Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product

A technology of epoxy resin and phenolic resin, which is applied in the field of epoxy resin, phenolic resin, the manufacture of these, epoxy resin composition and cured product, and can solve the problems of difficult formation of resin composition for transfer molding, low hygroscopicity, viscous Insufficient consideration of directness and other issues

Inactive Publication Date: 2009-09-02
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As low-viscosity epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, etc. are generally widely used. However, among these epoxy resins, those with low viscosity are liquid at room temperature, and it is difficult to form a resin for transfer molding. combination
In addition, these epoxy resins are not sufficient in terms of heat resistance, mechanical strength, and moisture resistance.
[0004] Considering from the above-mentioned background, as the epoxy resin with low hygroscopicity and high heat resistance, biphenyl type epoxy resin (Japanese Unexamined Patent Publication No. 58-39677), bisphenol type epoxy resin (Japanese Unexamined Patent Publication No. 6-39677) have been proposed. 345850 bulletin), but it is not enough to consider the adhesiveness with the metal substrate
In addition, from the viewpoint of improving the adhesiveness, an epoxy resin having a sulfide structure containing sulfur atoms has been proposed (JP-A-6-145300), but the heat resistance is insufficient.
In addition, epoxy resins having a conventionally known sulfonated structure have high heat resistance, but high water absorption and insufficient adhesion

Method used

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  • Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product
  • Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product
  • Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] 200 g (1.0 mol) of bisphenol F (manufactured by Honshu Chemical Co., Ltd., 4,4' body (31%), 2,4' body (49%), 2,2' body (20%)) was charged in a 1L flask, and the temperature was raised. to 175°C. After melting, 0.1 g of p-toluenesulfonic acid was added with stirring, and 232 g (2.0 moles) of indene was added dropwise at 175° C. over about 3 hours. The reaction was continued for another 3 hours under reflux. Then, low boiling point components were removed under reduced pressure to obtain 413 g of an indene-added phenolic resin (phenolic resin A). The OH equivalent is 216 g / eq., the softening point is 78°C, and the melt viscosity at 150°C is 0.06 Pa·s.

Embodiment 2

[0064] 200 g (1.0 mol) of bisphenol F was charged in a 1 L flask, and the temperature was raised to 175°C. After melting, 0.15 g of p-toluenesulfonic acid was added with stirring, and 348 g (3.0 moles) of indene was added dropwise at 175° C. over about 3 hours. Then, low boiling point components were removed under reduced pressure to obtain 527 g of an indene-added phenolic resin (phenolic resin B). The OH equivalent is 274 g / eq., the softening point is 86°C, and the melt viscosity at 150°C is 0.15 Pa·s.

Embodiment 3

[0066] 200 g (1.0 mol) of bisphenol F was charged in a 1 L flask, and the temperature was raised to 180°C. After melting, 0.04 g of p-toluenesulfonic acid was added while stirring, and 304 g (2.0 moles) of acenaphthylene was added dropwise at 180° C. over about 3 hours. Then, the temperature was raised to 200° C. under reduced pressure, and low boiling point components were removed to obtain 491 g of acenaphthylene-added phenolic resin (phenolic resin C). The OH equivalent is 252 g / eq., the softening point is 99°C, and the melt viscosity at 150°C is 0.59 Pa·s.

[0067] In addition, the reaction rate of indene in Examples 1-3 was about 100%.

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Abstract

Disclosed is an epoxy resin having excellent fluidity and high filler filling property, which provides a cured product excellent in moisture resistance, heat resistance and flame retardance. This epoxy resin is suitable for sealing of electronic components and uses as circuit board materials. Also disclosed is a composition of such an epoxy resin. Specifically disclosed is an epoxy resin represented by the general formula (3) below, which is obtained by reacting epichlorohydrin with a phenol resin which is obtained by reacting 0.2-6.0 moles of indene or acenaphthylene with 1 mole of a bisphenol compound represented by the general formula (2) below. (In the formulae, X represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -CO-, -O-, -S- or -SO2-; and R1-R4 independently represent a hydrogen atom or a substituent derived from indene or acenaphthylene).

Description

technical field [0001] The present invention relates to an epoxy resin that is excellent in low viscosity and provides a cured product that is also excellent in moisture resistance, heat resistance, flame retardancy, etc., a phenolic resin suitable as an intermediate thereof, a method for producing these, and an epoxy resin using the same Epoxy resin compositions and cured products of epoxy resins are suitable for use as insulating materials in electrical and electronic fields such as semiconductor sealing and printed wiring boards. Background technique [0002] In sealing materials for semiconductors, resin compositions mainly composed of epoxy resins are widely used, and the method of mounting components on printed wiring boards is advancing from the conventional plug-in type to the surface mount type. In the surface mount method, all the components are heated to the solder temperature, and the volume expands rapidly due to moisture absorption, causing cracks in the compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/30C08G59/06
CPCC08G59/302C08G59/245H05K1/0326C08G59/063H01L23/293H01L2924/0002H01L2924/00C08G8/30C08G59/06C08J5/00C08L63/00
Inventor 中原和彦梶正史
Owner NIPPON STEEL CHEMICAL CO LTD
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