647 results about "Thermal simulation" patented technology

The invention relates to the technical field of chip heat management, and discloses a chip heat distribution prediction modeling method and device, and the method comprises the steps: obtaining chip design information, carrying out the three-dimensional grid division through a pre-training transfer learning neural network, and constructing an electricity-heat-force multi-physics field coupling model; the method comprises the following steps: monitoring operation load data in real time, carrying out thermal simulation and generating a temperature distribution characteristic matrix, collecting data through a temperature sensor array, simulating thermal diffusion by using particle filtering and Bayesian inference, compressing and reconstructing the temperature distribution characteristic matrix by using a variational auto-encoder, generating a digital twinborn body, and optimizing a heat dissipation strategy by using deep reinforcement learning. The temperature control strategy is generated, the chip heat management precision is improved, the heat dissipation strategy is optimized, the performance and stability are improved, and the problem of insufficient prediction of temperature distribution in a traditional heat management scheme in the prior art is solved.

The invention discloses an equipment temperature adjusting method fusing a long short-term memory network, and particularly relates to the technical field of temperature control, which comprises the following steps: determining the deployment position of a sensor through thermal simulation, collecting multi-source heterogeneous data, dynamically adjusting the sampling frequency in combination with the temperature and the load current change rate, and adjusting the temperature of the sensor; after data preprocessing, an attention mechanism enhanced LSTM prediction model is constructed, a time sequence sample data set is divided according to equipment thermal response characteristics, training is carried out, and an optimal model is obtained through early stop mechanism optimization; predictive feedback double-closed-loop regulation and control is achieved based on the optimal model, outer loop PI control is combined with an integral separation mechanism to generate a basic control quantity, an inner loop outputs a correction quantity through fuzzification, reasoning and defuzzification, an actuator is driven after superposition, and safety linkage is triggered synchronously; constructing an incremental data buffer pool to screen effective samples, and adaptively updating model parameters by adopting a layered fine tuning strategy; the temperature regulation and control precision and the long-term self-adaptive capability are obviously improved, and the over-temperature risk of equipment is reduced.

A grading evaluation method for high-maturity gas source rock based on hydrocarbon generation and expulsion simulation includes: establishing a change curve of hydrocarbon generation yield based on a hydrocarbon generation thermal simulation experiment; establishing a change curve of hydrocarbon expulsion of source rocks based on a principle of material balance; determining a classification boundary of source rocks based on the change curve of hydrocarbon generation yield and the change curve of hydrocarbon expulsion of source rocks; and obtaining a spatial distribution of different types of source rocks by combining logging interpretation according to the classification boundary of source rocks. In the method, the evaluation model and change curve of hydrocarbon generation yield, retained gas volume and hydrocarbon expulsion volume of source rock are established, and the classification standard of gas source rock at different maturity stages is determined by combining the change curve of hydrocarbon expulsion efficiency under different maturities.

The invention relates to the technical field of electric vehicle power battery thermal management, and discloses a temperature change-based power battery thermal management system, which comprises a thermal simulation pre-judgment end, a sensor network end, a dynamic liquid cooling control end, a BMS decision end and a fault diagnosis module, aiming at the technical defects of out-of-control temperature difference, response hysteresis and leakage risk caused by static flow channel design of the existing liquid cooling system, breakthrough is realized through a three-dimensional technical architecture: a CFD (Computational Fluid Dynamics) prejudgment layer: automatically calibrating sensor distribution points based on temperature field standard deviation, and improving temperature difference identification precision; according to the dynamic valve control layer, an electromagnetic three-way reversing valve is adopted to execute a directional temperature control strategy, an edge battery cell is preferentially introduced under the low-temperature working condition, and heat dissipation is enhanced under the high-temperature working condition; according to the redundant safety layer, the valve body and the pipeline are integrally formed, the leakage rate is reduced, and flow maintenance under single-point failure is achieved through a double-water-inlet parallel pump source. The method has the effects of improving the convergence speed of temperature difference between modules, reducing the attenuation rate of battery life and reducing the risk probability of thermal runaway.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention discloses a chip packaging design optimization method and device, a storage medium and electronic equipment. The method comprises the steps that circuit and material parameter information, packaging parameter information and chip heat management parameter information are acquired; and performing thermal simulation and stress action simulation based on the circuit and material parameter information, the packaging parameter information, the chip thermal management parameter information and the actual function yield of the chip, so as to determine a circuit wiring design, a pin position and a target lamination or arrangement position of the chip according to simulation results of thermal simulation and stress simulation. According to the optimization method provided by the invention, the reliability and the quality of chip packaging can be improved.

