The present invention provides an
analysis method for safety boundary performance degradation of single-particle irradiated
silicon carbide power MOSFETs, and relates to a method for determining the safety boundary performance of a
silicon carbide power device, in order to solve the problem that the safety boundary of single-
particle irradiation of the SiC type power device cannot be accurately obtained at present. The technical scheme provided by the present invention is characterized in that: a ground single-
particle irradiation silicon carbide power device is used to obtain
test data of a single-particle
burnout or gate-through effect of the device; and each pair of
test data values are drawn in a
reverse bias voltage and electrical parameter performance numerical coordinate
system, thepoints corresponding to the minimum
reverse bias voltage and the electrical parameter value when the single-particle
burnout or the gate-through effect occurs are marked, and the points correspondingto the maximum
reverse bias voltage and the electrical parameter value when the single-particle
burnout or the gate-through effect does not occurs are marked, so as to determine the charge collectionregion, the electrical parameter value increase region, and the device breakdown burned region. The technical scheme provided by the present invention is used for determining the safety boundary performance of a
silicon carbide power device.