The invention relates to an adhesive tape encapsulating structure of an organic light emitting diode (OLED). According to the adhesive tape encapsulating structure of the OLED, adhesive tape encapsulation is carried out on the OLED formed by a front electrode, an organic layer, a back electrode and a protection layer, the front electrode, the organic layer and the back electrode are arranged on the upper face of a substrate, the OLED is sealed through adhesive tape which is arranged on the upper face of the OLED and formed by an adhesive sticker and a flexible film strip capable of preventing water vapor and oxygen from passing through, an air barrier layer formed by multilayer films of multilayer thin films made of different materials is further arranged on the upper face or the lower face of the flexible film strip, a layer of filter film can be further arranged on the lower face of the flexible film strip, a sealing rubber ring is arranged on the periphery of the sealing adhesive tape to cover the adhesive tape and the substrate so that air cannot permeate into the OLED from the periphery, and a thin glass sheet or a thin metal sheet can be further arranged on the upper face of the sealing rubber ring to prevent air from entering from the upper face. According to the adhesive tape encapsulating structure of the OLED, due to the fact that the main encapsulating process is the adhesive tape adhering process, the technological process of the adhesive tape encapsulating structure is much simpler relative to a previous method, the production speed can be improved, production cost is lowered, and the adhesive tape encapsulating structure is especially suitable for large-area and large-batch production.