The invention discloses an intelligent optimization decision-making method and system for an oilfield water injection system, and belongs to the technical field of oilfield development engineering. The method comprises the following steps: constructing a pipe network digital twinborn model and carrying out actual measurement verification; executing hydraulic-thermal simulation based on the model to generate a pressure-flow map; optimizing water distribution in combination with an injection allocation scheme and matching a pump set combination; generating a control instruction and executing a pressurization scheme; monitoring the state of the pipe network in real time and correcting model parameters. Through the digital twin technology and the differential evolution algorithm, global optimization decision of water distribution and pump set combination of the water injection system is achieved, and the problems that a traditional system is high in energy consumption and low in efficiency are solved.

Disclosed in the present invention are an intelligent liquid cooling plate optimization method and apparatus based on CFD numerical simulation. The method comprises: first, establishing a 3D battery pack model on the basis of liquid cooling plate design parameters and other component design parameters; then, on the basis of the 3D battery pack model, performing thermal simulation modeling and thermal simulation calculation on a battery pack; on the basis of a thermal simulation result, using a particle swarm multi-objective optimization algorithm to optimally calculate locally optimal solutions of the liquid cooling plate design parameters, and determining whether the locally optimal solutions converge; and using a loop iteration mode to calculate the locally optimal solutions of the liquid cooling plate design parameters until the locally optimal solutions converge, and then obtaining globally optimal solutions. Three-dimensional CAD software, CFD simulation software and an optimization interface are interconnected to each other, so that the operation of the whole process of design, simulation and optimization of a liquid cooling plate can be completely and intelligently realized simply by means of inputting key design parameters of the liquid cooling plate in an initial design stage; and an optimal design scheme is obtained by means of implanting the particle swarm multi-objective optimization algorithm. The present invention achieves a high speed and high efficiency.

The invention discloses an electromechanical composite transmission IGBT junction temperature prediction method based on a NODE reduced-order model. A thermal simulation model is constructed according to a real physical model mechanism, a material and a thermal transfer principle of an IGBT; in the constructed thermal simulation model, performing simulation calculation according to the monitored time sequence data to obtain the junction temperature of the IGBT corresponding to the time change, jointly establishing a data set for training and testing with the monitored data, establishing a NODE neural network order reduction model comprising an input layer, a hidden layer and an output layer, and training the NODE neural network order reduction model by using the data set; and inputting the IGBT related time sequence data into the constructed NODE neural network reduced-order model for prediction to obtain the time sequence data of the junction temperature. According to the method, the IGBT junction temperature can be predicted in real time, the calculation efficiency is high, the interpretability is high, the long-term dependence problem can be better solved, and the method is suitable for complex working conditions.

