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Memory body IC detecting and sorting machine

A memory and sorter technology, applied in the field of memory IC detection and sorting machines, can solve the problems of long waiting time for moving materials, reduce memory IC detection capacity, time consumption, etc. Effect

Active Publication Date: 2009-01-14
HON PRECISION INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because the memory IC is purely used to store data, its functionality is relatively simple, so it is generally tested with multiple memory ICs at the same time; It is not possible to transfer and test multiple memory ICs to be tested at the same time, and only a single memory IC to be tested is carried at a time through the transfer device, which will make the standby time of the entire material transfer too long. If there are multiple test devices If a large-scale memory IC inspection machine is used, the operation and waiting time of each device will be more cumbersome and time-consuming, and it will also greatly reduce the inspection capacity of memory ICs. Therefore, IC inspection and sorting machines are not suitable for performing memory IC inspection operations.

Method used

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  • Memory body IC detecting and sorting machine
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  • Memory body IC detecting and sorting machine

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Embodiment Construction

[0028] Referring to Fig. 3, the memory IC detection and sorting machine of the present invention includes a supply box 21 and an empty box 22 arranged at the front end of the machine 20, and a plurality of receiving boxes 23A arranged at the front and rear ends of the machine 20. , 23B, 23C, 23D and a transportable material receiving box 24, the test device 25 located at the rear end of the machine platform 20, the first carrier device 26 and the second carrier device 27 located at the front end and side ends of the test device 25, and The first material shifting device 28 that moves between the supply box 21, the empty box 22 and the first carrier device 26, and the second carrier device 27, the receiving box 23A, 23B, 23C, 23D and the moving type receiving device are moved. The second material shifting device 29 between the magazine 24; the described feeding magazine 21 is used to bear the memory IC to be tested, and the empty magazine 22 can receive the empty feeding tray us...

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PUM

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Abstract

The invention discloses a memory IC testing and classifying device, comprising a feeding box, an empty box, at least one receiving box and a transfer device arranged at the front end of the machine platform, and at least one testing device, a second transfer device and a removal receiving box arranged at the rear end of the machine platform, as well as a first material-moving device and a second material-moving device arranged among the feeding box, the receiving box and the testing box; the feeding box and the receiving box are used to hold the memory ICs to be tested / tested respectively; the testing device is a test circuit board provided with a plurality of test sheath seats; the first material-moving device transfers more than one memory IC to be tested in the feeding box to the firsttransferring device; the first transferring device is capable to preheat the held memory ICs to be tested, and make displacement movement to ensure the testing device to take materials at different positions. The invention is capable to transfer and test a plurality of memory ICs simultaneously, thereby, the testing capability is largely enhanced and the service efficiency of each device is improved effectively.

Description

technical field [0001] The invention relates to an IC detection and classification machine, in particular to a memory IC detection and classification machine. Background technique [0002] Nowadays, the ICs of semiconductor components are roughly divided into different types such as logic ICs, memory ICs, analog ICs, and micro-component ICs. Taking logic ICs as an example, they are applied to the central processing unit on the motherboard to be responsible for the central processing unit. Signal conversion or transmission of other peripheral components, as well as calculation operations, its functionality is more complicated, while the memory IC is simply used to store data and installed on the module circuit board, and the module circuit board is then assembled on the On the motherboard, its functionality is relatively simple, but no matter what type of IC, after the production is completed, it must go through a test operation to eliminate defective products and ensure prod...

Claims

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Application Information

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IPC IPC(8): B07C5/344B07C5/38G01R31/28
Inventor 张原龙郑欣祥
Owner HON PRECISION INC
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