Self-similar and fractal design for stretchable electronics

A device, electronic circuit technology, applied in the field of self-similar and fractal design for stretchable electronic devices, capable of solving problems such as limited

Inactive Publication Date: 2016-02-10
THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this study used relatively thin layers of metal films (eg, about 105 nm) and was relatively limited, as the system could potentially form electrical conductors that could be stretched by about 10%

Method used

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  • Self-similar and fractal design for stretchable electronics
  • Self-similar and fractal design for stretchable electronics
  • Self-similar and fractal design for stretchable electronics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0158] Example 1: Fractal Design Concepts for Stretchable Electronics

[0159] Stretchable electronics provide the basis for applications beyond the confines of conventional wafer and circuit board technologies due to their unique ability to integrate with soft materials and curved surfaces. The ultimate range of possibilities is predicted based on the development of device architectures that provide both advanced electronic functionality and compliant mechanical structures. This example shows that patterning in a thin film of a hard electronic material with a deterministic fractal pattern and bonding the film to an elastomer enables an unusual mechanical structure with important implications in stretchable device design. In particular, this example demonstrates the use of Peano, Greek Cross, Vicsek, and other fractal structures to create metal, polymer, and semiconductor components for electrophysiological sensors, precision monitors and actuators, and radio frequency antenna...

Embodiment 2

[0192] Example 2: Stretchable battery with self-similar serpentine interconnection and integrated wireless recharging system

[0193] An important trend in electronics involves the development of materials, mechanical designs and manufacturing strategies to enable the use of unconventional substrates, such as polymer films, metal foils, paper sheets or rubber slabs. The last possibility is particularly challenging because the system must accommodate not only bending but also stretching, sometimes to high strain levels (>100%). Although several approaches are available for electronic devices, in order to allow co-integration of energy storage devices and power supplies with electronic devices, there are continuing difficulties in energy storage devices and power supplies with similar mechanical properties. This example provides a set of materials and design concepts for rechargeable lithium-ion battery technology utilizing a thin, low modulus, silicone elastomer as the substrat...

Embodiment 3

[0309] Example 3: Mechanical structure of super-stretchable self-similar serpentine interconnection lines

[0310] Summary

[0311] In a so-called island-bridge design, electrical interconnects in a self-similar serpentine layout provide exceptional levels of stretchability in systems consisting of collections of small, non-stretchable active devices. This example develops a flexibility analysis model and an elastic stretchability analysis model for such a structure, and establishes recurrence formulas with different self-similar orders. The analytical solutions fit well with finite element analysis (FEA), where both show that the elastic stretchability more than doubles when the order of the self-similar structure increases by one. Design optimization yields elastic stretchability of 90% and 50% for systems with surface fill of active devices of 50% and 70%, respectively.

[0312] 1 Introduction

[0313] In recent years, there has been a rapid growth of interest in develop...

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Abstract

The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and / or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well- defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications..

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Patent Application 13 / 835,284, filed March 15, 2013, U.S. Provisional Patent Application 61 / 761,412, filed February 6, 2013, and U.S. Provisional Patent Application 61 / 930,732, filed January 23, 2014 , each of which is incorporated herein by reference in its entirety. [0003] Statement Regarding Federally Sponsored Research or Development [0004] This invention was made with Government support under Contract No. DE-FG02-07ER46471 awarded by the US Department of Energy. The Government has certain rights in this invention. Background technique [0005] Since the first demonstration of a printed, all-polymer transistor in 1994, a great deal of interest has directed toward a potential new type of electronic system that includes flexible integrated electronics on plastic substrates. [Garnier, F., Hajlaoui, R., Yassar, A. and Srivastava, P., Science, Vol. 265, pp. 1684-1686] Rec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L21/00H01L31/00H01L29/06H05K1/00B81C1/00
CPCH01L2924/12041H01L2924/1461H01L2924/12032H01L23/145H01L23/4985H05K1/0283H05K2201/09263H01L2924/15747H01L2924/12042H01L2924/12044H01L2924/12043H01L23/49838Y02P70/50H01L2924/00
Inventor J·A·罗杰斯J·范W-H·佑苏业旺黄永刚张一慧
Owner THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
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