The invention provides a method for obtaining the optimal low-temperature impact toughness and a welded body, and the method comprises the following steps: S1, obtaining chemical components of sample steel, and calculating the cooling rate corresponding to the bainite phase change curve nose tip temperature of the sample steel; s2, the cooling rate serves as the key cooling rate of the welding heat cycle process, and the corresponding welding heat input amount is calculated; s3, cutting a plurality of cuboid thermal simulation initial samples of which the length directions are parallel to the rolling direction of the steel plate from the sample steel; s4, two-pass welding thermal simulation cycle experiments at different temperatures are set; s5, two thermocouples are welded to the center of the cuboid thermal simulation initial sample for temperature measurement, and a welding simulation experiment is completed; and S6, size machining is conducted on the welding sample, a low-temperature impact experiment is conducted, impact energy under different technologies is measured, and the optimal impact toughness of CGHAZ and ICCGHAZ is determined. The method can be used for developing and optimizing the welding process with insufficient low-temperature impact toughness of the submerged-arc welding heat affected zone of the low alloy steel.

The invention relates to an intelligent thermal simulation method for a monolithic three-dimensional integrated chip, belongs to the technical field of monolithic three-dimensional integrated chips, and solves the problems of long thermal simulation period and large operation memory space in the prior art. The thermal simulation method comprises the following steps: layering a monolithic three-dimensional integrated chip, and constructing a coordinate system of the monolithic three-dimensional integrated chip and physical equivalent information of each layer; measuring and acquiring a plurality of training samples; measuring the coordinate points of the heat source and the power of each heat source coordinate point at different time points to form heat source power data; according to the plurality of training samples, in combination with the physical equivalent information and the heat source power data of each layer, training a physical neural network (PINN) to obtain a thermal simulation model of the monolithic three-dimensional integrated chip; and inputting all the coordinate points of the monolithic three-dimensional integrated chip and all the prediction time points of each coordinate point into the thermal simulation model to obtain the prediction temperature of each coordinate point at each prediction time point. And rapid thermal simulation of the monolithic three-dimensional integrated chip is realized.

The invention discloses a medium-deep buried pipe heat pump system capacity configuration design method, which comprises the following steps of: acquiring short-term heat exchange test data and heat exchange theoretical data of a medium-deep buried pipe, and performing data inversion to obtain comprehensive thermophysical parameters of a rock-soil body; building a building heat load prediction model according to the historical heat load, the historical state data and the building information to obtain a predicted heat load, determining a heat supply mode according to the predicted heat load, and performing dynamic heat supply simulation by adopting a long-term heat exchange model of the medium-deep buried pipe heat pump system to obtain configuration operation data, and optimizing the medium-deep layer buried pipe heat pump system long-term heat exchange model according to the configuration operation data, and outputting project system capacity configuration by the optimized medium-deep layer buried pipe heat pump system long-term heat exchange model. According to the method, the precision and efficiency of capacity configuration of the medium-deep buried pipe heat pump system can be improved, meanwhile, good interpretability is achieved, and the method has great significance in reducing the construction cost, saving energy and reducing emission.

The invention provides a thermal simulation analysis method, device and equipment for PCB design and a storage medium, and the method comprises the steps: obtaining a finite element model of a PCB, the finite element model being obtained through modeling according to the electrical parameters of components, the typesetting parameters of the components and the structural layout parameters of a substrate; controlling the finite element model to operate under a preset power load to obtain a simulation heat diagram of the finite element model; partially hiding the finite element model to respectively obtain a component plane graph and a substrate plane graph; inputting the component planar graph into a preset image recognition model to obtain a first annotation graph, and inputting the substrate planar graph into the preset image recognition model to obtain a second annotation graph; and inputting the simulation heat map, the first annotation map and the second annotation map into a preset image scoring model, annotating a thermal anomaly region and thermal anomaly information, and using the thermal anomaly region and the thermal anomaly information to guide optimization of a finite element model.

