Adhesive tape encapsulating structure of organic light emitting diode

A technology of light-emitting diodes and packaging structures, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of high device cost, complex process, expensive packaging equipment and related materials, etc. Cost, simple process, and the effect of increasing the speed of production

Inactive Publication Date: 2014-07-30
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these methods have been widely used in industry, their disadvantages are that the process is complicated

Method used

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  • Adhesive tape encapsulating structure of organic light emitting diode
  • Adhesive tape encapsulating structure of organic light emitting diode
  • Adhesive tape encapsulating structure of organic light emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, a tape encapsulation structure of an organic light emitting diode has a front electrode 2 with ITO on the glass substrate 1, and includes an organic hole injection layer, an organic hole transport layer, an organic light emitting layer, an organic electron transport layer and The organic layer 3 of the organic electron injection layer, the metal aluminum rear electrode 4 and the protective layer 5 of organic materials are used for tape packaging of the bottom-emitting organic light-emitting diode OLED of the glass substrate 1, and the tape 6 used for the tape packaging of the OLED is a A kind of adhesive tape which is coated with a layer of self-adhesive layer 6-1 under the polyimide flexible film tape 6-2 which has better resistance to the passage of water vapor and oxygen, and a gas barrier layer composed of multi-layer films on the adhesive tape 7 It is composed of a multi-layered thin film consisting of a silicon nitride layer, an aluminum...

Embodiment 2

[0026] Such as figure 2 As shown, the difference from Embodiment 1 is that the gas barrier layer 7 here is between the polyimide flexible film tape 6-2 and the self-adhesive layer 6-1. During the production process of the tape 6, the gas barrier layer 7 is prepared under the polyimide flexible film tape 6-2, and then the self-adhesive layer 6-1 is coated.

Embodiment 3

[0028] Such as image 3 As shown, a tape encapsulation structure of an organic light emitting diode has a front electrode 2 with ITO on the glass substrate 1, and includes an organic hole injection layer, an organic hole transport layer, an organic light emitting layer, an organic electron transport layer and The organic layer 3 of the organic electron injection layer, the metal aluminum rear electrode 4 and the protective layer 5 of the organic material are used for tape encapsulation of the organic light-emitting diode OLED of the bottom emission of the glass substrate, and the tape 6 used for the tape encapsulation of the OLED is a kind of A layer of self-adhesive layer 6-1 is coated under the aluminum foil belt 6-2 with good resistance to water vapor and oxygen passing through, and the adhesive tape 6 is rolled to make the self-adhesive layer 6 under a high-purity inert gas atmosphere. -1 is densely pasted on the OLED device, and the area of ​​the adhesive tape 6 just cove...

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Abstract

The invention relates to an adhesive tape encapsulating structure of an organic light emitting diode (OLED). According to the adhesive tape encapsulating structure of the OLED, adhesive tape encapsulation is carried out on the OLED formed by a front electrode, an organic layer, a back electrode and a protection layer, the front electrode, the organic layer and the back electrode are arranged on the upper face of a substrate, the OLED is sealed through adhesive tape which is arranged on the upper face of the OLED and formed by an adhesive sticker and a flexible film strip capable of preventing water vapor and oxygen from passing through, an air barrier layer formed by multilayer films of multilayer thin films made of different materials is further arranged on the upper face or the lower face of the flexible film strip, a layer of filter film can be further arranged on the lower face of the flexible film strip, a sealing rubber ring is arranged on the periphery of the sealing adhesive tape to cover the adhesive tape and the substrate so that air cannot permeate into the OLED from the periphery, and a thin glass sheet or a thin metal sheet can be further arranged on the upper face of the sealing rubber ring to prevent air from entering from the upper face. According to the adhesive tape encapsulating structure of the OLED, due to the fact that the main encapsulating process is the adhesive tape adhering process, the technological process of the adhesive tape encapsulating structure is much simpler relative to a previous method, the production speed can be improved, production cost is lowered, and the adhesive tape encapsulating structure is especially suitable for large-area and large-batch production.

Description

technical field [0001] The invention relates to a tape packaging structure of an organic light emitting diode, which belongs to the field of flat-panel device packaging. Background technique [0002] At present, the organic light emitting diode (OLED) has developed rapidly and has been widely used in the fields of flat panel display and lighting. But because it is very sensitive to moisture and oxygen, in order to obtain a long enough life, it must be encapsulated to isolate it from the atmosphere and environment. The current main packaging methods are: thin film packaging, which is to prepare colorful organic and inorganic thin films on OLED devices to block the entry of moisture and oxygen. Its patents are such as CN201210057243; airtight packaging, such as using metal back cover or glass back After adding some getters, dehumidifiers and coating ultraviolet sensitive glue (UV glue) on the convex edge around it, in the glove box of high-purity inert gas, after packaging an...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/50
CPCH10K50/844H10K50/84
Inventor 张建华张志林张浩蒋雪茵
Owner SHANGHAI UNIV
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