parts of tetrabromobisphenol A epoxy resin (Changchun Artificial Resin Factory, BEB400), 12 parts of anhydride curing agent styrene- Maleic anhydride copolymer (Sartomer, SMA EF40), 10 parts of 2,6-glycidylphenyl allyl ether (commercially available reagent), 3 parts of cumene peroxide DCP and 70 parts of toluene were mixed and completely dissolved . 0.2 parts of 2-ethyl-4-methylimidazole was dissolved in 10 parts of butanone, and then added to the above solution. The above composition is fully stirred at room temperature to obtain a uniformly dispersed resin composition. The resin composition was impregnated into NE-type glass fiber cloth (Nittobo Co., Ltd., NEA2116), and dried at 155°C for 2-10 minutes to remove the solvent to obtain a prepreg with a resin content of about 55%.

[0102] A 1Oz copper foil is coated on both sides of eight overlapping prepregs, and hot-pres...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a thermosetting resin composition. The thermosetting resin composition comprises (A) polyphenylene ether resin; (B) epoxy resin; (C) a curing agent and (D) an initiating agent. The thermosetting resin composition can also comprise a compound which simultaneously contains an epoxy group and an olefinic bond type unsaturated group, the curing agent, a flame retardant, an accelerant and the like. The thermosetting resin composition has the characteristics of low dielectric constant and dielectric loss, high heat resistance, flame retardance and the like, and is suitable for laminated boards and the like for prepregs and printed circuits.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a prepreg and a printed circuit laminate using the resin composition. Background technique [0002] At present, the electronic and electrical industry is developing rapidly, and the development direction of electronic products is light and thin, high performance, high reliability and environmental protection. The specific requirements of laminates for printed circuits are also manifested in high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. Therefore, traditional epoxy resins cannot fully meet the development needs of printed circuit laminates, and polyphenylene ether resins with high heat resistance, low dielectric constant and dielectric loss, and excellent toughness are used in printed circuit laminates. applications are beco...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L71/12C08L63/00C08L63/02C08L51/08C08F283/08C08F283/10B32B27/04B32B15/08H05K1/03
Inventor 孟运东方克洪
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com