The invention relates to a thermal simulation numerical simulation method of a multi-physics field architecture with CFD as a core, and belongs to the technical field of cross of computational fluid mechanics and heat transfer science. The method comprises the following steps: constructing a geometry and a conformal / non-conformal grid, presetting a model library, establishing association between a region and a physical field through physical group division, confirming a boundary and initial parameters, and screening a core simulation model; dividing an independent control volume based on a core numerical model, converting an area component and a volume component through integral operation, discretizing a boundary flux to construct a parameter matrix, then solving an equation set, and synchronously optimizing the grid quality; calculating a boundary flux and matching a discrete format, a turbulence model and a corresponding multi-physical field coupling model; original data are screened and processed, and cloud picture results such as temperature and flow field are generated through visualization. Accurate simulation of a multi-physics coupling scene is achieved, the precision and stability of thermal simulation under complex working conditions are improved, and efficient and reliable technical support is provided for engineering design optimization and performance evaluation.

The invention discloses a flood lake wetland heat flux simulation method in a watershed hydrological model, and relates to the technical field of heat flux simulation, and the method comprises the following steps: dispersing a watershed space into a slope river channel and a lake wetland, simulating the water movement of a slope river channel unit, and simulating the water movement of the lake wetland; the method comprises the following steps: simulating surface energy exchange for a lake wetland unit on the basis of simulating a hydrological process, simulating land hydrology and lake inflow runoff of a sub-basin by adopting a grid-based distributed hydrological model, respectively dividing simulation grid units for a slope river channel and a lake wetland, establishing evapotranspiration, infiltration and surface runoff models, and establishing an evapotranspiration, infiltration and surface runoff model; a two-dimensional shallow water equation is used for processing slope confluence, a one-dimensional hydrodynamic model is used for calculating river channel confluence, a lake water quantity balance model is established for calculating the lake water level, the lake submerging process is simulated, and the lake wetland distributed heat flux process is simulated. And the technical blank of flooding wetland hydrothermal simulation is filled.

The invention provides a thermal simulation processing method, device and equipment for a printed circuit board and a storage medium, and relates to the technical field of simulation processing, and the method comprises the steps: building an electronic equipment geometric model, dividing the electronic equipment geometric model into a plurality of tetrahedron units, setting material parameters, and generating an electronic equipment grid model; rasterizing a pre-established geometric model of the printed circuit board to obtain a plurality of grid subunits, and calculating equivalent material parameters of each grid subunit according to actual circuit data of the printed circuit board; screening out a plurality of first tetrahedron units in the electronic equipment grid model; mapping the first tetrahedron units to corresponding positions in the rasterized model to obtain equivalent material parameters of each first tetrahedron unit; updating material parameters of a printed circuit board area in the electronic equipment grid model; and performing thermal simulation processing, and drawing a temperature distribution diagram of the printed circuit board. According to the invention, high-precision temperature distribution of the printed circuit board can be obtained.

The invention discloses a finite element analysis simulation and neural network prediction-based component one-dimensional simulation calculation method and system, relates to the technical field of one-dimensional simulation, and is used for solving the technical problems of large calculation amount and low simulation efficiency of the existing three-dimensional simulation technology. The component one-dimensional simulation calculation method based on finite element analysis simulation and neural network prediction comprises the steps that a first heterogeneous system is determined; establishing a three-dimensional geometric model of each component by using COMSOL software; performing thermal simulation on each component by using COMSOL software to obtain three-dimensional simulation data of each component; training a neural network by taking the three-dimensional simulation data as a data set for training the neural network; after training is finished, a neural network prediction model is obtained; inputting simulation data of a to-be-calculated component into the neural network prediction model, and outputting characteristic parameters of the corresponding component by the neural network prediction model; and inputting the characteristic parameters into a one-dimensional simulation platform, and carrying out component calculation by the one-dimensional simulation platform according to the characteristic parameters.

