PCB reliability prediction and method and computer equipment

A prediction method and reliability technology, applied in the electronic field, can solve the problems of high cost and low efficiency, and achieve the effects of high accuracy, high precision and time saving

Inactive Publication Date: 2018-06-22
SOUTH CHINA UNIV OF TECH +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide a PCB reliability prediction method, device, computer-readable storage medium and computer equipment for the technical problems of low efficiency and high cost in traditional methods

Method used

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  • PCB reliability prediction and method and computer equipment
  • PCB reliability prediction and method and computer equipment
  • PCB reliability prediction and method and computer equipment

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Embodiment Construction

[0039] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0040] The application environment of the method for predicting PCB reliability provided by various embodiments of the present application may involve a user terminal or a server. Wherein, the user terminal may be a desktop terminal or a mobile terminal, and the mobile terminal may specifically include at least one of a mobile phone, a tablet computer, a notebook computer, and a wearable device. The server can be an independent physical server, or a server cluster composed of multiple physical servers.

[0041] Such as figure 1 As shown, in one embodiment, a method for p...

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Abstract

The invention relates to a PCB reliability prediction method and device, a computer readable storage medium and computer equipment. The method comprises the following steps of: constructing a PCB structure model on the basis of laminated structure information of a target PCB, wherein the PCB structure model comprises a substrate model, a copper foil layer model and a guide hole model; configuringthermal performance parameters for the substrate model, the copper foil layer model and the guide hole model in the PCB structure model on the basis of material using information of the target PCB, soas to obtain a PCB simulation model; obtaining a temperature field simulation result of the target PCB, wherein the temperature field simulation result is generated by carrying out thermal simulationon the basis of a predetermined temperature simulation parameter and the PCB simulation model; obtaining a stress field simulation result of the target PCB, wherein the stress field simulation resultis generated on the basis of the temperature field simulation result; and predicting reliability of the target PCB on the basis of the stress field simulation result. According to the method and device, the computer readable storage medium and the computer equipment, the prediction efficiency can be effectively improved.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a PCB reliability prediction method, device, computer-readable storage medium and computer equipment. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is an important part of electronic equipment, used to support components and realize the electrical connection between components. [0003] With the continuous development of electronic technology, electronic equipment is gradually becoming thinner, miniaturized and high-performance. The number of components that PCB needs to carry is increasing, the arrangement is becoming more and more compact, and the overall power consumption is increasing. . Moreover, PCBs will face various high temperature conditions during mounting and use. Therefore, the probability of PCB reliability risk is increasing. In this case, before the PCB is put into actual use, it is necessary to carry out relevan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 陈蓓柳祖善
Owner SOUTH CHINA UNIV OF TECH
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