81results about How to "Reduce signal transmission loss" patented technology

A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality of electrode pads and optical active areas are formed on the active surfaces of the optoelectronic components; a dielectric layer formed on a surface of the carrier board and the active surface of the optoelectronic components, wherein a plurality of vias for exposing the electrode pads and two holes for exposing the optical active areas are formed in the dielectric layer; a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads of the optoelectronic components; an insulating protecting layer formed on the dielectric layer and the circuit layer; and at least one optical transmission element formed on a surface of the insulating protecting layer.

The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board comprises a medium substrate and a transmission line, wherein the medium substrate is made of a prepreg with thickness larger than a set value, the transmission line is formed on the prepreg, a windowed solder mask is formed on the medium substrate at the position of the transmission line. By utilizing the technical scheme, the signal transmission loss can be reduced, the board cost can be reduced, the manufacturing process can be simplified and the production cost is lowered further.

A ceiling-mount omnidirectional antenna for indoor distribution system of mobile communication network and a method for manufacturing the same are provided. The antenna includes: a monopole consisting of a cone part and a columnar part; a reflecting plate consisting of a cone part and a platform part; and a feed connector. The monopole and the reflecting plate are arranged in such that the tips of cone parts are opposite to each other. The signal is fed into the antenna through the feed connector and radiated outward by the monopole and the reflecting plate. In high frequency band, the maximal gain appears at about 70°, so that the signal power focuses at radiating angles of 60°˜85°. Comparing to the existing antenna, the gain of the antenna increases 4.22 dB at a radiating angle of 85° and decreases 10 dB at a radiating angle of 30°. So, the maximal permissible value of antenna aperture power of mobile communication signal in high frequency band, such as 3G, is increased; and the field strength of signal covering the edge is increased. The antenna can increase the covering range of a single antenna, increase the signal quality, and cover 2G and 3G networks in the same time so as to reduce the difficulty and the cost for building and reconstructing an indoor distribution system in 3G.

Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.

The invention relates to an acousto-optic adjustable light filter with broadband, which comprises an acousto-optic medium, wherein the acousto-optic medium is installed on a base; at least two transducers are installed on the surface of the acousto-optic medium; the surface of each transducer is plated with a surface electrode; each surface electrode is respectively connected with a matching network; the matching network is connected with a high-frequency socket; all the transducers are installed on the same surface of the acousto-optic medium through a linking layer; and the thicknesses of the transducers with each surface electrode are different. Because the two transducers are installed on the same side of the acousto-optic medium, the problem that the clamp is easy to damage the transducer which is installed in the front when the transducers are installed on the two surfaces of the traditional acousto-optic medium, thereby enhancing the finished product rate of products; and the transducers with different thicknesses drive the radio frequency signals with different frequencies, thereby obtaining the diffraction light with different wavelengths.

A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.

A high-frequency-signal switching circuit includes a first high-frequency-signal path which includes first and second diodes connected in series with a high-frequency amplifier stage therebetween, and a second high-frequency-signal path formed of a third diode connected in parallel to the first high-frequency-signal path. A switching-voltage supply section switches the high-frequency amplifier stage and first and second diodes ON, and the third diode OFF, so that a high-frequency signal is transferred through the first high-frequency-signal path, or switches the high-frequency amplifier stage and first and second diodes OFF and the third diode ON, so that a high-frequency signal is transferred through the second high-frequency-signal path.

An antenna device includes an antenna element including a dielectric substrate including a first principal surface and a second principal surface, a built-in feed line provided on the first principal surface of the dielectric substrate, and a radiating element provided on the second principal surface of the dielectric substrate and along the built-in feed line so that the radiating element is fed from the built-in feed line, a triplate line including a first outer conductor and a second outer conductor parallel to each other, and a central conductor arranged therebetween to feed excitation power to the antenna element, a connecting member which electrically connects the central conductor and the built-in feed line, a projecting piece from one end of the dielectric substrate toward the second outer conductor, and a first hole and a second hole provided in the first outer conductor and in communication with each other. The first hole includes a first opposite surface to the connecting member with a specified space therebetween. The projecting piece is inserted in the second hole. The second hole includes an opposite regulating surface to the first principal surface of the projecting piece of the dielectric substrate, to regulate movement of the dielectric substrate toward the first opposite surface.

The invention discloses a device internally including a plurality of isolated temperature control detection units. The device comprises a plurality of isolated temperature control detection units, a feedback signal selecting device, an output voltage control device, and a voltage adjuster. The isolated temperature control detection units are arranged at a plurality of positions, so as to conduct the temperature monitoring detection and integrate the monitored and detected temperature data with a signal, thereby enabling the signals of the isolated temperature control detection units, such as (T1) and (T2)...(TN), to be converted into output signals containing temperature information, such as (F1) and (F2)... (FN); the feedback signal selecting device is used for receiving the signals, (F1) and (F2)...(FN), which are output by the isolated temperature control detection units, and choosing a signal with the maximum temperature from the signals, such as (F1) and (F2)... (FN), to be output; the output voltage control device is used for receiving the signal with maximum temperature output by the signal selecting device and a voltage feedback signal, and outputting a control signal; and the voltage adjuster is used for receiving the control signal output by the output voltage control device and outputting a voltage used for controlling the speed of the fan.