The invention relates to the technical field of data simulation processing, in particular to a thermal simulation method and system for a circuit board and a medium. The method comprises the following steps: acquiring circuit board layer data; extracting board layer material thermal resistance parameters of the circuit board layer data, wherein the board layer material thermal resistance parameters comprise copper foil thermal resistance parameters and insulating medium thermal resistance parameters; identifying the layered structure of the circuit board layer data, and recording as layered structure data; component layout characteristics are determined according to the layered structure data, interlayer thermal resistance distribution calculation is carried out on the board layer material thermal resistance parameters based on the component layout characteristics, and layered structure thermal resistance distribution data are generated. Through a data processing technology and an analogue simulation technology, heat transfer interaction analysis is carried out on the copper foil layer and the insulating medium layer of the circuit board, and the heat transfer direction and the heat accumulation effect of the circuit board are evaluated so as to construct a heat simulation model of the circuit board.

The invention relates to the technical field of computer simulation, in particular to a thermal simulation method and system for a semiconductor power assembly. The method comprises the following steps: obtaining geometric structures, material attributes and working characteristics corresponding to each semiconductor power assembly, and carrying out finite element simulation modeling to generate a finite element model of each semiconductor power assembly; performing heat source distribution response analysis on the finite element model of each semiconductor power component based on the working characteristics to generate corresponding heat source distribution fields of each semiconductor power component under different working conditions; based on material attributes, heat conduction simulation analysis is carried out on heat source distribution fields corresponding to the semiconductor power assemblies under different working conditions, and a semiconductor assembly electrical model is constructed to carry out electric heat distribution influence evaluation calculation and thermal simulation iterative optimization; and generating a heat flow temperature distribution simulation optimization result among the semiconductor power components. The thermal simulation precision corresponding to the semiconductor power assembly can be improved.

The invention relates to a core particle thermal simulation finite element mesh generation method based on a neural network. The method comprises a geometric and thermal feature extraction module, a temperature distribution prediction module and an intelligent grid optimization module. The geometric and thermal feature extraction module realizes accurate prediction of chip temperature distribution through tensor construction in combination with multi-scale convolution, pyramid pooling and deformable convolution; the intelligent grid optimization module adaptively optimizes a finite element grid through coupling of thermal gradient and geometric constraint, reduces the number of grid units and improves calculation efficiency. According to the method, deep learning and finite element mesh generation are combined for the first time, a traditional iterative mesh refinement process is replaced by predicting heat distribution through a neural network, the mesh generation speed is remarkably increased, and meanwhile, the thermal simulation precision is kept within 0.8%. The method is particularly suitable for a complicated 2.5 D / 3D chip packaging structure, can effectively cope with thermal management challenges in modern integrated circuit design, and provides a rapid and accurate thermal simulation tool for chip design.

The invention belongs to the technical field of high-temperature and high-pressure free radical in-situ analysis, and provides a visual detection method for free radicals generated by hydrocarbon-water interface micro-droplets at high temperature and high pressure. The method comprises the following steps: preparation of a free radical fluorescence indicator aqueous solution, sample loading of a fused quartz capillary tube, visual simulation experiment and free radical fluorescence phenomenon analysis. On the basis of the temperature and pressure range of the actual stratum burying condition, the micro-droplet fluorescence phenomenon of the free radical fluorescence indicator water solution and the hydrocarbon liquid interface under the high-temperature and high-pressure conditions is observed through a visual fused quartz capillary thermal simulation experiment, and the fluorescence characteristics of a laser confocal microscope are used for detection. Comprehensively obtaining a method for in-situ online detection of generation of free radicals in the high-temperature and high-pressure process; the problem that micro-droplet free radicals cannot be directly detected under high-temperature and high-pressure conditions is solved.

Described herein are systems and methods for detecting flaws during an additive manufacturing (AM) process. A method can include accessing, by a computer, simulation results of a computer-modelled part representing a physical part to be formed using the AM process. The simulation includes a thermal history model for the computer-modelled part. During run-time formation of the physical part, the method includes receiving, from sensor devices, real-time sensor data of temperature values for nodes within regions of the physical part as each region is formed. The method also includes determining, for each region as the region is formed in the physical part, a deviation between the real-time sensor data of temperature values for nodes within the region and temperature values of the thermal history model for the computer-modelled part, and identifying flaws in the physical part based on determining that the deviation satisfies criteria indicating a flaw.

