Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rigid-flex circuit board and manufacturing method thereof

A technology of rigid-flex board and manufacturing method, which is applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit and other directions, can solve the problem of large signal transmission loss of rigid-flex board

Pending Publication Date: 2018-04-20
GUANGZHOU FASTPRINT CIRCUIT TECH +2
View PDF12 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the transmission speed of the transmission signal of the external device is higher, the signal transmission loss of the rigid-flex board is also greater.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical featu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a rigid-flex board and a manufacturing method thereof, the rigid-flex board comprises a first flexible core board, a second flexible core board, a first circuit board and a second circuit board. One side surface of the first circuit board and one side surface of the second circuit board are connected with the first flexible core board, the other side surface of the first circuit board and the other side surface of the second circuit board are connected with the second flexible core board. In the rigid-flex board, regions, corresponding to an interval between the firstcircuit board and the second circuit board, on the first flexible core board and the second flexible core board are the regions which can be bent, thus, a bending function of the rigid-flex board is realized. Moreover, the first flexible core board and the second flexible core board have enough signal transmission lines for conducting electronic elements on the first circuit board and the second circuit board. Moreover, transmission signals of an external device are directly transmitted to the first flexible core board and the second flexible core board at an external surface, thus, the transmission signals are free from producing loss while passing through via holes.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a rigid-flexible circuit board and a production method thereof. Background technique [0002] In the traditional rigid-flexible board, before the step of laminating the rigid core board and the flexible core board, the rigid core board located on the outside is subjected to window opening treatment, and the area corresponding to the flexible core board and the window opening position is the bending area. The rigid core board and the flexible core board are laminated into a rigid-flex board. After lamination, the flexible core is clamped between the rigid cores. The transmission signal of the external equipment is first transmitted to the rigid core board on one side of the surface layer of the rigid-flex board, and then transmitted to the inner flexible core board through the via hole of the rigid-flex board, and the flexible core board transmits the transmissio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/36H05K3/46
CPCH05K1/0216H05K1/147H05K3/361H05K3/4691H05K2201/0723H05K2201/0715
Inventor 林楚涛李艳国陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com