The invention discloses a low-loss resin composition, which is prepared from the following main components in parts by weight: 10 to 90 parts of
acenaphthylene-p-vinylbiphenyl
copolymer, 10 to 70 parts of cross-linking agent, 20 to 60 parts of
elastomer, 0.1 to 3 parts of initiator and 10 to 90 parts of filler. The
acenaphthylene-p-vinylbiphenyl
copolymer is obtained by pre-polymerizing
acenaphthylene and divinylbiphenyl, the acenaphthylene
monomer residue is less, the acenaphthylene
monomer is difficult to volatilize in a resin
system, implosion caused by too fast curing reaction of the resin
system is prevented while good reaction activity is maintained, and a subsequent curing product is high in crosslinking density and good in
heat resistance; a
machining window is wide, and subsequent production and
machining are facilitated; and an acenaphthylene structure has high symmetry and rigidity and does not contain elements such as
oxygen,
sulfur and
nitrogen, so that the resin composition has excellent
dielectric properties and thermal properties and a low
thermal expansion coefficient, and an
elastomer as a cross-linking curing matrix material can provide the characteristics of low
dielectric constant, low
dielectric loss, low water absorption and the like.