A transmission device for a near field communication (NFC) device includes a matching circuit, a connecting interface with a first width for connecting an operating circuit of the NFC device, a first transmission line electrically connected between an antenna of the NFC device and the matching circuit, and a second transmission line electrically connected between connecting interface and the matching circuit, including an increasing width portion and a constant width portion, wherein a width of the second transmission increases from the first width to a second width within the increasing width portion and keeps the second width within the constant width portion, wherein the second width is greater than and related to the first width.

The invention discloses a CMOS three-port amplifier applied to a TR assembly. The CMOS three-port amplifier comprises a driving amplifier and a low noise amplifier, the output end of the driving amplifier is directly connected with the input end of the low noise amplifier, during forward working, an input signal is connected with the input end of the driving amplifier and output by a common port,and during backward working, the input signal is connected with the common port and output by the output end of the low noise amplifier. The CMOS three-port amplifier has the advantages that receive-send switching is achieved without an additional receive-send switch, and impedance matching of the common port is achieved.

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board including an adhesive promoter interposed between an insulating layer and a circuit layer on a substrate in order to improve adhesion therebetween; and a first metal layer formed between the adhesive promoter and the circuit layer has high adhesion between an insulating layer such as a resin and a circuit while having low roughness by including a polymer adhesive promoter, easily forms a fine circuit and has low signal transmission loss due to low roughness, and has high reliability due to the high adhesion.

The invention relates to a CMOS (Complementary Metal-Oxide-Semiconductor Transistor) contact type fluorescent homogeneous assay array sensing chip which comprises a chip body, wherein the chip body comprises a silicon gel substrate, an SU-8 thick adhesive, a signal processing circuit, a photoelectric sensing array, an active preprocessing amplifying array and an asynchronous time sequence control circuit; the SU-8 thick adhesive is fixed on the upper surface of the silicon substrate, at least one florescent reaction pool group is arranged on the SU-8 thick adhesive, each florescent reaction pool group comprises at least one micro-reaction pool, and the signal processing circuit, the photoelectric sensing array, the active preprocessing amplifying array and the asynchronous time sequence control circuit are correspondingly laid on the silicon gel substrate positioned just below the florescent reaction pool group; the signal output end of the signal processing circuit is connected with a pressure welding block. The CMOS contact type fluorescent homogeneous assay array sensing chip has the beneficial effects that a photoelectric PN junction diode is capable of converting fluorescent into a photoelectric current; the photoelectric PN junction diode is integrated with the active signal processing circuit monolithically, thus the signal transmission loss is reduced, and the detection microminiaturization is realized; the micro-reaction pool is capable of detecting one sample or simultaneously detecting a plurality of samples.

A flexible circuit board comprises a substrate layer, a first conducting circuit layer, a second conducting circuit layer, a plurality of conducting holes, a sensitive film and an anti-electromagnetic interference layer. The first conducting circuit layer and the second conducting circuit layer are formed on opposite sides of the substrate layer respectively. The plurality of conducting holes are electrically connected with the first conducting circuit layer and the second conducting circuit layer. The sensitive film is formed on the surface of the first conducting circuit layer. The anti-electromagnetic interference layer is formed on the surface of the sensitive film. The first conducting circuit layer includes at least one linear signal line, the sensitive film is provided with at least one opening, and the linear signal line is located in the opening.

The invention discloses a PCB manufacturing method, which relates to a manufacturing technology of a printed circuit board. The manufacturing method comprises the following steps of: manufacturing aninner layer circuit pattern on a daughter board, pasting a film material on the inner layer circuit pattern, superposing the daughter board with prepregs and other daughter boards, and pressing the daughter board, prepregs and other daughter boards into a multilayer board, forming a slotted hole in the multi-layer board to enable at least one part of the film material laminated on the inner layerto be exposed, and soaking the multilayer board in a liquid medicine, and removing the film material. According to the PCB manufacturing method disclosed in the invention, one surface of the inner layer circuit pattern of the PCB is coated with the dissoluble film material, and the film material is dissolved after lamination, so that the inner layer circuit is located in the built-in cavity to replace a high-loss resin dielectric layer, and the signal transmission loss is reduced; meanwhile, the cavities can be manufactured in different inner layers according to circuit distribution design, diversification of PCB products is facilitated, the PCB is suitable for more product requirements, the peripheries of the cavities are provided with enough supporting design, and the capacity of the cavities for resisting external pressure can be enhanced.