Method and system for detection and fault positioning of SoC chip through laser simulation single particle irradiation

Abstract

The invention provides a method and system for detection and fault positioning of a SoC chip through laser simulation single particle irradiation. The method comprises the following steps of (1) performing hollowed-out processing on a test area of a to-be-tested chip; (2) if dynamic testing is carried out, selecting a function testing program of a certain module, starting function testing, and outputting a testing result; (3) if static testing is carried out, bypassing a PLL clock, stopping clock signal input, and detecting a circuit state through the current change; and (4) if reset state testing is carried out, connecting a reset pin to the ground, enabling the SOC chip to be continuously in a reset state through a reset circuit, and detecting the circuit state by observing the current change and a phase-locked loop frequency waveform. According to the method and system, the influence of larger laser spots on a non-test area is avoided, and the comprehensiveness and the accuracy of SOC chip testing are improved.

Description

technical field [0001] The invention relates to the field of single event effect test technology and methods, in particular to methods for testing and detecting devices such as SoC chips by irradiating laser simulated single event effects, finding problems and finding and locating faults. Background technique [0002] Spacecraft are exposed to high-energy particles such as galactic cosmic rays, solar cosmic rays, Earth radiation belt particles, and atmospheric neutrons in outer space. Single event effects are prone to occur when devices are irradiated by high-energy particles. With the continuous improvement of chip manufacturing technology and integration, the feature size of semiconductor devices continues to shrink, and integrated circuits are becoming more and more sensitive to space radiation effects. Carrying out the research and analysis of the single event effect of aerospace electronic devices is of great significance for improving the stability of spacecraft opera...

AI Technical Summary

Problems solved by technology

However, due to the large laser spot, it is easy to cause the problem of multi-bit flipping, which will make the flipping section of the chip too large, which is not conducive to truly reflecting the flipping characteristics of the chip; moreover, most of the lasers are pulsed lasers, and the laser frequency and the step distance of the mechanical translation stage need to be coordinated with each other. Otherwise, repeated irradiation or missed irradiation may occur

Images