The invention discloses a rapid thermal simulation method and system for a semiconductor power assembly, and relates to the technical field of semiconductors, and the method comprises the steps: collecting a voltage V (t) signal and a current I (t) signal of the semiconductor power assembly in real time through a voltage and current sampling circuit, constructing a power pulse input sequence A, and carrying out the hot carrier accumulation analysis according to the power fluctuation change amplitude; introducing a transient thermal resistance function Zth (t), fitting the transient thermal resistance function Zth (t) with a hot carrier pulse response index Mcx after numerical integration to analyze junction temperature change caused by power pulse, and evaluating an equivalent junction temperature dynamic change rate; when the analysis result is that the thermal drift out-of-control trend exists, thermal risk analysis is carried out, and thermal risk state assessment is generated; the simulation model optimizes thermal model parameters and outputs thermal control suggestions through a rollback correction path, and the working state of the semiconductor power assembly is automatically adjusted. According to the method, real-time monitoring and effective prevention and control of thermal runaway can be realized, and the reliability and safety of the semiconductor power assembly are improved.

The invention discloses a mobile phone thermal simulation method and system based on multi-physics field coupling, relates to the field of mobile phone thermal simulation, and constructs hybrid simulation coupling machine learning and physical solution. A machine learning agent model and a throttling logic script are innovatively introduced. The machine learning agent model is used for quickly predicting the temperature according to the current power consumption so as to instantaneously respond to the power consumption change; and the throttling logic script is used for simulating a real temperature control frequency reduction strategy and dynamically adjusting the target power consumption at the next moment according to the predicted temperature. In this way, the original black box temperature control logic is explicit, and a power consumption-temperature closed-loop feedback path is constructed. And finally, taking the adjusted power consumption as a heat source, and performing physical field solving by a traditional CAE solver. Therefore, the problem of time scale difference between heat conduction and electrical change is effectively solved, and efficient and accurate simulation of true performance and temperature performance of the mobile phone in a long-time high-load scene is realized.

The invention provides a reflector light machine installation and adjustment prediction method based on glue spot thermal simulation assistance, relates to the technical field of light machine installation and adjustment, and aims to optimize a glue joint process route according to a finite element simulation result by performing finite element modeling on a reflector, a reflector base and glue spots and analyzing stress distribution of the reflector after glue joint. And the technical difficulty of high-strength and low-stress glue joint of the large-size reflecting mirror is solved.

Provided in the present application are a heat dissipation test system and method, and an apparatus, a device and a computer program product. The heat dissipation test system comprises a heat dissipation apparatus and a plurality of heat production simulation apparatuses, wherein each heat production simulation apparatus is used for simulating a heat production component that requires heat dissipation in a server, the plurality of heat production simulation apparatuses are accommodated in the same box body, and actual heat dissipation components simulated by the plurality of heat production simulation apparatuses are not components in the same server; and the heat dissipation apparatus is used for performing cooling treatment on the plurality of heat production simulation apparatuses. In the heat dissipation test system, actual heat dissipation components that actually require heat dissipation in servers are simulated by the heat production simulation apparatuses, and since the heat production simulation apparatuses are not actual heat dissipation assemblies in the servers, even if a heat generation simulation apparatus is damaged during a test, damage to a server would not be caused, thereby alleviating the problem in the related art of high test cost being caused by server damage when a real server is used to test a liquid cooling cabinet.

