The invention provides a method for improving the accuracy of a resistance value of a buried resistance
printed circuit board. The method comprises the following steps of: 1, providing a board with a buried resistance layer, wherein the board comprises an insulating
dielectric layer, the buried resistance layer and a
copper foil layer; 2, pasting a first
photoresist film, performing primary
exposure, printing a line graph of a negative film on the first
photoresist film, and performing primary development, wherein the line graph consists of a resistance line and a normal line, each of long sides of a
line width of the resistance line is prolonged by 6mil, and each of wide sides of the
line width of the resistance line is prolonged by 1.25mil; 3, performing primary
etching and secondary
etching; 4, pasting a second
photoresist film, performing secondary
exposure, printing a resistance graph of a positive film on the second photoresist film, and performing
secondary development, wherein each of long sides of a
line width of the resistance graph is shortened by 0.6mil, and each of wide sides of the line width of the resistance graph is widened by 6mil; 5, performing
tertiary etching; and 6, performing blackening treatment on the surface of the board in a way of controlling a
microetching amount within 1.1 to 1.5 mu.m, and performing additional compensation of -12 percent on the resistance graph of the positive film.