Automatic IC testing and sorting device

Abstract

The invention discloses an automatic IC testing and sorting device. The device comprises a feeding device, a testing device and a sorting and storing device which are arranged on a machine frame; andthe machine frame comprises a first mounting plate and a second mounting plate, wherein the first mounting plate is vertically arranged, and the second mounting plate is connected with the bottom of the first mounting plate and is obliquely arranged. An IC material tube is clamped on the feeding device, IC chips which are not tested in the IC material tube are supplied to the testing device for testing through the feeding device, after the testing is finished, the chips are classified through the sorting and storing device and are stored in a plurality of empty material tubes. According to thedevice, a clamping mechanism with the IC material tube clamped is turned over, so that the IC material tube is changed into a vertical state, and the IC chips in the IC material tube slide out and get to a vertical material channel; the IC chips can be controlled by a blocking and pressing mechanism to be fed to the testing device one by one, testing chucks clamp the IC chips and push the IC chips to a testing PCB for testing, the IC chips are received through a material receiving table after the test is completed and are classified and placed to a first material storing mechanism or a second material storing mechanism, so that the speed of sorting and storing is increased, and the labor cost is saved.

Description

technical field [0001] The invention belongs to the technical field of automation equipment, and in particular relates to an IC testing and sorting equipment. Background technique [0002] IC chip is an integrated circuit formed by a large number of microelectronic components placed on a plastic base to make a chip. The integrated circuit chip must be strictly tested before leaving the factory. The test items include various performance parameters of the integrated circuit chip, such as Current and voltage, etc., people need to screen out the integrated circuit chips whose test results are not within the qualified range, and classify the integrated circuit chips with different test results. There are many packaging methods for IC chips, such as tube packaging types, such packaged as figure 1 As shown: the IC chip 2009 is stored in the tubular IC material tube 1001, and the chips in the material tube need to be taken out one by one for testing during the test; [0003] And ...

AI Technical Summary

Problems solved by technology

[0003] And the feeding mechanism of existing automatic sorting machine, as publication number is the Chinese invention patent of CN106311633A, has announced a kind of integrated circuit chip multi-station serial band marking test sorting device, and its feeding mechanism is arranged by inclination The middle inclined track sends the IC chip into the material track. This structure can easily cause the IC chip to fail to slide out, resulting in material jams and other situations;

[0004] The test of the electrical performance of the chip needs to connect the IC chip to the test system. After the test is completed, the IC chip needs to be classified according to the performance of the test. In the prior art, the receiving mechanism of the sorting equipment is manually loaded with empty materials. Tubes are replaced manually after the material tube is full, but the actual test of sorted IC chips shows that the number of high-quality chips is the largest, so the frequency of replacing empty tubes with high-quality IC chips will be very high, and other empty materials The tube replacement is a long cycle, so if the material tube of the superior chip is still completed manually at this time, it will be very troublesome, affecting the speed of testing and sorting, and wasting human resources

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