The invention provides a printed circuit board electric heating simulation processing method, device and equipment and a storage medium, and relates to the technical field of simulation processing, and the method comprises the steps: carrying out the current simulation of a printed circuit board, generating a printed circuit board grid model comprising a plurality of printed circuit board grid units, and collecting the current distribution data of the printed circuit board; calculating the heating power of each printed circuit board grid unit; establishing a printed circuit board grid model; mapping the printed circuit board grid units into the printed circuit board grid model, and calculating the equivalent heating power of each grid unit; building a printed circuit board thermal simulation model comprising a plurality of thermal grid units, and configuring the equivalent heating power as the target heating power of the thermal grid units; and carrying out thermal simulation analysis on the printed circuit board, and drawing a temperature distribution diagram of the printed circuit board. According to the invention, the precision and efficiency of electrothermal simulation processing can be improved, and the accurate temperature distribution condition of the printed circuit board can be obtained.

The invention provides a visual detection method for interface water droplet induced electron generation in a high-temperature and high-pressure hydrocarbon-water system, and belongs to the technical field of in-situ analysis of electrons in mixed fluid. The detection method comprises the following steps: preparing a fused quartz capillary reaction cavity; loading a sample in a fused quartz capillary reaction cavity: sequentially inserting a thin capillary syringe filled with a silicomolybdic acid aqueous solution and a thin capillary syringe filled with a hydrocarbon liquid into the fused quartz capillary reaction cavity, and injecting the silicomolybdic acid aqueous solution and the hydrocarbon liquid; and carrying out visual detection on the water droplets. Through the visual fused quartz capillary thermal simulation experiment device, the color change of the water droplets at the interface of the silicomolybdic acid aqueous solution and the hydrocarbon fluid under the conditions of high temperature and high pressure is visually displayed, and the color characteristics of the water droplets are observed in real time by using a microscope, so that whether the water droplets induce electron generation or not is judged; the problem that electrons generated by water droplets cannot be directly observed and detected under high-temperature and high-pressure conditions is solved.

The invention discloses an interventional therapy path planning system based on ultrasonic imaging, and relates to the technical field of interventional therapy systems.An image acquisition module acquires a two-dimensional or three-dimensional ultrasonic image of an operation area, and standardized input of image data is achieved; the structure identification module executes a medical image segmentation task based on the ultrasonic image and identifies a key anatomical structure in the image; the geometric modeling module constructs a three-dimensional space model according to the structure recognition result; the thermal simulation prediction module comprises a heat conduction simulation sub-module and a thermal parameter dynamic adjustment sub-module; the temperature feedback module reconstructs a three-dimensional temperature field image in the target tissue based on the tissue temperature feedback signal; the parameter updating module executes real-time updating of heat conduction parameters based on the residual error between the predicted temperature field and the observation temperature field collected by the temperature feedback module; the problems that in existing interventional therapy, thermal control precision is low, path planning depends on experience, and tissue dynamic changes are difficult to deal with are effectively solved.

The invention relates to the technical field of oil-gas exploration, in particular to a hydrocarbon generation potential evaluation method for marine hydrocarbon source rocks. On the basis of determining terrestrial source and sea source organic matter proportions of marine facies hydrocarbon source rocks in different sedimentary areas, marine facies hydrocarbon source rock thermal simulation experiments of different terrestrial source / sea source organic matter proportions are carried out, and gaseous hydrocarbon yields of the marine facies hydrocarbon source rocks of different terrestrial source / sea source organic matter proportions and isotope characteristics and activation energy of gaseous hydrocarbons of different maturity degrees are determined; according to generation, storage and cover layer parameters of a research area, selecting a suitable model and giving suitable parameter values, performing numerical simulation on hydrocarbon source rocks with different terrestrial / sea source organic matter proportions, and finally quantitatively determining hydrocarbon generation potential of hydrocarbon source rocks with different sedimentary areas and different terrestrial / sea source organic matter proportions in the research area by combining burial-thermal history evolution of the research area. And obtaining a hydrocarbon generation and expulsion period and a charging process, and determining a main reservoir forming period. Compared with the prior art, the hydrocarbon generation potential evaluation accuracy of the marine hydrocarbon source rock can be greatly improved.