Circuit rotating plate integrating thin film circuit board and spring needle

Abstract

The invention discloses a circuit rotating plate integrating a thin film circuit board and a spring needle. The circuit rotating plate comprises the thin film circuit board, a spring needle plate anda filling material; contacts with the relatively low distribution density on one side of the thin film circuit board are welded with an electric connecting part of the spring needle of the spring needle plate through unit conductors; the filling material is applied to a gap between a film sheet body of the thin film circuit board and a plate body of the spring needle plate, and is solidified and shaped; and the thin film circuit board is enabled to be in a flat state through the solidified filling material. Therefore, when the circuit rotating plate is applied to a probe card for wafer detection, the spring needle part of the spring needle plate of the circuit rotating plate can be directly connected with a relatively low-density circuit board of the probe card, so that the probe card canbe directly applied to the circuit conversion between the relatively low-density circuit board of the probe card and a relatively high-density probe head without assistance of an intermediate connector.

Description

technical field [0001] The present invention relates to a kind of probe card (probe card) used for wafer detection, especially refers to that the probe card is connected to the probe head (probe head), so that the probes in the probe head which are distributed in high density can be connected with In the circuit board of the probe card for wafer inspection, the contacts with low-density distribution are used for electrical connection. The integrated film circuit board and the circuit transfer board of pogo pins. Background technique [0002] The probe card (probe card) currently used in wafer inspection mainly uses the majority of probes in the probe head to form a high-density distribution to perform functional tests on one or more chip units in the wafer. The high-density distribution probes in the head must be electrically connected to the low-density distribution contacts in the circuit board of the wafer inspection probe card. Therefore, in the existing probe card, in a...

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a circuit transfer board integrating a film circuit board and pogo pins, which solves the problem of long signal transmission path and impedance of the existing high-density conversion low-density circuit conversion components connected between the probe head and the circuit board. Too high and signal transmission loss is too large and other issues

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