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High-frequency copper-silver mixed conducting circuit structure and manufacturing method thereof

A technology of conductive lines and manufacturing methods, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as large losses, and achieve the effect of reducing signal transmission loss and improving signal transmission efficiency.

Inactive Publication Date: 2017-12-15
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, metal copper is generally used to make conductive lines. This kind of conductive line is suitable for transmitting low-frequency signals, but when used to transmit high-frequency signals, it usually has a large loss.

Method used

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  • High-frequency copper-silver mixed conducting circuit structure and manufacturing method thereof
  • High-frequency copper-silver mixed conducting circuit structure and manufacturing method thereof
  • High-frequency copper-silver mixed conducting circuit structure and manufacturing method thereof

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Embodiment Construction

[0023] The structure of the high-frequency copper-silver hybrid circuit provided by the present invention and its manufacturing method will be further described in detail below with reference to the accompanying drawings and embodiments.

[0024] see Figure 1-7 , the first embodiment of the present invention provides a method for manufacturing a high-frequency copper-silver mixed conductive circuit structure, the steps of which include:

[0025] Step 1: See figure 1 and figure 2 , an insulating substrate 10 is provided, and a silver layer 12 is evaporated on one surface of the insulating substrate 10 . Specifically, under vacuum conditions, the insulating substrate 10 is used as a base material, and metallic silver is set as a target source on the opposite side of the insulating substrate, and the target source is heated at a high temperature to evaporate the metallic silver, so that the metallic silver is deposited on the target source. formed on an insulating substrate ...

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Abstract

The invention discloses a manufacturing method of a high-frequency copper-silver mixed conducting circuit structure. The manufacturing method comprises the steps of: providing an insulating substrate, and evaporating a silver layer on one surface of the insulating substrate; manufacturing and forming copper conductive circuit patterns on the surface of the silver layer; etching to remove the silver layer on the surface of the insulating substrate and between the copper conductive circuit patterns; and forming silver coating layers on the surfaces of the copper conductive circuit patterns, so that the copper conductive circuit patterns are coated by the silver coating layers. The invention further relates to the high-frequency copper-silver mixed conducting circuit structure manufactured by adopting the manufacturing method.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a high-frequency copper-silver mixed conductive circuit structure and a production method thereof. Background technique [0002] With the development of electronic products towards high-frequency, high-speed transmission, and thinner dimensions, there are higher requirements for the design of conductive lines. In the prior art, metal copper is generally used to make conductive lines. Such conductive lines are suitable for transmitting low-frequency signals, but usually have relatively large losses when used for transmitting high-frequency signals. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a high-frequency copper-silver mixed conductive circuit structure capable of solving the above-mentioned technical problems and a high-frequency copper-silver mixed circuit conductive structure manufactured by the manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/06H05K3/24
CPCH05K1/09H05K3/06H05K3/24H05K2203/072H05K2203/0723H05K2201/0391H05K3/108H05K3/244H05K1/0326Y10T29/49155H05K1/0237H05K3/188
Inventor 何明展徐筱婷
Owner AVARY HLDG (SHENZHEN) CO LTD
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