The invention discloses a manufacture method for a step circuit board with a gold-masking
copper-plating
hybrid surface process. The manufacture method comprises the steps of
cutting materials, transferring an inner pattern,
browning and pressing a plate, drilling, plating
copper,
electroplating the whole plate, adhering a thick gold dry film, achieving pattern transfer for the first time through exposing and developing, exposing a local electrical thick gold part, plating
copper,
nickel gold and electrical thick gold on the electrical thick gold part, removing the film, adhering a dry film, achieving pattern transfer for the second time through exposing and developing, exposing a part needing plating copper, plating copper, removing the film, silk-
screen printing a wet film, achieving pattern transfer for the third time through exposing and developing, exposing a needed outer circuit, adhering a dry film to completely cover a PTH (Plated Through Hole) through exposing and developing,
etching an outer circuit, removing the film, carrying out AOI (
Automated Optical Inspection) to the outer layer, silk-
screen printing and resistance-
welding,
lettering, forming, electrically testing, carrying out an OSP (Organic
Solderability Preservatives) surface process, carrying out final inspection, packaging and shipping. The gold-masked copper-plated step circuit board manufactured by the method disclosed by the invention can achieve more compact assembling needs and a better adhering effect.