Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

370 results about "Air barrier" patented technology

Air barriers control air leakage into and out of the building envelope. Air barriers are divided into air barrier materials, air barrier accessories, air barrier components, air barrier assemblies and air barrier systems.

Adhesive tape encapsulating structure of organic light emitting diode

The invention relates to an adhesive tape encapsulating structure of an organic light emitting diode (OLED). According to the adhesive tape encapsulating structure of the OLED, adhesive tape encapsulation is carried out on the OLED formed by a front electrode, an organic layer, a back electrode and a protection layer, the front electrode, the organic layer and the back electrode are arranged on the upper face of a substrate, the OLED is sealed through adhesive tape which is arranged on the upper face of the OLED and formed by an adhesive sticker and a flexible film strip capable of preventing water vapor and oxygen from passing through, an air barrier layer formed by multilayer films of multilayer thin films made of different materials is further arranged on the upper face or the lower face of the flexible film strip, a layer of filter film can be further arranged on the lower face of the flexible film strip, a sealing rubber ring is arranged on the periphery of the sealing adhesive tape to cover the adhesive tape and the substrate so that air cannot permeate into the OLED from the periphery, and a thin glass sheet or a thin metal sheet can be further arranged on the upper face of the sealing rubber ring to prevent air from entering from the upper face. According to the adhesive tape encapsulating structure of the OLED, due to the fact that the main encapsulating process is the adhesive tape adhering process, the technological process of the adhesive tape encapsulating structure is much simpler relative to a previous method, the production speed can be improved, production cost is lowered, and the adhesive tape encapsulating structure is especially suitable for large-area and large-batch production.
Owner:SHANGHAI UNIV

Packaging structure of organic light emitting diode

The invention provides a packaging structure of an OLED (organic light emitting diode), which comprises a substrate, an OLED device, an air-barrier film and a metal packaging film, wherein the OLED device is arranged above the substrate; the air-barrier film is positioned above the OLED device; the OLED device is covered with the air-barrier film; the air-barrier film is glued to the substrate by virtue of a seal to form an enclosed space for sealing the OLED device; and the metal packaging film is arranged in a neighbor area where the substrate is glued with the air-barrier film, so that external moisture is prevented from entering the enclosed space. Compared with the prior art, after the air-barrier film is glued with the substrate, the metal packaging film is coated in the seal neighbor area in a sputter or evaporation coating mode at the side edges of the air-barrier film and the seal, the damage of the external moisture to the OLED device is thoroughly isolated by the metal packaging film, the stopping capacity of the packaging structure to the moisture is improved, and moisture absorption layers can be coated on the two sides of the OLED device before the seal is coated, thereby reducing the damage of the moisture in a glue material to the OLED device during coating.
Owner:AU OPTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products