Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof

Abstract

The invention discloses a manufacture method for a step circuit board with a gold-masking copper-plating hybrid surface process. The manufacture method comprises the steps of cutting materials, transferring an inner pattern, browning and pressing a plate, drilling, plating copper, electroplating the whole plate, adhering a thick gold dry film, achieving pattern transfer for the first time through exposing and developing, exposing a local electrical thick gold part, plating copper, nickel gold and electrical thick gold on the electrical thick gold part, removing the film, adhering a dry film, achieving pattern transfer for the second time through exposing and developing, exposing a part needing plating copper, plating copper, removing the film, silk-screen printing a wet film, achieving pattern transfer for the third time through exposing and developing, exposing a needed outer circuit, adhering a dry film to completely cover a PTH (Plated Through Hole) through exposing and developing, etching an outer circuit, removing the film, carrying out AOI (Automated Optical Inspection) to the outer layer, silk-screen printing and resistance-welding, lettering, forming, electrically testing, carrying out an OSP (Organic Solderability Preservatives) surface process, carrying out final inspection, packaging and shipping. The gold-masked copper-plated step circuit board manufactured by the method disclosed by the invention can achieve more compact assembling needs and a better adhering effect.

Description

technical field [0001] The invention relates to a circuit board manufacturing technology, in particular to a stepped circuit board with gold surface copper-plating mixed surface technology and a manufacturing method thereof. Background technique [0002] At present, due to the needs of assembly and surface mount, stepped circuit boards and mixed surface process circuit boards are more common, but stepped circuit boards are all processed in insulating dielectric materials, and mixed surface process circuit boards are only built on the same plane Completing different surface treatment processes, the production process and production difficulty are relatively simple. Contents of the invention [0003] The object of the present invention is to provide a stepped circuit board with a mixed surface technology of gold-plated copper and a manufacturing method thereof in order to achieve a tighter assembly requirement and a better patching effect. [0004] The technical scheme that...

AI Technical Summary

Problems solved by technology

[0002] At present, due to the needs of assembly and surface mount, stepped circuit boards and mixed surface process circuit boards are more common, but stepped circuit boards are all processed in insulating dielectric materials, and mixed surface process circuit boards are only built on the same plane Completing different surface treatment processes, the production process and production difficulty are relatively simple